Precision Assembly Technologies and Systems: 6th IFIP WG 5.5 International Precision Assembly Seminar, IPAS 2012, Chamonix, France, February 12-15, 2012. Proceedings

Front Matter....Pages -
Development of a Micro-scale Assembly Facility with a Three Fingered, Self-aware Assembly Tool and Electro-chemical Etching Capabilities....Pages 1-8
Semi-automated Assembly of a MEMS-Based Micro-scale CMM Probe and Future Optimization of the Process Chain with a View to Desktop Factory Automation....Pages 9-16
Design, Fabrication and Testing of Assembly Features for Enabling Sub-micron Accurate Passive Alignment of Photonic Chips on a Silicon Optical Bench....Pages 17-27
Parallel Packaging of Micro Electro Mechanical Systems (MEMS) Using Self-alignment....Pages 28-35
Processes for the Self-assembly of Micro Parts....Pages 36-41
Precisely Assembled Multi Deflection Arrays – Key Components for Multi Shaped Beam Lithography....Pages 42-50
Construction Kit for Miniaturised Handling Systems: Further Developments and First Applications....Pages 51-56
Flexible Gripper System for Small Optical Assemblies – Final Tests and Findings....Pages 57-64
Handling and Manipulation of Microcomponents: Work-Cell Design and Preliminary Experiments....Pages 65-72
Adhesive Workpiece Fixturing for Micromachining....Pages 73-80
Dual-Stage Feed Drive for Precision Positioning on Milling Machine....Pages 81-88
High Resolution Actuators for Severe Environments....Pages 89-96
Tolerance Management for Assembly – Not a Matter of Product Size....Pages 97-104
Modelling and Analysis of the Geometrical Errors of a Parallel Manipulator Micro-CMM....Pages 105-117
Methods for Implementing Compensation Strategies in Micro Production Systems Supported by a Simulation Approach....Pages 118-125
Accuracy Measurements of Miniature Robot Using Optical CMM....Pages 126-133
A System for the Quality Inspection of Surfaces of Watch Parts....Pages 134-143
Characterisation of High Accuracy, Feedback Controlled, Adhesive Bonding....Pages 144-153
Towards Intelligent Assembly and Manufacturing Environment – Modular ICT Support for Holonic Manufacturing System....Pages 154-162
Enabling Fast Ramp-Up of Assembly Lines through Context-Mapping of Implicit Operator Knowledge and Machine-Derived Data....Pages 163-174
Accelerated Ramp-Up of Assembly Systems through Self-learning....Pages 175-182
A Methodology for Assessing the Cost Effectiveness of Assembly Processes....Pages 183-190
Model Based Planning of Complex Micro-manufacturing Strategies....Pages 191-199
Towards an European Approach for Characterisation of Multimaterial Micromanufacturing Process Capabilities....Pages 200-209
Back Matter....Pages -