Signal Integrity: Applied Electromagnetics and Professional Practice

Introduction
	Why Study This Subject?
	Why This Book?
	Why Are We Here, and Where Is ``Here´´?
Contents
Chapter 1: The Basics - Charge, Energy, Time, and Distance
	Background and Objectives
	Getting Back to Basics
	Consequences of the Basics
	Distance, Time, Speed, and c
	The Effect of Dielectrics
	Rise Time and Bandlimit
	Knee Frequency
	Lumped Versus Distributed
	Combining Rise Times
	Appendix
Chapter 2: Circuit Boards
	Background and Objectives
	What Is a Circuit Board?
	How Are Circuit Boards Made?
	Components and Component Packages
	How Are Circuit Boards Used to Make a Product?
	Appendix
Chapter 3: Gates, Packaging, and Boards: Properties and Modeling
	Background and Objectives
	What Limits What Is Possible?
	Power and Heat Dissipation
	Summarizing the Effects
	Simplest Gate Model
	Electrical Modeling
	The Modeling Process
	The Limits of Modeling
	Appendix
Chapter 4: Circuit Elements: Resistance, Capacitance, and Inductance
	Background and Objectives
	Reviewing the Review
	What Is Resistance?
	What Is Capacitance?
	Finding Capacitance
	What Is Inductance?
	Calculating Inductance
	Inductance and Return Current
	Inductance and the Skin Effect
	Appendix
Chapter 5: Ground Bounce and Ringing
	Background and Objectives
	The Role of Inductance
	What Is Ground Bounce?
	Results of Ground Bounce
	Minimizing Ground Bounce
	What Is Ringing?
	Results of Ringing
	Minimizing Ringing
	So Where Is Ringing Seen - And Not Seen - Today?
	Appendix
Chapter 6: Distributed Analysis: Transmission Lines and Z0
	Background and Objectives
	Where Can You See a Transmission Line?
	Transmission Line: The View from the Inside
	Estimating Z0 in Common Situations
	Approximate Model of a Transmission Line
	Appendix
Chapter 7: Transmission Lines: Reflections and Termination
	Background and Objectives
	The Left Hand and the Right Hand: Reflection and Transmission
	Terminating Impedance
	Departures from the Ideal
	Fixing It When It´s Broke
	Appendix
Chapter 8: Lossy Transmission Lines
	Background and Objectives
	What Is Attenuation and How Is It Measured?
	Frequency-Dependent Attenuation
	Dielectric Loss
	How Does Dielectric Loss Affect ε?
	How Does Dielectric Loss Affect Signal Propagation?
	Appendix
Chapter 9: Differential Signaling
	Background and Objectives
	What Is Differential Signaling and How Does It Help?
	What Is Zdiff?
	Obstacles: Clock Jitter and Common-Mode Signals
	Termination Strategies Revisited
	Appendix
Chapter 10: Crosstalk
	Background and Objectives
	What Is Crosstalk?
	Near-End Versus Far-End Crosstalk
	Estimating and Reducing Crosstalk
	Diagnosing Crosstalk
	Appendix
Chapter 11: Power Distribution Network: Frequency Domain Analysis
	Background and Objectives
	The Power Distribution Network
	Power Supplies and Resonance
	Design Strategy: The Big Picture
	Design Strategy: The Details
	Design Strategy: The Role of Simulation
	Selecting Bypass Capacitors
	Appendix
Chapter 12: EMI/EMC: Design and Susceptibility
	Background and Objectives
	EMI/EMC
	Circuit-Board Design
		Engineering Notebook - Mounting Holes, Cable Shields, and Grounding
	Chassis
	Cabling
	Legal Certification: Standards and Test Requirements
		Engineering Notebook - Get Down Here Right Away
	Appendix
Chapter 13: Electrostatic Discharge
	Background and Objectives
	What Is Electrostatic Discharge?
	Where Can ESD Occur?
	ESD and Lightning Standards and Testing
	Components to Manage ESD
	Design Techniques to Manage ESD
	Appendix
Chapter 14: Clocks, Jitter, and Eye Diagrams
	Background and Objectives
	Clock Jitter and Clock Skew
	Sources of Jitter
	Clock Sources
	Layout to Reduce Clock Jitter
		Engineer´s Notebook - The Crystal Layout
	Eye Diagrams
	Appendix
Chapter 15: Circuit-Board Design Process
	Background and Objectives
	How Are Circuit Boards Designed?
	Component Selection
		Engineer´s Notebook - More About Capacitors
	Schematic
	Bill of Materials
	Layout
	Design Files
	The Board Is Dead. Now What?
	Appendix
Chapter 16: Circuit-Board Attacks and Security
	Background and Objectives
	Circuit Board Recap
	First Indication of Trouble
	Review of Circuit-Board Design, Fabrication, and Assembly
	Example Attacks
	Review of Processor-Based Design
	Taxonomy of Attacks
	Conclusion
	Appendix
	References
Chapter 17: Testing, Debugging, DFX, and Quality Management
	Background and Objectives
	Testing a Board: The Oscilloscope
	Qualifying a Design for Mass Production
	Transitioning to Mass Production
	Appendix
Chapter 18: Commercial and Legal Implications, Project Management, and Risk Mitigation
	Background and Objectives
	Legal Aspects of Design
	Commercial Aspects of Design
		Engineering Notebook - Predicting What Comes Next
	Project Management
	Risk Mitigation
	Engineering Careers
	Appendix
Index