PLASMA APPLICATIONS FOR MATERIAL MODIFICATION : from microelectronics to.

Cover
Half Title
Title Page
Copyright Page
Table of Contents
Preface
Chapter 1: Introduction: Cold Plasmas and Surface Processing
	1.1: Types of Plasmas
	1.2: Cold Plasma in the Industry
	1.3: Cold Plasma Chemistry
	1.4: Microelectronics
	1.5: Surface Treatments with Cold Plasmas
	1.6: Controlled-Fusion Plasmas
	1.7: Medical and Biomedical Applications
Chapter 2: Plasma-Enhanced Chemical Vapor Deposition of Thin Films
	2.1: Introduction
	2.2: Effect of Gas Pressure on the Electrical Discharges between Two Electrodes
		2.2.1: Paschen’s Law
		2.2.2: Thermal and Low-Temperature Plasma Discharges
	2.3: Elementary Collisional Processes in Plasma Discharges
		2.3.1: Elastic and Inelastic Collision Processes
		2.3.2: Effect of the Discharge Frequency on the Collision Processes
			2.3.2.1: Discharges at the DC-kHz regimes (ωkHz < ωi < ωe)
			2.3.2.2: Discharges at the MHz regime (ωi < ωrf < ωe)
			2.3.2.3: Discharges at the GHzregime (ωi < ωrf ≈ ωe)
	2.4: LP-PECVD vs. AP-PECVD of Thin Films
	2.5: PECVD of Thin Films under LP and AP Conditions: Some Examples
		2.5.1: Carbon-Based Compounds
		2.5.2: Silicon-Based Compounds
		2.5.3: Titanium-Based Compounds
Chapter 3: Deposition of Porous Nanocolumnar Thin Films by Magnetron Sputtering
	3.1: Introduction to Magnetron Sputtering
		3.1.1: Nanostructuring Variables during Thin-Film Sputtering Deposition
		3.1.2: The Sputtering Mechanism
		3.1.3: Transport of Sputtered Species in the Plasma: Thermalization Degree
		3.1.4: Reactive Magnetron Sputtering
	3.2: Plasma-Assisted Deposition of Porous Nanocolumnar Thin Films
		3.2.1: The Oblique Angle Geometry
		3.2.2: Process-Control and Growth Mechanism
		3.2.3: Effect of the Kinetic Energy of the Deposition Species on the Nanocolumnar Growth of Thin Films
		3.2.4: Influence of Plasma–Nanocolumnar Film Interaction during Growth
		3.2.5: Reactive Magnetron Sputtering at Oblique Angles
		3.2.6: Growth of Nanocolumnar Thin Films on Patterned and Rough Substrates
	3.3: Nanostructure-Related Applications of Porous Nanocolumnar Thin Films
		3.3.1: Porous Magnetron Sputtered Thin Films
		3.3.2: Nanostructured Magnetron Sputtered Thin Films
		3.3.3: Nanostructured Thin Films Deposited on Patterned or Nanostructured Substrates
Chapter 4: Atomic Species Generation by Plasmas
	4.1: Introduction
	4.2: Plasma Sources of Neutral Atoms
	4.3: Production of O, H, and N Atoms in an Inductively Coupled RF Discharge
		4.3.1: Oxygen Atoms
		4.3.2: Hydrogen Atoms
		4.3.3: Nitrogen Atoms
	4.4: Conclusions
Chapter 5: Surface Modification by Fusion Plasmas
	5.1: Introduction
	5.2: Controlled Thermonuclear Fusion: Reactions and Devices
	5.3: Fusion Fuel and Reactor Components
	5.4: Plasma-Facing Wall
	5.5: Plasma–Wall Interactions
	5.6: Erosion Processes and Wall Materials
		5.6.1: Selection of Plasma-Facing Materials
		5.6.2: Erosion and Deposition
			5.6.2.1: Erosion-deposition under steady-state conditions
			5.6.2.2: Erosion under high-power loads and off-normal events
			5.6.2.3: Neutron-induced effects
	5.7: Tools for Material Migration Studies
		5.7.1: Erosion-Deposition Probes and Test Limiters
		5.7.2: Tracer Techniques
	5.8: Analysis of Wall Materials
		5.8.1: Analyzed Species
		5.8.2: Analysis Methods
	5.9: Concluding Remarks
Chapter 6: Plasma-Assisted Wall Conditioning of Fusion Devices: A Review
	6.1: Introduction
	6.2: Fundamentals of Wall Conditioning by Plasmas
	6.3: Kinds of Conditioning Plasmas
		6.3.1: Direct Current Glow Discharge
		6.3.2: Conditioning Techniques in the Presence of Magnetic Fields
		6.3.3: RF Conditioning
		6.3.4: MW Conditioning in Tokamaks
		6.3.5: High Temperature Plasma for Conditioning Purposes
		6.3.6: Taylor Discharge Cleaning
	6.4: Plasma Coating
	6.5: A Practical Case: Wall Conditioning of the TJ-II Stellarator
		6.5.1: He Glow Discharge during the First Campaigns of TJ-II
		6.5.2: Boronization of TJ-II
		6.5.3: Lithium Coating in TJ-II
	6.6: The Future: Wall Condition of Reactor-Oriented Fusion Devices
Chapter 7: Cold Atmospheric Pressure Plasma Jets and Their Applications
	7.1: Introduction
		7.1.1: Meaning of Cold Plasma
		7.1.2: Importance of Voltage Frequency, Gas Pressure, and Discharge Electrode Configuration in Plasma Sources Operation
	7.2: Atmospheric Pressure Plasma Sources: Principles, Design, and Models
		7.2.1: DBD and DBE Plasma Sources
		7.2.2: Expanding Plasmas, Plasma Je
	7.3: Applications of Atmospheric Pressure Plasma Sources
		7.3.1: Surface Modification
		7.3.2: Coating of Surfaces by Deposition with Atmospheric Pressure Plasma Jets
		7.3.3: Surface Cleaning with Atmospheric Pressure Plasma Jets
		7.3.4: Atmospheric Pressure Plasma Processing of Liquid Solutions and Dispersions
			7.3.4.1: Degradation of chemical contaminants in solutions
			7.3.4.2: Plasma in-liquid processing of nanomaterials
		7.3.5: Other Applications
	7.4: Conclusions and Outlook
Chapter 8: Plasma in Odontology
	8.1: Introduction
	8.2: Surface Treatment of Materials or Medical Devices
		8.2.1: Peri-implant Osseointegration Improved by Plasma Treatment
		8.2.2: Increasing the Adhesion
		8.2.3: Plasma Cleaning and Antimicrobial Effect
	8.3: Direct Application
		8.3.1: Increasing the Adhesion
		8.3.2: Antimicrobial Effects
		8.3.3: Endodontic Applications of Cold Atmospheric Plasmas
			8.3.3.1: Plasma and disinfection
			8.3.3.2: Plasma and dentine wall
		8.3.4: Tooth Bleaching
		8.3.5: Periodontal Treatment
		8.3.6: Peri-implantitis Treatment
	8.4: Discussion and Conclusion
Index