Nano-Lithography

Title Page......Page 2
Copyright
......Page 3
Contents......Page 4
Foreword......Page 9
Introduction......Page 14
1.1. Introduction......Page 23
1.2. The principle of X-ray lithography......Page 27
1.2.1. The irradiation system for XRL......Page 29
1.2.2. Properties of synchrotron radiation......Page 31
1.2.4. Examples of X-ray lithography beamlines......Page 34
1.2.5. Scanner/stepper......Page 40
1.2.6. The mask......Page 41
1.3.1. How phase and intensity of X-rays are altered by interaction with matter......Page 47
1.3.2. X-ray lithography as a shadow printing technique......Page 49
1.3.3. X-ray absorption in a resist and physical mechanisms involved in itsexposure......Page 52
1.3.4. Physical model of electron energy loss in resists......Page 57
1.3.5. Diffraction effects in X-ray lithography......Page 62
1.3.6. Coherence of synchrotron radiation from bending magnet devices......Page 63
1.3.7. Basic formulation of diffraction theory for a scalar field......Page 66
1.3.8. Rayleigh?Sommerfeld formulation of diffraction by a planar screen......Page 69
1.3.9. An example of diffraction effects: Poisson’s spot in X-ray lithography......Page 73
1.4.1. Optimal photon energy range for High resolution and Deep X-raylithography......Page 77
1.4.2. Diffraction effects on proximity lithography......Page 78
1.4.3. High resolution 3D nano structuring......Page 83
1.4.4. 3D polymer structures by combination of NanoImprint NIL and X-raylithography XRL......Page 86
1.4.5. Micromachining and the LIGA process......Page 88
1.4.9. Micro-optical element for distance measurement......Page 99
1.6. Bibliography......Page 101
2.1. From printing to NanoImprint......Page 109
2.2. A few words about NanoImprint......Page 112
2.3. The fabrication of the mold......Page 118
2.4.1. The problem......Page 122
2.4.2. Adhesion......Page 124
2.4.3. Adhesion and physico-chemical surface properties......Page 125
2.4.4. Surface treatment of the mold......Page 129
2.4.6. Characterization of the demolding process......Page 136
2.5.1. The residual layer: a NanoImprint specific issue......Page 140
2.5.2. Is the thickness of the residual layer predictable?......Page 142
2.5.3. How can the process impact the thickness of the residual layer?......Page 147
2.6. Residual layer thickness measurement......Page 154
2.6.1. Macro-scale approach: coherence between film color and thickness......Page 156
2.6.2. Microscopic approach......Page 158
2.7. A few remarks on the mechanical behavior of molds and flow properties ofthe NanoImprint process......Page 170
2.9. Bibliography......Page 179
3.1. Introduction......Page 191
3.2. Presentation of local-probe microscopes......Page 192
3.3. General principles of local-probe lithography techniques......Page 193
3.4. Classification of surface structuring techniques using local-probemicroscopes......Page 195
3.4.1. Classification according to the physical nature of the interaction......Page 196
3.4.2. Comparison with competing advanced lithography techniques......Page 198
3.4.3. Industrial development perspectives......Page 199
3.5. Lithographic techniques with polymer resist mask......Page 201
3.5.1. Electron beam exposure of resists by scanning probe microscopes......Page 202
3.5.2. Development of a resist dedicated to AFM nano-lithography
......Page 204
3.5.3. Lithography using mechanical indentation......Page 206
3.6. Lithography techniques using oxidation-reduction interactions......Page 207
3.6.1. Direct fabrication by matter deposition induced by STM microscopy......Page 208
3.6.2. Local anodization under the AFM tip......Page 210
3.7.1. Dip-pen lithography......Page 220
3.8. Conclusions and perspectives......Page 222
3.9. Bibliography......Page 223
4.1. Introduction......Page 229
4.2.1. Definition of a volume plasmon......Page 230
4.2.2. Delocalized surface plasmons......Page 231
4.2.3. Localized surface plasmons......Page 234
4.3. Localized plasmon optical lithography......Page 238
4.3.1. Near-field optical lithography by optical edge effect......Page 239
4.3.2. Use of nanoparticle resonances......Page 242
4.4. Delocalized surface plasmon optical lithography......Page 244
4.4.1. Coupling between nanostructures and delocalized surface plasmons......Page 245
4.4.2. Surface plasmon launch and interferences......Page 246
4.5. Conclusions, discussions and perspectives......Page 247
4.6. Bibliography......Page 248
5.1. Block copolymers: a nano-lithography technique for tomorrow?......Page 252
5.2. Controlling self-assembled block copolymer films......Page 254
5.3. Technological applications of block copolymer films......Page 258
5.4. Bibliography......Page 265
6.1. Introduction......Page 269
6.2.1. CD measurement after a lithography stage: definitions......Page 270
6.2.2. What are the metrological needs during a lithography step?
......Page 271
6.3.1. SEM principle......Page 274
6.3.2. Matter?electron interaction......Page 278
6.3.3. From signal to quantified measurement......Page 282
6.4. 3D atomic force microscopy AFM 3D......Page 286
6.4.1. AFM principle......Page 287
6.4.2. 3D AFM AFM 3D special features......Page 295
6.5. Grating optical diffractometry or scatterometry......Page 306
6.5.1. Principle......Page 307
6.5.2. Example: ellipsometry characterization of post development lithography......Page 310
6.5.3. Pros and cons......Page 316
6.5.4. Optical measurements analysis......Page 317
6.5.5. Specificities of scatterometry for CD metrology......Page 325
6.5.6. Scatterometry implementation: R&D versus production......Page 327
6.6. What is the most suitable technique for lithography?......Page 330
6.6.2. Technique calibration......Page 333
6.6.4. Evaluation of morphological damage generated by the primary electronbeam from CD-SEM......Page 334
6.7. Bibliography......Page 336
List of authors......Page 341
Index......Page 343