Lumped Elements for RF and Microwave Circuits

Lumped Elements for RF
and Microwave Circuits Second Edition
	Contents
	Preface
	Chapter 1
Introduction
		1.1 History of Lumped Elements
		1.2 Why Use Lumped Elements for RF and Microwave Circuits?
		1.3 L, C, R Circuit Elements
		1.4 Basic Design of Lumped Elements
			1.4.1 Capacitor
			1.4.2 Inductor
			1.4.3 Resistor
		1.5 Lumped-Element Modeling
		1.6 Fabrication
		1.7 Applications
		References
	Chapter 2 Inductors
		2.1 Introduction
		2.2 Basic Definitions
			2.2.1 Inductance
			2.2.2 Magnetic Energy
			2.2.3 Mutual Inductance
			2.2.4 Effective Inductance
			2.2.5 Impedance
			2.2.6 Time Constant
			2.2.7 Quality Factor
			2.2.8 Self-Resonant Frequency
			2.2.9 Maximum Current Rating
			2.2.10 Maximum Power Rating
			2.2.11 Other Parameters
		2.3 Inductor Configurations
		2.4 Inductor Models
			2.4.1 Analytical Models
			2.4.2 Coupled-Line Approach
			2.4.3 Mutual Inductance Approach
			2.4.4 Numerical Approach
			2.4.5 Measurement-Based Model
		2.5 Coupling Between Inductors
			2.5.1 Low-Resistivity Substrates
			2.5.2 High-Resistivity Substrates
		2.6 Electrical Representations
			2.6.1 Series and Parallel Representations
			2.6.2 Network Representations
		References
	Chapter 3
Printed Inductors
		3.1 Inductors on Si Substrate
			3.1.1 Conductor Loss
			3.1.2 Substrate Loss
			3.1.3 Layout Considerations
			3.1.4 Inductor Model
			3.1.5 Q-Enhancement Techniques
			3.1.6 Stacked-Coil Inductor
			3.1.7 Temperature Dependence
		3.2 Inductors on GaAs Substrate
			3.2.1 Inductor Models
			3.2.2 Figure of Merit
			3.2.3 Comprehensive Inductor Data
			3.2.4 Q-Enhancement Techniques
			3.2.5 Compact Inductors
			3.2.6 High Current Handling Capability Inductors
		3.3 Printed Circuit Board Inductors
		3.4 Hybrid Integrated Circuit Inductors
			3.4.1 Thin-Film Inductors
			3.4.2 Thick-Film Inductors
			3.4.3 LTCC Inductors
		3.5 Ferromagnetic Inductors
		References
	Chapter 4
Wire Inductors
		4.1 Wire-Wound Inductors
			4.1.1 Analytical Expressions
			4.1.2 Compact High-Frequency Inductors
		4.2 Bond Wire Inductor
			4.2.1 Single and Multiple Wires
			4.2.2 Wire Near a Corner
			4.2.3 Wire on a Substrate Backed by a Ground Plane
			4.2.4 Wire Above a Substrate Backed by a Ground Plane
			4.2.5 Curved Wire Connecting Substrates
			4.2.6 Twisted Wire
			4.2.7 Maximum Current Handling of Wires
		4.3 Wire Models
			4.3.1 Numerical Methods for Bond Wires
			4.3.2 Measurement-Based Model for Air Core Inductors
			4.3.3 Measurement-Based Model for Bond Wires
		4.4 Broadband Inductors
		4.5 Magnetic Materials
		References
	Chapter 5
Capacitors
		5.1 Introduction
		5.2 Capacitor Parameters
			5.2.1 Capacitor Value
			5.2.2 Effective Capacitance
			5.2.3 Tolerances
			5.2.4 Temperature Coefficient
			5.2.5 Quality Factor
			5.2.6 Equivalent Series Resistance
			5.2.7 Series and Parallel Resonances
			5.2.8 Dissipation Factor or Loss Tangent
			5.2.9 Time Constant
			5.2.10 Rated Voltage
			5.2.11 Rated Current
		5.3 Chip Capacitor Types
			5.3.1 Multilayer Dielectric Capacitor
			5.3.2 Multiplate Capacitor
		5.4 Discrete Parallel Plate Capacitor Analysis
			5.4.1 Vertically Mounted Series Capacitor
			5.4.2 Flat-Mounted Series Capacitor
			5.4.3 Flat-Mounted Shunt Capacitor
			5.4.4 Measurement-Based Model
		5.5 Voltage and Current Ratings
			5.5.1 Maximum Voltage Rating
			5.5.2 Maximum RF Current Rating
			5.5.3 Maximum Power Dissipation
		5.6 Capacitor Electrical Representation
			5.6.1 Series and Shunt Connections
			5.6.2 Network Representations
