More-than-Moore Devices and Integration for Semiconductors

Preface
	Introduction
	Acknowledgements
	References
Contents
1 Energy Harvesters and Power Management
	1 Introduction
	2 Motion
		2.1 The Use of a Proof Mass
		2.2 Electrostatic
		2.3 Electromagnetic
		2.4 Piezoelectric
		2.5 Comparison of Transduction Mechanisms
		2.6 Opportunities
	3 Heat
		3.1 Static Thermoelectric Harvesting
		3.2 Dynamic Thermoelectric Harvesting
		3.3 Opportunities
	4 Electromagnetic Fields
		4.1 Piezoelectric Harvesting from AC Power Lines
		4.2 Electrostatic Harvesting from AC Power Lines
		4.3 Inductive Coupling for Energy Collection
		4.4 Coil Design
		4.5 Core Structures
		4.6 Opportunities
	5 Energy Harvesting from Waves
		5.1 Solar Energy Harvesting
		5.2 Acoustic Energy Harvesting
		5.3 RF Energy Harvesting
	6 Power Management
		6.1 Active Drive
		6.2 Rectification
		6.3 Impedance Matching
		6.4 Voltage Boosting, Bucking and Regulation
		6.5 Storage
		6.6 Cold-Starting
		6.7 Digital Control
		6.8 Integration
	7 Conclusion
	References
2 SiC and GaN Power Devices
	1 Introduction
	2 Silicon Carbide Diodes
		2.1 Silicon Carbide Power Microwave Diodes
		2.2 Silicon Carbide Power Diodes
		2.3 Schottky Barrier Power Diodes (SBDs)
		2.4 JBS and MPS Diodes
		2.5 p-i-n Power Diodes
		2.6 Edge Termination
		2.7 Main Points on SiC Power Diodes
	3 SiC BJTs
	4 SiC Junction Field-Effect Transistors
	5 SiC MOSFETs
		5.1 4H-SiC DMOSFETs
		5.2 MOS Channel Resistance Issue
		5.3 4H-SiC Trenched MOSFETs
		5.4 4H-SiC Superjunction MOSFETs
	6 SiC IGBTs
	7 III-Nitrides Power Devices
		7.1 Lateral GaN HEMTs
		7.2 Commercial and R&D Devices
		7.3 Discrete Device Packaging
		7.4 Robustness and Reliability
		7.5 Approaches to GaN ICs
		7.6 Vertical GaN Devices
			7.6.1 Transistors
			7.6.2 Diodes
			7.6.3 Vertical Devices on Foreign Substrates
			7.6.4 GaN Superjunction Devices
		7.7 Outlook: Research Opportunities
			7.7.1 Selective Area P-Type Doping
			7.7.2 High-Voltage GaN Devices
			7.7.3 N-Polar GaN HEMTs
			7.7.4 UWBG III-Nitrides
	8 Conclusions
	References
3 Flexible and Printed Electronics
	1 Introduction
	2 Materials and Processes for Flexible and Printed Electronics
		2.1 Printing Processes
		2.2 3D Printed Electronics
		2.3 Electronic Textiles
	3 Devices for Flexible and Printed Electronics
		3.1 OLED Technologies
		3.2 Organic Photovoltaics
		3.3 Printed TFTs
		3.4 Device Modelling and Design Automation
	4 Conclusions
	References
4 Terahertz Metasurfaces, Metawaveguides, and Applications
	1 Introduction
		1.1 Terahertz Gap
		1.2 Principles of Metamaterials
		1.3 Meta-atoms
			1.3.1 Metallic Resonators
			1.3.2 Dielectric Resonators
	2 Metasurfaces
		2.1 Amplitude Control
		2.2 Phase Control
		2.3 Polarization Control
	3 Terahertz Metawaveguides
		3.1 Metamaterial Waveguides
			3.1.1 Air-Core Meta-Clad Waveguides
			3.1.2 Silicon-Core Meta-Clad Waveguides and Components
		3.2 Topologically Protected Waveguides
	4 Conclusion and Outlook
	References
5 Mechanical Robustness of Patterned Structures and Failure Mechanisms
	1 Reliability of Microelectronic Products and Failure Mechanisms
		1.1 Electrical Effects
		1.2 Stress-Driven Effects
	2 Risks of Microcrack Propagation and Design
	3 Characterization of Microcrack Behavior
		3.1 Fracture Test at Microscale
		3.2 Mode Mixity Dependence of Crack Path and Controlled Steering
		3.3 In Situ Monitoring of Microcracking with an X-Ray Microscope
	4 Understanding of Microcrack Behavior
		4.1 Local Energy Release Rate and Fracture Resistance (Size Effect)
		4.2 Controlled Crack Steering into High-Toughness Regions
	5 Summary and Outlook
		5.1 Future Technologies and Mechanical Reliability Challenges
		5.2 Biomimetics: What Can We Learn from Nature?
	References
6 Neuromorphic Computing for Compact LiDAR Systems
	1 Introduction
		1.1 Background to Single-Photon LiDAR Systems
		1.2 Flash 3D Imaging Laser RADAR and Applications
		1.3 Challenges for Flash LiDAR Systems
		1.4 What Is Neuromorphic Event-Based Vision?
	2 Innovating SPAD Array Sensors for 3D Flash LiDAR
		2.1 Smart SPAD Sensor IC Design
		2.2 Optical Enhancement Through Microlensing
		2.3 3D Stacked Assembly Methods for Imaging SPAD Sensors
		2.4 Frame-Based Versus Event-Based SPAD Architectures
	3 SPAD Neuromorphic Event-Based Sensing and Processing
		3.1 First AND SPAD Feature Event Generation
		3.2 First SPAD Photon Counting Event-Based Design for Temporal Intensity Imaging
		3.3 SPAD Data Processing Using Integrated Spiking Neural Networks (SNNs)
		3.4 Algorithm Testing and Temporally Constrained Dataset Generation
		3.5 Spiking Neural Networks (SNNs): Trends and Challenges
	4 Future Concepts and Summary
	References
7 Integrated Sensing Devices for Brain-Computer Interfaces
	1 Introduction
	2 The Principles of Brain Signal Acquisition
		2.1 How EEG Measurement Works
		2.2 Typical Methodologies for Non-invasive EEG Setup and Analysis
		2.3 Non-invasive EEG Electrode Types
	3 Applications in BCI
		3.1 Conventional BCI Applications
		3.2 Mobile BCI Applications
		3.3 Other Non-EEG BCI Applications
	4 Future Electrode Directions
	5 Challenges and Outlooks
	References
Index
Index