Understanding Nanoelectromechanical Quantum Circuits and Systems (NEMX) for the Internet of Things (IoT) Era (River Publishers Series in Electronic Materials and Devices)

Front Cover
Half Title
Series Page - RIVER PUBLISHERS SERIES IN ELECTRONIC MATERIALS AND DEVICES
Title Page
Copyright Page
Dedication Page
Contents
Preface
Acknowledgements
List of Figures
List of Tables
List of Abbreviations
Chapter 1 - The Internet of Things
	1.1 Origins
	1.2 IoT Motivation/Impact
	1.3 Summary
Chapter 2 - Microelectromechanical and Nanoelectromechanical Systems
	2.1 MEMS/NEMS Origins
	2.2 MEMS/NEMS Impetus/Motivation
	2.3 Summary
Chapter 3 - Understanding MEMS/NEMS Device Physics
	3.1 Actuation
		3.1.1 Electrostatic Actuation
			3.1.1.1 Parallel-plate capacitor
			3.1.1.2 Electrostatically actuated cantilever beam
			3.1.1.3 Interdigitated (comb-drive) capacitor
		3.1.2 Piezoelectric Actuation
			3.1.2.1 Piezoelectric cantilever probe
		3.1.3 Casimir Actuation
			3.1.3.1 Casimir’s own force calculation
			3.1.3.2 Lifshitz’ calculation of the casimir force
			3.1.3.3 Casimir force calculation of brown and maclay
			3.1.3.4 Casimir force calculations for arbitrary geometries
				3.1.3.4.1 Computing the casimir energy based on multipole interactions
				3.1.3.4.2 Computing the casimir force using finite-difference time-domain techniques
				3.1.3.4.3 Computing the casimir force using the framework of macroscopic quantum electrodynamics
			3.1.3.5 Corrections to ideal casimir force derivation
		3.1.4 Radiation Pressure Actuation
			3.1.4.1 Radiation pressure manipulation of particles
			3.1.4.2 Radiation pressure trapping of particles
			3.1.4.3 Radiation pressure effect on cantilever beams
	3.2 Mechanical Vibration
		3.2.1 The Single-Degree-of-Freedom System
		3.2.2 The Many-Degree-of-Freedom System
		3.2.3 Rayleigh’s Method
	3.3 Thermal Noise in MEMS/NEMS
		3.3.1 Fundamental Origin of Intrinsic Noise [66]
			3.3.1.1 Amplitude of brownian (random) displacement of cantilever beam [69]
	3.4 Sensing
		3.4.1 The Accelerometer
			3.4.1.1 Capacitive accelerometer implementation
			3.4.1.2 Quantum mechanical tunneling accelerometer
		3.4.2 Vibration Sensors
	3.5 Summary
Chapter 4 - Understanding MEMS/NEMS Devices
	4.1 Introduction
	4.2 MEMS/NEMS Switches
		4.2.1 Nanoelectromechanical Switches
			4.2.1.1 Downscaled MEMS/NEMS switches
			4.2.1.2 MEMS/NEMS switches via new materials
	4.3 MEMS/NEMS Varactors
		4.3.1 Nanoelectromechanical Varactors
			4.3.1.1 Dual-gap MEMS/NEMS varactors
			4.3.1.2 MEMS/NEMS varactors via new materials
	4.4 MEMS/NEMS Resonators
		4.4.1 Nanoelectromechanical Resonators
			4.4.1.1 Clamp–clamp RF MEMS resonators
			4.4.1.2 MEMS/NEMS resonators via new materials
	4.5 Summary
Chapter 5 - Understanding MEMS/NEMS for Energy Harvesting
	5.1 Introduction
	5.2 Wireless Energy Harvesting
		5.2.1 RF-DC Conversion Circuit
		5.2.2 Resonant Amplification of Extremely Small Signals
	5.3 Mechanical Energy Harvesting
		5.3.1 Theory of Energy Harvesting from Vibrations
			5.3.1.1 Piezoelectric conversion
			5.3.1.2 Electrostatic conversion
	5.4 Summary
Chapter 6 - NEMX Applications in the IoT Era
	6.1 Introduction
		6.1.1 Wireless Connectivity
			6.1.1.1 Communication protocols
			6.1.1.2 Network range
	6.2 Roots of the Internet of Things
	6.3 Applications of the Internet of Things
		6.3.1 NEMX in Smart Home IoT Applications
		6.3.2 NEMX in Wearable IoT Applications
		6.3.3 NEMX in Smart Cities IoT Applications
		6.3.4 NEMX in Smart Grid IoT Applications
		6.3.5 NEMX in Industrial Internet IoT Applications
		6.3.6 NEMX in Connected Car IoT Applications
		6.3.7 NEMX in Connected Health IoT Applications
		6.3.8 NEMX in Smart Retail IoT Applications
		6.3.9 NEMX in Smart Supply Chain IoT Applications
		6.3.10 NEMX in Smart Farming IoT Applications
	6.4 Applications in Wireless Sensor Networks
		6.4.1 NEMX-Based Radios for the IoT
		6.4.2 Agricultural Applications
	6.5 5G: Systems [156]
	6.6 5G: Technologies [158]
		6.6.1 Device-to-Device Communications
		6.6.2 Simultaneous Transmission/Reception
		6.6.3 mmWave/5G Frequencies for IoT
	6.7 Summary
Appendix A - MEMS Fabrication Techniques Fundamentals
	A.1 Introduction
	A.2 The Conventional IC Fabrication Process
	A.3 Bulk Micromachining
	A.4 Surface Micromachining
	A.5 Materials Systems
	A.6 Summary
Appendix B - Emerging Fabrication Technologies for the IoT: Flexible Substrates and Printed Electronics
	B.1 Flexible Substrates [176]
		B.1.1 Device Fabrication on Flexible Substrates
			B.1.1.1 Thin-Film Transistors (TFTs)
		B.1.2 Film Bulk Acoustic Wave Resonators (FBARs)
	B.2 Printed Electronics [178]
		B.2.1 Printing Technologies
			B.2.1.1 Contact Printing Techniques
			B.2.1.2 Non-Contact Printing Techniques
	B.3 Summary
References
Index
About the Author
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