Handbook of Modern Coating Technologies: Applications and Development

Title-page_2021_Handbook-of-Modern-Coating-Technologies
	Handbook of Modern Coating Technologies
Copyright_2021_Handbook-of-Modern-Coating-Technologies
	Copyright
Contents_2021_Handbook-of-Modern-Coating-Technologies
	Contents
List-of-contributors_2021_Handbook-of-Modern-Coating-Technologies
	List of contributors
About-the-editors_2021_Handbook-of-Modern-Coating-Technologies
	About the editors
Preface_2021_Handbook-of-Modern-Coating-Technologies
	Preface
1---Application-of-the-scanning-vibrating-electrode_2021_Handbook-of-Modern-
	1 Application of the scanning vibrating electrode technique to the characterization of modern coatings
		1.1 Introduction
		1.2 Metals and corrosion
		1.3 Corrosion protection and coatings
			1.3.1 Strategies of corrosion control
			1.3.2 Metallic coatings
			1.3.3 Inorganic coatings
			1.3.4 Organic coatings
			1.3.5 Techniques for assessing coating degradation
		1.4 The scanning vibrating electrode technique
			1.4.1 The principle
			1.4.2 Experimental set-up
			1.4.3 Common measurements
			1.4.4 Experimental parameters
				1.4.4.1 Sensitivity
				1.4.4.2 Spatial resolution
			1.4.5 Quantitative information
			1.4.6 Limitations
			1.4.7 Main sources of artifacts and errors
				1.4.7.1 Electrode platinization
				1.4.7.2 Bad calibration
				1.4.7.3 Wrong conductivity
				1.4.7.4 Unknown distance to source
		1.5 Application of the scanning vibrating electrode technique to characterize modern coatings
			1.5.1 Systems with inert coating or inert substrate (Cases 1–3)
			1.5.2 Coatings with pores or small defects (Case 4)
			1.5.3 Coatings with macroscopic defects (Case 5)
			1.5.4 Coatings anodic to the substrate (Cases 6 and 7)
			1.5.5 Coatings cathodic to the substrate (Cases 8 and 9)
		1.6 Review of published work using the scanning vibrating electrode technique to characterize coatings performance
			1.6.1 Self-healing coatings
		1.7 Critical account on the application of the scanning vibrating electrode technique to study coatings
		1.8 Other localized techniques
			1.8.1 Scanning reference electrode technique
			1.8.2 Potentiometric microelectrodes
			1.8.3 Voltammetric/amperometric microelectrodes
			1.8.4 Scanning electrochemical microscopy
			1.8.5 Localized electrochemical impedance spectroscopy
			1.8.6 Alternate current scanning electrochemical microscopy
			1.8.7 Scanning Kelvin microscopy
			1.8.8 Scanning Kelvin probe force microscopy
			1.8.9 Microcapillary and microdroplet cells
			1.8.10 Wire beam electrodes
		1.9 Conclusions
		References
2---Spectroscopic-ellipsometry_2021_Handbook-of-Modern-Coating-Technologies
	2 Spectroscopic ellipsometry
		2.1 Introduction
		2.2 Basic principles of ellipsometry
		2.3 Data analysis procedure
		2.4 Extracting information of coatings
			2.4.1 Ex situ measurements
				2.4.1.1 Thickness/roughness characterization
				2.4.1.2 Optical and electric properties characterization
				2.4.1.3 Other properties characterization
			2.4.2 In situ measurement
		2.5 Spectroscopic ellipsometry application examples in coatings
			2.5.1 Photovoltaic films
			2.5.2 Display coatings
			2.5.3 Protective coatings
			2.5.4 Films of biological molecules
			2.5.5 Films of two-dimensional materials
		2.6 Summary and perspectives
		Acknowledgment
		References
3---X-ray-diffraction_2021_Handbook-of-Modern-Coating-Technologies
	3 X-ray diffraction
		3.1 Introduction
		3.2 Application areas of various X-ray techniques
