Statistical case studies for industrial process improvement

Statistical Case Studies for Industrial Process Improvement......Page 1
Contents......Page 6
Foreword......Page 10
Preface......Page 12
Acknowledgments......Page 16
Introduction......Page 18
Facts about SEMATECH......Page 20
SEMATECH Qualification Plan......Page 22
PART 1 GAUGE STUDIES......Page 30
CHAPTER 1 INTRODUCTION TO GAUGE STUDIES......Page 32
CHAPTER 2 PROMETRIX RS35e GAUGE STUDY IN FIVE TWO-LEVELFACTORSAND ONE THREE-LEVEL FACTOR......Page 38
CHAPTER 3 CALIBRATION OF AN FTIR SPECTROMETER FOR MEASURING CARBON......Page 48
CHAPTER 4 REVELATION OF A MICROBALANCE WARM-UP EFFECT......Page 68
CHAPTER 5 GRR METHODOLOGY FOR DESTRUCTIVE TESTING AND QUANTITATIVE ASSESSMENT OF GAUGE CAPABILITY FOR ONE-SIDE SPECIFICATIONS......Page 76
PART 2 PASSIVE DATA COLLECTION......Page 90
CHAPTER 6 INTRODUCTION TO PASSIVE DATA COLLECTION......Page 92
CHAPTER 7 UNDERSTANDING THE NATURE OF VARIABILITY IN A DRY ETCH PROCESS......Page 100
CHAPTER 8 VIRGIN VERSUS RECYCLED WAFERS FOR FURNACE QUALIFICATION:Is THE EXPENSE JUSTIFIED?......Page 116
CHAPTER 9 IDENTIFYING SOURCES OF VARIATION IN A WAFER PLANARIZATION PROCESS......Page 134
CHAPTER 10 FACTORS WHICH AFFECT THE NUMBER OF AEROSOL PARTICLES RELEASED BY CLEAN ROOM OPERATORS......Page 144
CHAPTER 11 A SKIP-LOT SAMPLING PLAN BASED ON VARIANCE COMPONENTS FOR PHOTOLITHOGRAPHIC REGISTRATION MEASUREMENTS......Page 162
CHAPTER 12 SAMPLING TO MEET A VARIANCE SPECIFICATION: CLEAN ROOM QUALIFICATION......Page 174
CHAPTER 13 SNAPSHOT: A PLOT SHOWING PROGRESS THROUGH A DEVICE DEVELOPMENT LABORATORY......Page 184
PARl 3 DESIGN OF EXPERIMENTS......Page 198
CHAPTER 14 INTRODUCTION TO DESIGN OF EXPERIMENTS......Page 200
CHAPTER 15 ELIMINATION OF TiN PEELING DURING EXPOSURE TO CVD TUNGSTEN DEPOSITION PROCESS USING DESIGNED EXPERIMENTS......Page 228
CHAPTER 16 MODELING A UNIFORMITY BULLS-EYE INVERSION......Page 242
CHAPTER 17 USING FEWER WAFERS TO RESOLVE CONFOUNDING IN SCREENING EXPERIMENTS......Page 264
CHAPTER 18 PLANARIZATION BY CHEMICAL MECHANICAL POLISHING:A RATE AND UNIFORMITY STUDY......Page 280
CHAPTER 19 USE OF EXPERIMENTAL DESIGN TO OPTIMIZE A PROCESS FOR ETCHING POLYCRYSTALLINE SILICON GATES......Page 294
CHAPTER 20 OPTIMIZATION OF A WAFER STEPPER ALIGNMENT SYSTEM......Page 312
PART 4 STATISTICAL PROCESS CONTROL......Page 326
CHAPTER 21 INTRODUCTION TO STATISTICAL PROCESS CONTROL (SPC)......Page 328
CHAPTER22 REMOVING DRIFT EFFECTS WHEN CALCULATING CONTROL LIMITS......Page 344
CHAPTER23 IMPLEMENTATION OF ASTATISTICAL PROCESS CONTROL CAPABILITY STRATEGY IN THE MANUFACTURE OF RAW PRINTED CIRCUIT BOARDS FOR SURFACE MOUNT TECHNOLOGY......Page 354
CHAPTER24 OBTAINING AND USING STATISTICAL PROCESS CONTROL LIMITS IN THE SEMICONDUCTOR INDUSTRY......Page 366
PART 5 EQUIPMENT RELIABILITY......Page 386
CHAPTER25 INTRODUCTION TO EQUIPMENT RELIABILITY......Page 388
CHAPTER 26 MARATHON REPORT FOR A PHOTOLITHOGRAPHY EXPOSURE TOOL......Page 394
CHAPTER 27 EXPERIMENTATION FOR EQUIPMENT RELIABILITY IMPROVEMENT......Page 416
CHAPTER 28 How TO DETERMINE COMPONENT-BASED PREVENTIVE MAINTENANCE PLANS......Page 432
PART 6 COMPREHENSIVE CASE STUDY......Page 454
CHAPTER 29 INTRODUCTION TO COMPREHENSIVE CASE STUDY......Page 456
CHAPTER 30 CHARACTERIZATION OF A VERTICAL FURNACE CHEMICAL......Page 458
PART 7 APPENDIX: INTRODUCTION TO INTEGRATED CIRCUIT MANUFACTURING......Page 498
INDEX......Page 530