Right the first time; A PRACTICAL HANDBOOK ON HIGH-SPEED PCB AND SYSTEM DESIGN

Right The First Time - Cover......Page 1
Acknowledgements......Page 4
Foreword......Page 8
Table Of Contents......Page 12
Figures, Tables And Equations......Page 14
Chapter 1 - Introduction......Page 24
Ad: Trilogy Circuits......Page 35
Chapter 2 - The Electrical Engineering Problem......Page 36
Ad: Rogers Corporation......Page 43
Chapter 3 - Major Elements in an Electronic System......Page 44
Ad: Samtec......Page 48
Chapter 4 - Assumptions often Made about Electronic Systems......Page 50
Chapter 5 - How Different from Ideal Real Systems and Their Components Are......Page 54
Ad: Sunstone Circuits......Page 56
Chapter 6 - Transmission Lines......Page 58
Ad: Mentor Graphics......Page 60
Chapter 7 - What's Moving on a Transmission Line?......Page 62
Chapter 8 - Basics of Electromagnetic Fields......Page 70
Chapter 9 - Digital vs. RF/Microwave vs. Analog......Page 76
Chapter 10 - Time and Distance......Page 80
Chapter 11 - Inductance......Page 88
Chapter 12 - Capacitance......Page 94
Chapter 13 - Resistance......Page 100
Chapter 14 - Fundamentals of Transmission Lines......Page 104
Chapter 15 - The Concept of Ground and Power Planes......Page 110
Chapter 16 - Impedance......Page 118
Ad: Prototron Circuits......Page 124
Chapter 17 - Reflections—What Causes Them, What They Do to a Signal......Page 126
Chapter 18 - What is Meant by Signal Integrity Engineering?......Page 142
Ad: Marcel Electronics International......Page 147
Chapter 19 - When is a Design High-Speed?......Page 148
Chapter 20 - Controlling Reflections by Using Terminations......Page 156
Chapter 21 - Terminator Type, Terminator Placement and Net Sequencing......Page 172
Chapter 22 - Stubs on Transmission Lines?......Page 192
Chapter 23 - Properties of Transmission Lines that Affect Impedance......Page 198
Chapter 24 - Methods for Calculating and Measuring Impedance......Page 204
Chapter 25 - Right Angle Bends and Vias: Potential Sources of Reflections and Other Problems......Page 220
Chapter 26 - Types of Drivers or Sources......Page 232
Chapter 27 - Types of Loads......Page 238
Chapter 28 - Bus Protocols......Page 242
Chapter 29 - Crosstalk or Coupling......Page 252
Chapter 30 - Single-Ended Signaling......Page 270
Chapter 31 - Differential Signaling......Page 276
Chapter 32 - The Power Subsystem......Page 292
Chapter 33 - Power Distribution DC Drop......Page 304
Chapter 34 - Decoupling Capacitors......Page 314
Chapter 35 - Power Subsystem Inductance......Page 330
Chapter 36 - Power Dissipation Estimate......Page 348
Chapter 37 - Example Power Subsystem Design......Page 370
Chapter 38 - IC Packages: Vcc and Ground Bounce or SSN......Page 390
Chapter 39 - Noise Margins......Page 404
Chapter 40 - Design Rule Creation Using Noise Margin Analysis......Page 412
Chapter 41 - PCB Fabrication Process......Page 434
Chapter 42 - PCB Materials......Page 446
Chapter 43 - Creating PCB Stack-Ups......Page 458
Chapter 44 - Types of Vias......Page 466
Chapter 45 - PCB Design Process......Page 476
Chapter 46 - PCB Routing......Page 494
Chapter 47 - Documentation......Page 508
Chapter 48 - The Ideal Component Data Sheet......Page 516
Glossary......Page 522
Index......Page 570
Appendix 1 - Bibliography......Page 576
Appendix 2 - Anatomy of a Plated Through Hole......Page 586
Appendix 3 - Selecting PCB Suppliers......Page 596
Appendix 4 - A Page of Useful Equations......Page 624
Appendix 5 - Technology Table Explanation......Page 626
Appendix 6 - Drill Table......Page 636
Appendix 7 - Conversion Tables......Page 638