MEMS and Nanotechnology, Volume 5: Proceedings of the 2013 Annual Conference on Experimental and Applied Mechanics

Front Matter....Pages i-viii
Warpage Measurement of Simulated Electronic Packaging Assembly....Pages 1-9
Nanomechanical Characterization of Lead Free Solder Joints....Pages 11-22
In-Situ Surface Mount Process Characterization Using Digital Image Correlation....Pages 23-31
Acoustic Waveform Energy as an Interconnect Damage Indicator....Pages 33-42
Shape Optimization of Cantilevered Piezoelectric Devices....Pages 43-48
Unique Fabrication Method for Novel MEMS Micro-contact Structure....Pages 49-55
A Frequency Selective Surface Design Fabricated with Tunable RF Meta-Atoms....Pages 57-62
Stress Characterization in Si/SiO 2 Spherical Shells Used in Micro-robotics....Pages 63-71
MEMS Cantilever Sensor for Photoacoustic Detection of Terahertz Radiation....Pages 73-79
In-Plane MEMS Acoustic Emission Sensors Development and Experimental Characterization....Pages 81-87
New Insight into Pile-up in Thin Film Indentation....Pages 89-95
Mapping the Mechanical Properties of Alloyed Magnesium (AZ 61)....Pages 97-101
Temperature Dependent Micromechanical Testing on the Formation of Cu/Sn Intermetallic Thin Films....Pages 103-108
Molecular Interactions on In x Ga 1−x N....Pages 109-114
Timoshenko Beam Model for Lateral Vibration of Liquid-Phase Microcantilever-Based Sensors....Pages 115-124
Improvement in Uncertainty of Tuning Fork-Based Force Sensor Stiffness Calibration via the Indentation Method Using Direct Determination of Contact and Machine Compliance....Pages 125-128
Flexible Terahertz Metamaterials for Frequency Selective Surfaces....Pages 129-134