Micro Light Emitting Diode: Fabrication and Devices: Micro-LED Technology

Contents
Part I Materials and Processes
1 Epi-Growth and Chip Fabrication Process for Micro-LEDs
	1.1 Introduction
		1.1.1 Mobile Phone
		1.1.2 Large-Area Display
		1.1.3 Ultra-High Resolution in a Small Display
	1.2 Considerations in Vertical and Horizontal MOCVDs
		1.2.1 Vertical Rotating Disc Reactors
		1.2.2 Horizontal Planetary Reactors
	1.3 The Capability of Improving Peak Efficiency
		1.3.1 Peak Efficiency Affected by Defect-Related Mechanism
		1.3.2 Effects of Sidewall Damage on the Peak Efficiency
		1.3.3 Improvement of the Peak Efficiency by Epitaxy Structure
	1.4 Epitaxy Growth Technique Between 4″ and 6″ Sapphire
		1.4.1 Large-Sized Wafer Substrate
		1.4.2 Relationship Between Wafer Bow and Wafer Diameter
		1.4.3 Pocket/disk Design for Wafer Bowing
	1.5 Device Manufacturing
	References
2 Quantum Dot Color Filter and Micro LED
	2.1 Color Conversion Display
	2.2 Quantum Dot Color Conversion Layer
	2.3 CCL Patterning Process and Color Resist Composition
	2.4 Optical Property
		2.4.1 Color Purity
		2.4.2 Efficiency
		2.4.3 Blue Leakage
		2.4.4 Viewing Angle
	2.5 Conclusion
	References
3 Laser Lift-Off (LLO) Process for Micro-LED Fabrication
	3.1 Introduction
	3.2 Laser Lift-Off Mechanism
	3.3 Lift-Off Process by Excimer Laser (193 nm, 248 nm, 308 nm)
	3.4 Lift-Off Process by DPSS Laser (266 nm, 355 nm)
	3.5 Supplemental Process
		3.5.1 Temporary Substrate
		3.5.2 Underfill and Sacrificial Layer for LED Quality Improvement
		3.5.3 Light Extraction Improvement
		3.5.4 Photochemical Process
	3.6 Summary
	References
4 Transfer Technology of Micro-LEDs for Display Applications
	4.1 Introduction
	4.2 Manufacturing Process of Micro-LED Display Panel
		4.2.1 Face-Down Manufacturing Process
		4.2.2 Face-Up Manufacturing Process
		4.2.3 Comparison Between Face-Down and Face-Up Processes
	4.3 Mechanics of Transfer Process
		4.3.1 Two Approaches to Solving the Adhesion Issue
		4.3.2 Mechanical Characteristics of Transfer Media
	4.4 Available Transfer Technologies
		4.4.1 Electrostatic Transfer
		4.4.2 Laser Transfer
		4.4.3 Rubber Stamp Transfer
		4.4.4 Self-Assembly Transfer
		4.4.5 Roll Transfer
	4.5 Some Examples of Roll Transfer
		4.5.1 Roll-To-Plate Transfer of Mini-LEDs
		4.5.2 Face-Up Transfer of Micro-LEDs
		4.5.3 Face-Down Transfer of Micro-LEDs
	4.6 Summary and Future Direction
	References
Part II Device Applications
5 Advanced Epitaxial Growth of LEDs on Van Der Waals Materials
	5.1 Introduction
	5.2 Brief Summary of Conventional Epitaxy of LEDs
		5.2.1 Epitaxy of III-V LEDs
		5.2.2 Layer Transfer Techniques of LEDs
	5.3 III-V LEDs on Van Der Waals Materials
		5.3.1 Van Der Waals Epitaxy of Thin Films and Nanostructures
		5.3.2 Remote Epitaxy of Thin Films and Nanostructures
		5.3.3 Epitaxy of LEDs on Van Der Waals Materials
		5.3.4 Layer Transfer of LEDs
	5.4 Emerging Materials-Based LEDs on Van Der Waals Materials
		5.4.1 TMDs-Based LEDs
		5.4.2 Perovskite LEDs
	5.5 Conclusion and Perspective
	References
6 Implantable LED for Optogenetics
	6.1 Introduction
	6.2 In-Vivo Optogenetics Applications
	6.3 Tools for Light Delivery
	6.4 Representative Optogenetic Studies in-Vivo
	6.5 Power Delivery Mechanisms
	6.6 Passive Wireless Battery-Free Devices
	6.7 Limitations of Passive Wireless Battery-Free Devices
	6.8 Active Wireless Battery-Free Devices for Studies of the Central Nervous System
	6.9 Active Wireless Battery-Free Devices for Peripheral Nerves
	6.10 Hybrid Devices for Other Applications
	6.11 Conclusion
	References
7 Flexible and Stretchable Micro-LED Display
	7.1 Introduction
	7.2 Flexible Micro-LED
		7.2.1 Technical Processes to Transfer Micro-LEDs
		7.2.2 Micro-LEDs on a Flexible Substrate
		7.2.3 Flexible Micro-LED Display
		7.2.4 Flexible Micro-LED for Optogenetics
	7.3 Stretchable Micro-LED Display
	7.4 Conclusion
	References