		3.3 Production and characteristics of X-rays
			3.3.1 Emission of continuous spectrum radiation
			3.3.2 Emission of characteristic radiation
			3.3.3 Absorption and filtration of characteristic radiation
			3.3.4 Total external reflection of X-rays
		3.4 Milestones
		3.5 Crystalline materials
			3.5.1 Space lattice and unit cell
			3.5.2 The Bravais lattices and crystal structure
			3.5.3 Designation of points, lines, and planes
			3.5.4 Reciprocal lattice
		3.6 Interaction of X-rays with crystalline materials
			3.6.1 Diffraction of X-rays by crystals
			3.6.2 Ewald sphere
			3.6.3 Extinction of X-rays
			3.6.4 Determination of crystal structure and lattice parameter
			3.6.5 Estimation of crystallite size
		3.7 Specimen preparation
		3.8 X-ray diffraction methods
			3.8.1 Laue method
			3.8.2 Rotating crystal method
			3.8.3 Hull/Debye–Scherrer powder method
		3.9 Powder diffractometer geometry
		3.10 Powder diffraction measurements
			3.10.1 Symmetric reflection measurement
				3.10.1.1 Structure determination
				3.10.1.2 Application to coated specimens
			3.10.2 Asymmetric reflection measurement
				3.10.2.1 Estimation of residual stress
				3.10.2.2 Diffraction peak location
				3.10.2.3 Depth of penetration in thin film
			3.10.3 Grazing-incidence techniques
				3.10.3.1 Grazing-incidence X-ray diffraction
				3.10.3.2 Grazing-incidence small-angle X-ray scattering
				3.10.3.3 X-ray reflectivity measurement
			3.10.4 Texture measurement
		3.11 Concluding remarks
		Acknowledgments
		References
4---Neutron-reflectivity-for-the-investigation-o_2021_Handbook-of-Modern-Coa
	4 Neutron reflectivity for the investigation of coatings and functional layers
		4.1 Reflection and refraction of neutrons at interfaces
			4.1.1 Reflection from interfaces
				4.1.1.1 Semiinfinite interfaces
				4.1.1.2 Layered structures
				4.1.1.3 Blurred interfaces
				4.1.1.4 Polarized neutrons
			4.1.2 Off-specular scattering
			4.1.3 Grazing incidence small-angle scattering
		4.2 Instrumentation
		4.3 Experimental results
			4.3.1 Data storage
			4.3.2 Functional layers used in integrated microelectronic circuits
			4.3.3 Self-assembled nanostructures
			4.3.4 Graphene oxide
			4.3.5 Organic photovoltaics
			4.3.6 Surfactant monolayers at solid/liquid interfaces
			4.3.7 Cellulose degradation
			4.3.8 Thermosensitive coatings
			4.3.9 Polymer brushes
			4.3.10 Magnetic nano-particle assembly
		References
5---Application-of-micro--and-nanoprobes-to-the-analys_2021_Handbook-of-Mode
	5 Application of micro- and nanoprobes to the analysis of small-sized 2D and 3D materials, nanocomposites, and nanoobjects
		5.1 Introduction
		5.2 Scanning nuclear microprobe
			5.2.1 Physical mechanisms of interaction between high-energy light ions and solid-state matter
			5.2.2 Physical basis of the scanning nuclear microprobe
			5.2.3 High-voltage ion gun of the scanning nuclear microprobe
			5.2.4 Probe-forming systems of the scanning nuclear microprobe
				5.2.4.1 Probe-forming system with a superconducting solenoid
				5.2.4.2 Multiplets of quadrupole lenses
				5.2.4.3 Focusing elements
		5.3 Local microanalysis with the use of a scanning nuclear microprobe
			5.3.1 Method of characteristic X-ray emission induced by beam ions
			5.3.2 Rutherford backscattering and elastic recoil detection
			5.3.3 Nuclear reaction analysis
			5.3.4 Registration of ion beam-induced charge
			5.3.5 Registration of ion beam-induced luminescence
			5.3.6 Single event effects
		5.4 Modification of materials for the creation of small-sized 3D structures
