Optical Inspection of Microsystems

Content: Image Processing and Computer Vision for MEMS Testing
 Markus Huttel  Introduction  Classification of Tasks  Image Processing and Computer Vision Components  Processing and Analysis of Image Data  Commercial and Noncommercial Image Processing and Computer Vision Software  Image Processing Techniques for the Processing of Fringe Patterns in Optical Metrology  Conclusion  References  Image Correlation Techniques for Microsystems Inspection
 Dietmar Vogel and Bernd Michel  Introduction  Deformation Measurement by Digital Image Correlation (DIC) Techniques  Base Equipment for DIC Applications  Applications of DIC Techniques to Microsystems  Conclusions and Outlook  References  Light Scattering Techniques for the Inspection of Microcomponents and Microstructures
 Angela Duparre  Introduction  Theoretical Background of Light Scattering  Measurement Equipment  Standardization of Light Scattering Methods  Applications for Microcomponent and Microstructure Inspection  Combination of Light Scattering and Profilometric Techniques  Conclusions and Outlook  References  Characterization and Measurement of Microcomponents with the Atomic Force Microscope (AFM)
 F. Michael Serry and Joanna Schmit  Introduction  Components of AFM and Principles of AFM Operation  AFM Imaging Modes  AFM Nonimaging Modes  Applications of AFM for Microcomponent Inspection: A Case Study  Atomic Force Profilometer (AFP) - A Combination of AFM and Stylus Profiler  Optical Metrology Complementary to AFM  Conclusions and Outlook  References  Optical Profiling Techniques for MEMS Measurement
 Klaus Koerner, Aiko Ruprecht, and Tobias Wiesendanger  Introduction  Principles of Confocal Microscopy  Principle of Microscopic Depth-Scanning Fringe Projection (DSFP)  Conclusion  References  Grid and Moire Methods for Micromeasurements
 Anand Asundi, Bing Zhao, and Huimin Xie  Introduction  Grid or Grating Fabrication Methods  Micro-Moire Interferometer  Moire Methods Using High-Resolution Microscopy  Microscopic Grid Methods  Conclusions  References  Grating Interferometry for In-Plane Displacement and Strain Measurement of Microcomponents
 Leszek Salbut  Introduction  Principle of Grating Interferometry  Waveguide Grating Interferometry  Measurement System  SG Technology  Exemplary Applications of WGI  Conclusions  References  Interference Microscopy Techniques for Microsystem Characterization
 Alain Bosseboeuf and Sylvain Petitgrand  Introduction  Interference Microscopes  Modeling of Two-Beam Homodyne Interference Microscopes  Static Measurements by Interference Microscopy  Performance and Issues of Interference Microscopy  Applications of Interferometric Profilometers in the MEMS Field  Dynamic Measurements by Interference Microscopy  Conclusion  Acknowledgments  References  Measuring MEMS in Motion by Laser Doppler Vibrometry
 Christian Rembe, Georg Siegmund, Heinrich Steger, and Michael Woertge  Introduction  Laser Doppler Effect and Its Interferometric Detection  Techniques of Laser Doppler Vibrometry  Full-Field Vibrometry  Measuring on Microscopic Structures  Resolution and Accuracy  Combination with Other Techniques  Examples  Conclusion and Outlook  References  An Interferometric Platform for Static, Quasi-Static, and Dynamic Evaluation of Out-Of-Plane Deformations of MEMS and MOEMS
 Christophe Gorecki, Michal Jozwik, and Patrick Delobelle  Introduction  Interferometric Platform Architecture and Principle of Operation  Optomechanical Characterization of Membranes by "Pointwise" Deflection Method  Mechanical Expertise of Scratch Drive Actuators via Interferometric Measurement of Out-of-Plane Microdisplacements  Dynamic Evaluation of Active MOEMS by Interferometry Using Stroboscopic Technique  General Conclusion and Outlook  Acknowledgments  References  Optoelectronic Holography for Testing Electronic Packaging and MEMS
 Cosme Furlong  Introduction  Overview of MEMS Fabrication Processes  Optoelectronic Holography  Representative Applications  Summary  Acknowledgments  References  Digital Holography and Its Application in MEMS/MOEMS Inspection
 Wolfgang Osten and Pietro Ferraro  Introduction  Theory and Basic Principle of Digital Holography (DH)  Digital Holographic Interferometry  Digital Holographic Microscopy (DHM)  The Application of DH to the Investigation of Microcomponents  Conclusion  References  Speckle Metrology for Microsystem Inspection
 Roland Hoefling and Petra Aswendt  Introduction  Basics  Applications  Conclusion  References  Spectroscopic Techniques for MEMS Inspection
 Ingrid De Wolf  Introduction  Raman Spectroscopy (RS)  Spectroscopic Ellipsometry (SE)  Dual-Beam Spectroscopy (DBS)  X-Ray Photoelectron Spectroscopy (XPS)  High-Resolution Electron Energy Loss Spectroscopy (HREELS)  Auger Electron Spectroscopy (AES)  Brillouin Scattering (BS)  Conclusions  References  Index