Characterization of Integrated Circuit Packaging Materials

Content: 
MATERIALS CHARACTERIZATION SERIES, Page ii
Front Matter, Page iii
Dedication, Page iv
Copyright, Page iv
Foreword, Pages xi-xii, Walter H. Schroen
Preface to Series, Page xiii, C.R. Brundle, C.A. Evans Jr.
Preface, Pages xiv-xvi, Thomas M. Moore, Robert G. McKenna
Contributors, Pages xvii-xviii
1 - IC Package Reliability Testing, Pages 1-26, LAWRENCE C. WAGNER
2 - Mold Compound Adhesion and Strength, Pages 27-55, SAMUEL S. KIM
3 - Mechanical Stress in IC Packages, Pages 57-77, DARVIN R. EDWARDS, STEVEN K. GROOTHUIS
4 - Moisture Sensitivity and Delamination, Pages 79-96, THOMAS M. MOORE, ROBERT G. McKENNA, SHAWN J. KELSALL
5 - Thermal Management, Pages 97-119, MOSTAFA AGHAZEDEH
6 - Electrical Performance of IC Packages, Pages 121-143, ERIC BOGATIN
7 - Solderability of Integrated Circuits, Pages 145-166, JAMES A. KARGOL, ANTHONY M. PETRUCCI, TIMOTHY M. McGUIGGAN
8 - Hermeticity and Joining in Ceramic IC Packages, Pages 167-185, STEPHEN R. MARTIN
9 - Advanced Interconnect Technologies, Pages 187-207, ROBERT G. McKENNA, THOMAS M. MOORE
Appendix - Technique Summaries, Page 208
1 - Acoustic Microscopy (C-AM), Pages 209-212, THOMAS M. MOORE
2 - Atomic Absorption Spectrometry (AAS), Page 213, THOMAS M. MOORE
3 - Auger Electron Spectroscopy (AES)*, Page 214
4 - Ceramic Plate Test (CPT) for Evaluating the Solderability of IC Devices, Pages 215-217, TIMOTHY McGUIGGAN
5 - Coulometric Method for Solderability Evaluation, Pages 218-221, KUAN-SHAUR LEI
6 - Decapsulation Techniques, Pages 222-224, LAWRENCE C. WAGNER
7 - Differential Scanning Calorimetry (DSC), Pages 225-226, SAMUEL S. KIM
8 - Dynamic Mechanical Analysis, Pages 227-228, HERBERT J. MOLTZAN
9 - Dynamic Secondary Ion Mass Spectrometry (Dynamic SIMS)*, Page 229
10 - Electron Probe X-Ray Microanalysis (EPMA)*, Page 230
11 - Energy-Dispersive X-Ray Spectroscopy (EDS)*, Page 231
12 - Finite Element Analysis (FEA), Pages 232-234, DARVIN R. EDWARDS, STEVE GROOTHUIS
13 - Fourier Transform Infrared Spectroscopy (FTIR)*, Page 235
14 - Inductively Coupled Plasma Mass Spectrometry (ICPMS)*, Page 236
15 - Inductively Coupled Plasma-Optical Emission Spectroscopy (ICP-OES)*, Page 237
16 - In Situ Strain Gauges, Pages 238-239, DARVIN EDWARDS, STEVE GROOTHUIS
17 - Ion Chromatography, Pages 240-242, T. TALASEK
18 - Mechanical Testing in IC Packaging, Pages 243-246, LAWRENCE C. WAGNER
19 - Scanning Electron Microscopy (SEM)*, Page 247
20 - Scanning Tunneling Microscopy (STM) and Scanning Force Microscopy (SFM)*, Page 248
21 - Static Secondary Ion Mass Spectrometry (Static SIMS)*, Page 249
22 - Thermogravimetric Analysis (TGA), Pages 250-251, HERBERT J. MOLTZAN
23 - Thermomechanical Analysis (TMA), Pages 252-254, HERBERT J. MOLTZAN
24 - Torsional Braid Analysis (TBA), Pages 255-257, SAMUEL S. KIM
25 - Wetting Balance Method to Evaluate the Solderability of IC Devices, Pages 258-259, TIMOTHY McGUIGGAN
26 - X-Ray Laminography, Pages 260-262, JOHN ADAMS
27 - X-Ray Photoelectron Spectroscopy (XPS)*, Page 263
28 - X-Ray Radiographic Inspection, Pages 264-266, JOSEPH COLANGELO
Index, Pages 267-274