			5.4.1 Nanoimprinting
			5.4.2 Biophysics and medicine
			5.4.3 Microphotonics and microoptics
		5.5 The use of slow positrons for diagnostics of materials
			5.5.1 Positron source and moderation
			5.5.2 Measurement of Doppler broadening of the annihilation peak
				5.5.2.1 Experimental setup
				5.5.2.2 Data treatment
			5.5.3 Positron beam guidance systems
			5.5.4 Measuring techniques
				5.5.4.1 Defect depth profiling
				5.5.4.2 Positron implantation profiles
			5.5.5 Computation of defect depth profiles
			5.5.6 Positron microscopy and microprobing
			5.5.7 Principles of positron beam generation
			5.5.8 Experimental results obtained with the use of pulsed beams
			5.5.9 Scanning positron microscope
		5.6 Near-field microwave diagnostics of materials and media
			5.6.1 Operating principles of the microwave microscope
			5.6.2 Characteristics of the microwave microscope
				5.6.2.1 Spatial resolution
				5.6.2.2 Frequency bandwidth
			5.6.3 Images
		5.7 Application of nano- and microprobes for the analysis of nanomaterials and nanocomposites, including nitrides of high-e...
		Acknowledgments
		References
6---Application-of-fluorescence-technique-for-unders_2021_Handbook-of-Modern
	6 Application of fluorescence technique for understanding film formation from polymer latexes and composites
		6.1 Introduction
			6.1.1 Film formation of polymer latexes
			6.1.2 Polymer nanocomposites
			6.1.3 Fluorescence technique
		6.2 Theoretical considerations
			6.2.1 Photon diffusion model for film formation
			6.2.2 Void closure mechanism
			6.2.3 Healing and interdiffusion
		6.3 Experimental results
			6.3.1 Film formation from hard (high-T) latexes
				6.3.1.1 Poly(methyl methacrylate) latex films
					6.3.1.1.1 Monte Carlo simulation for photon diffusion
				6.3.1.2 Polystyrene latex films
					6.3.1.2.1 Void closure during latex film formation
				6.3.1.3 Film formation using nanosized polystyrene latexes
				6.3.1.4 Fast transient fluorescence technique in latex film formation
					6.3.1.4.1 Vapor–induced latex film formation using fluorescence quenching method
					6.3.1.4.2 Film formation using pure and mixed latexes using energy transfer method
			6.3.2 Film formation from blends of hard and soft latexes
				6.3.2.1 Swelling of interpenetrating network like particles in a soft polymer matrix
				6.3.2.2 Film formation of nanosized hard latex in soft polymer matrix: an excimer study
		6.4 Film formation of polymer composites
			6.4.1 Polymer–clay composites
				6.4.1.1 The effect of clay particles on film formation from polystyrene latex
				6.4.1.2 Effect of clay content on film formation from polystyrene latex
			6.4.2 Polymer/metal-oxide composites
				6.4.2.1 The effect of thickness on film formation from polystyrene latex/TiO2 nanocomposites
				6.4.2.2 Effect of latex size and TiO2 on film formation from polystyrene latex/TiO2 nanocomposites
			6.4.3 Carbon nanotube/polymer composites
		6.5 Conclusions
		References
7---Stress-in-physical-vapor-deposited-thin-films-_2021_Handbook-of-Modern-C
	7 Stress in physical vapor deposited thin films: Measurement methods and selected examples
		7.1 Introduction
		7.2 Sources of residual stress in thin films
		7.3 Stress evaluation methods
			7.3.1 Substrate curvature–based techniques
				7.3.1.1 Principle and definitions
				7.3.1.2 Bending of a thin film/substrate bilame system
				7.3.1.3 Beyond Stoney formula: range of applicability and extension