		References
	Chapter 6
Monolithic Capacitors
		6.1 MIM Capacitor Models
			6.1.1 Simple Lumped Equivalent Circuit
			6.1.2 Single Microstrip-Based Distributed Model
			6.1.3 EC Model for MIM Capacitor on Si
			6.1.4 EM Simulations of Capacitors
		6.2 High-Density Capacitors
			6.2.1 Multilayer Capacitors
			6.2.2 Ultra-Thin-Film Capacitors
			6.2.3 High-K Capacitors
			6.2.4 Fractal Capacitors
			6.2.5 Ferroelectric Capacitors
		6.3 Capacitor Shapes
			6.3.1 Rectangular Capacitors
			6.3.2 Circular Capacitors
			6.3.3 Octagonal Capacitors
		6.4 Design Considerations
			6.4.1 Q-Enhancement Techniques
			6.4.2 Tunable Capacitor
			6.4.3 Maximum Power Handling
		References
	Chapter 7
Interdigital Capacitors
		7.1 Interdigital Capacitor Models
			7.1.1 Approximate Analysis
			7.1.2 Full-Wave Analysis
			7.1.3 Measurement-Based Model
		7.2 Design Considerations
			7.2.1 Compact Size
			7.2.2 Multilayer Capacitor
			7.2.3 Q-Enhancement Techniques
			7.2.4 Voltage Tunable Capacitor
			7.2.5 High-Voltage Operation
		7.3 Interdigital Structure as a Photodetector
		References
	Chapter 8
Resistors
		8.1 Introduction
		8.2 Basic Definitions
			8.2.1 Power Rating
			8.2.2 Temperature Coefficient
			8.2.3 Resistor Tolerances
			8.2.4 Maximum Working Voltage
			8.2.5 Maximum Frequency of Operation
			8.2.6 Stability
			8.2.7 Noise
			8.2.8 Maximum Current Rating
		8.3 Resistor Types
			8.3.1 Chip Resistors
			8.3.2 MCM Resistors
			8.3.3 Monolithic Resistors
		8.4 High-Power Resistors
		8.5 Resistor Models
			8.5.1 EC Model
			8.5.2 Distributed Model
			8.5.3 Meander Line Resistor
		8.6 Resistor Representations
			8.6.1 Network Representations
			8.6.2 Electrical Representations
		8.7 Effective Conductivity
		8.8 Thermistors
		References
	Chapter 9 Via Holes
		9.1 Types of Via Holes
			9.1.1 Via Hole Connection
			9.1.2 Via Hole Ground
		9.2 Via Hole Models
			9.2.1 Analytical Expression
			9.2.2 Quasi-static Method
			9.2.3 Parallel Plate Waveguide Model
			9.2.4 Method of Momen
			9.2.5 Measurement-Based Model
		9.3 Via Fence
			9.3.1 Coupling Between Via Holes
			9.3.2 Radiation from Via Ground Plug
		9.4 Plated Heat Sink Via
		9.5 Via Hole Layout
		9.6 Silicon Vias
		References
	Chapter 10 Airbridges and Dielectric Crossovers
		10.1 Airbridge and Crossov
		10.2 Analysis Techniques
			10.2.1 Quasi-static Method
			10.2.2 Full-Wave Analysis
		10.3 Models
			10.3.1 Analytical Model
			10.3.2 Measurement-Based Model
		References
	Chapter 11 Inductor Transformers and Baluns
		11.1 Basic Theory
			11.1.1 Parameters Definition
			11.1.2 Analysis of Transformers
			11.1.3 Ideal Transformers
			11.1.4 Equivalent Circuit Representation
			11.1.5 Equivalent Circuit of a Practical Transformer
			11.1.6 Wideband Impedance Matching Transformers
			11.1.7 Types of Transformers
		11.2 Wire-Wrapped Transformers
			11.2.1 Tapped Coil Transformers
			11.2.2 Bond Wire Transformer
		11.3 Transmission-Line Type Transformers
		11.4 Parallel Conductor Winding Transformers on Si Substrate
		11.5 Spiral Transformers on GaAs Substrate
		11.6 Baluns
			11.6.1 Lumped-Element LP/HP Filter Baluns
			11.6.2 Lumped-Element Power Divider and 180◦ Hybrid Baluns
			11.6.3 Coil Transformer Baluns
			11.6.4 Transmission-Line Baluns
			11.6.5 Marchand Baluns
			11.6.6 Common-Mode Rejection Ratio
		References
	Chapter 12
Lumped-Element Passive Components
		12.1 Impedance Matching Techniques
			12.1.1 One-Port and Two-Port Networks
			12.1.2 Lumped-Element Narrowband Matching Techniques
			12.1.3 Lumped-Element Wideband Matching Techniques