					7.3.1.3.1 Influence of film-to-substrate thickness ratio and elastic properties
					7.3.1.3.2 Case of strong deflections: nonlinearity and bifurcation
				7.3.1.4 Experimental methods and practical considerations
					7.3.1.4.1 Practical considerations
					7.3.1.4.2 Resolution
					7.3.1.4.3 Sensitivity
			7.3.2 Strain–stress analysis in homogeneous films using X-ray diffraction
				7.3.2.1 Concepts and methodology
					7.3.2.1.1 Definitions and frames of reference for diffraction stress analysis
					7.3.2.1.2 Mechanical interaction models
					7.3.2.1.3 Hierarchy of elastic anisotropy
				7.3.2.2 Single-crystal stiffness tensor
				7.3.2.3 Expressions of stress tensor for thin film geometry
				7.3.2.4 Considerations on the diffraction geometry
				7.3.2.5 Polycrystalline thin films with macroscopic elastic isotropy
					7.3.2.5.1 “Classical” sin2ψ analysis
					7.3.2.5.2 Grazing incidence: cos2α sin2ψ method
					7.3.2.5.3 Other methods
				7.3.2.6 Macroscopically anisotropic specimens
					7.3.2.6.1 General method
					7.3.2.6.2 Case of single crystalline and polycrystalline textured films: Crystallite group method
				7.3.2.7 Determination of the stress-free lattice parameter a0
			7.3.3 Position–resolved methods for determination of stress profiles
				7.3.3.1 Transmission electron microscopy–based techniques
				7.3.3.2 X-ray nanodiffraction
				7.3.3.3 Ion beam removal methods
				7.3.3.4 Focused ion beam milling combined with digital image correlation
				7.3.3.5 Residual stress measurements by instrumented indentation
		7.4 Selected examples
			7.4.1 Intrinsic stress evolution during early stages of polycrystalline film growth
				7.4.1.1 Film forming stages and archetypal stress behaviors
				7.4.1.2 Stress evolution during growth interrupts
				7.4.1.3 Factors influencing nucleation and growth: towards a grain size-dependent stress tailoring
			7.4.2 Microstructure-dependent stress gradients in thin nanocrystalline films
				7.4.2.1 Microstructure–related origin of depth gradients of stresses in nanocrystalline films
				7.4.2.2 Stress evolution model—development of microstructure-dependent stress components
		7.5 Conclusions and outlooks
		Acknowledgment
		References
8---Spatially-resolved-electrochemical-tools--micropotent_2021_Handbook-of-M
	8 Spatially resolved electrochemical tools: micropotentiometry and scanning vibrating electrode technique to detail localiz...
		8.1 Introduction
			8.1.1 Localized electrochemistry
		8.2 Scanning vibrating electrode technique and scanning ion-selective electrode technique applied to the study of different...
			8.2.1 Localized pH measurements for validating the use of microhydroxyapatite particles as smart carriers of corrosion inhi...
			8.2.2 Inhibitor–enriched anticorrosion coatings for ZK30 magnesium alloy
			8.2.3 Self-healing coatings modified with combinations of layered double hydroxides and cerium molybdate nanocontainers as ...
				8.2.3.1 Blank coating
				8.2.3.2 Layered double hydroxide/mercaptobenzothiazole protective system
				8.2.3.3 Cerium molybdate/mercaptobenzothiazole protective system
				8.2.3.4 (Layered double hydroxide+cerium molybdate)/mercaptobenzothiazole protective system
			8.2.4 Self-repair processes in focused ion beam defects on “smart” coatings applied on galvanized steel
			8.2.5 Particular case of metal–coated steel samples of a cut-edge geometry
		8.3 Overview and final remarks
		Acknowledgments
		List of Abbreviations
		References
Index_2021_Handbook-of-Modern-Coating-Technologies
	Index