		12.2 90◦ Hybrids
			12.2.1 Broadband 3-dB 90◦ Hybrid
			12.2.2 Reconfigurable 3-dB 90◦ Hybrid
			12.2.3 Dual-Band 3-dB 90◦ Hybrid
			12.2.4 Differential 3-dB 90◦ Hybrid
		12.3 180◦ Hybrids
			12.3.1 Compact Lumped-Element 3-dB 180◦ Hybrid
			12.3.2 Wideband Lumped-Element Differential 3-dB 180◦ Hybrids
		12.4 Directional Couplers
			12.4.1 Transformer Directional Couplers
			12.4.3 Differential Directional Couplers
			12.4.4 Directional Coupler with Impedance Matching
		12.5 Power Dividers/Combiners
			12.5.1 Power Dividers with 90◦ and 180◦ Phase Difference
			12.5.2 Broadband 2-Way and 4-Way Power Dividers
			12.5.3 Compact 2-Way and 4-Way Power Dividers
			12.5.4 Dual-Band Power Dividers
			12.5.5 Differential Power Dividers
		12.6 Filter
			12.6.1 Ceramic Lumped-Element LTCC Bandpass Filters
			12.6.2 Dual-Band Filters
			12.6.3 Reconfigurable and Switchable Filters
			12.6.4 High Selectivity Compact BPF
			12.6.5 Differential-Mode and Common-Mode Rejection Filters
			12.6.6 Tunable BPF with Constant Bandwidth
			12.6.7 Compact Si Bandpass Filter
			12.6.8 Compact CMOS Bandpass Filters
		12.7 Biasing Networks
			12.7.1 Biasing of Diodes and Control Components
			12.7.2 Biasing of Active Circuits
		References
	Chapter 13 Lumped-Element Control Components
		13.1 Switches
			13.1.1 Switch Configurations
			13.1.2 Broadband Switches
			13.1.3 MESFET Switches
			13.1.4 HEMT Switches
			13.1.5 CMOS Switches
			13.1.6 GaN HEMT Switches
			13.1.7 Comparison of Switch Technologies
		13.2 Phase Shifters
			13.2.1 Types of Phase Shifters
			13.2.2 Switched-Network Phase Shifters
			13.2.3 Multibit Phase Shifter Circuits
			13.2.4 MESFET/HEMT Multibit Phase Shifters
			13.2.5 CMOS Phase Shifters
			13.2.6 Analog Phase Shifters
			13.2.7 Broadband Phase Shifters
			13.2.8 Ultrawideband Phase Shifters
			13.2.9 Millimeter-Wave Phase Shifters
			13.2.10 Active Phase Shifters
		13.3 Attenuators
			13.3.1 Attenuator Configurations
			13.3.2 Multibit Attenuators
			13.3.3 GaAs MMIC Step Attenuators
			13.3.4 Si CMOS Step Attenuators
			13.3.5 Variable Voltage Attenuators
			13.3.6 GaN HEMT Attenuator
			13.3.7 Phase Compensated Attenuators
			13.3.8 CMOS Attenuator with Integrated Switch
		13.4 Limiters
			13.4.1 Limiter Types
			13.4.2 Diode Limiter Circuits
			13.4.3 FET Switch Limiter Circuits
			13.4.4 Matched Limiters
			13.4.5 Limiter/LNA
		References
	Chapter 14
Lumped-Element Active Circuits
		14.1 Amplifiers
			14.1.1 Low-Noise Amplifiers
			14.1.2 Power Amplifiers
			14.1.3 Differential Amplifiers
			14.1.4 Buffer Amplifiers
		14.2 Oscillators
			14.2.1 Oscillator Configurations
			14.2.2 Operation of Oscillators
			14.2.3 Phase Noise in Oscillators
			14.2.4 Oscillator Design
			14.2.5 GaAs HEMT and HBT-HEMT Based VCOs
			14.2.6 Si-Based VCOs
		14.3 Mixers
			14.3.1 Passive Mixer Circuits
			14.3.2 Active Mixer Circuits
		14.4 Frequency Multipliers
			14.4.1 Introduction
			14.4.2 Diode Multipliers
			14.4.3 Transistor Multipliers
			14.4.4 Frequency Doublers
			14.4.5 Frequency Triplers
			14.4.6 Frequency Quadrupler and Higher-Order Multipliers
		14.5 Frequency Dividers
			14.5.1 Regenerative Frequency Dividers
			14.5.2 Injection-Locked Frequency Dividers
			14.5.3 Divide-by-3 Injection-Locked Frequency Dividers
			14.5.4 Divide-by-4 and Higher-Order Dividers
		14.6 Other Active Circuits
			14.6.1 Active Baluns
			14.6.2 Active Inductors
			14.6.3 Active Capacitors
			14.6.4 Active Filters
			14.6.5 Active Circulators
		References
	About the Author
	Index