Handbook of Integrated Circuit Industry

Preface
Acknowledgments
Contents
About the Editors
Contributors
Spring Blossoms and Autumn Fruits: History of Compiling The Handbook of Integrated Circuit Industry
	Introduction
	A Long-Cherished Wish
	Flowering in Spring
	Sharpening Up
	Forging Ahead
	Fruits in Autumn
Section I
	Introduction
	1 Invention and Technological Progresses of Integrated Circuits
		Integrated Circuit (IC) and IC Industry
		Technology Preparation Before the Invention of ICs
		Invention and Applications of Electron Tubes and Transistors
		Invention of ICs
		Milestones of Information Acquisition, Storage, and Processing in IC Industry
		Milestones of Development in IC Materials
		Milestones in IC Manufacturing
		From Industry Age to Information Age
		Market Demand and Driving Force of Information Technology
		References
	2 Characteristics and Strategic Significance of IC Industry
		ICs and Green Economy
		ICs and Social Life and Culture
		The Value Goes to Where the Knowledge Is
		References
	3 The Development Law of the IC Industry
		Moore´s Law and Bell´s Law
		Gene´s Law, Gilder´s Law, and Metcalfe´s Law
		Development Pattern of IC Technology and Industry
		The End of Moore´s Law and the Innovations of Software
			Physical Constraints
			Power Consumption Constraints
			Economic Constraints
		References
	4 Development of World IC Industry
		Global GDP and GDP per Capita
		IC Supply Chain
		Wafer Foundry
		Evolution of IC Industrial Structure
		Revenue Change of the Top 10 World´s Semiconductor Companies (1985-2021)
		Revenue, Distribution, and Product Category of Global Semiconductor Market (1997-2021)
		World Semiconductor Council (WSC)
		Semiconductor Equipment and Materials International
		Global Semiconductor Alliance (GSA)
		International Technology Roadmap for Semiconductors
		Worldwide Major Institutions of IC Research and Development
			Interuniversity Microelectronics Center (IMEC)
			Very Large-Scale Integration (VLSI) Consortium
			Semiconductor Manufacturing Technology Research Consortium (SEMATECH)
			Semiconductor Leading Edge Technologies, Inc. (SELETE)
		Semiconductor Market Analysis
			Days Sales of Inventory
			The Annual Growth Rate of the Semiconductor Industry
			Book-to-Bill Ratio
			Semiconductor Content
		World Semiconductor Trade Statistics (WSTS)
		Worldwide Major IC Market Research and Consulting Companies
			IC Insights
			Gartner
			TrendForce
			Yole
		Perspectives of IC Science and Technology in Post-Moore Era
		References
	5 Development of Regional IC Industry
		IC Industry Development in the United States
		IC Industry Development in Europe
		IC Industry Development in Japan
		IC Industry Development in South Korea
		IC Industry Development in China
			IC Industry Development in Chinese Mainland
			IC Industry Development in Chinese Taiwan
		References
	6 Information Security in Integrated Circuits
		IC and Information Security
		Kinds of Attacks to Information Security in ICs
		Non-invasive Attack
		Invasive Attack
		Semi-invasive Attack
		Information Security Protection in Memory
			Anti-Sniffing
			Anti-Data-Remanence Analysis
			Prevention from FIA
		Information Security Protection in CPU
			Anti-FIA
			Anti-sniffing
		Defense Against SCA to the Implementation of Cryptography
		Defense Against FIA to the Implementation of Cryptography
			Fault Tolerance Technique
			Error Detection Technique
		Robustness and Information Security
		References
	7 Integrated Circuit Intellectual Property
		Silicon IP Core
		Status of IC Intellectual Property
		The Transactions, Cooperation, and Sharing of IPs
		References
	8 International Competition and Cooperation
		Customer-Owned Tooling (COT) and Foundry-Owned Tooling (FOT)
		Technology License
			IP License
			Process Licensing
		Semiconductor Corporation Merge and Acquisition
		Future Trend and Business Model of Foundry
		References
	9 Integrated Circuit Enterprise Management
		Types of IC Companies
			The Division of Industry Chain
			The Segments of Semiconductor Industry Chain
		Management Structure of IC Enterprises
		Operation Management of IC Enterprises
			The Four Aspects of IC Enterprises Operation Management
				Strategic Management
				Marketing Management
				Human Resource Management
				Financial Management
			The Fields that IC Enterprise Management Must Break Through
				Cost Management
				Supply Chain Management
				B2B Data Exchange
				Paperless Complex Business Processes
				Quality System Construction
		Production Management of IC Enterprises
			Security
			Field Production
			Production Support Business
				Employee Qualification Training, Assessment, and Certification
				Automatic Production Control
				Lean Production Promotion
				Production Planning and OTDO Control
		Asset Management of IC Enterprises
			Fixed Assets Management
			Intangible Assets Management
			Inventory Management
			Monetary Capital Management
		Information Management of IC Enterprises
			The Management IT System
			The Manufacturing IT System
			The IT Service System
			Information Security Systems
		High Output Management at Intel
			Three Core Concepts of ``High Output Management at Intel´´
			Managerial Leverage
			Increasing Managerial Output
			Concentrating on High-Leverage Activities and Ignoring the Rest
				Delegating as Leverage
				Production Principles for Time Management
			Meetings: The Medium of Management
				Category 1: Process-Oriented Meetings
				Category 2: Mission-Oriented Meetings
			Decision-Making
			Management by Objectives and Key Results (OKRs)
		References
	10 Talent Cultivation
		Development of Modern Science Education
		Training of IC Talents
		Talent Needs of Semiconductor Industry
		References
Section II
	Introduction
	11 Development and Classification of IC
		Overview of the Development of IC Products
			IC Products in the Mainframe Era
			IC Products in the Era of PC and Internet
			IC Products in the Era of Mobile Phones and Mobile Internet
			IC Products in the Era of Smart Terminals and IoT
		Classification of IC Products
		Function and Structure of ICs
		References
	12 Classification of IC Products by Manufacturing Processes
		IC Manufacturing Processes and Products
		Bipolar Junction Transistor ICs
		Planar CMOS ICs
		Double-Diffused Metal Oxide Semiconductor ICs
		Bipolar Complementary Metal Oxide Semiconductor ICs
		Bipolar Complementary Double-Diffused Metal Oxide Semiconductor ICs
		Fin Field-Effect Transistor ICs
		Silicon-on-Insulator IC
		Gallium Arsenide Devices and ICs
		Indium Phosphide Devices and ICs
		Gallium Nitride Devices and ICs
		Silicon Carbide Devices and ICs
		Heterojunction Bipolar Transistor (HBT)
		System in Package IC
		Micro/Nano-Electro-Mechanical System and IC
		IC Products of Other Advanced Processes
		References
	13 Products of Digital Integrated Circuit
		Digital Integrated Circuit
		Static Random Access Memory (SRAM)
		Dynamic Random Access Memory (DRAM)
		Double Data Rate (DDR) SDRAM
		Low-Power Double Data Rate SDRAM
		Graphics Double Data Rate SDRAM (GDDR SDRAM)
		OTP and MTP Memories
			One-Time Programmable Memory
			Multi-Time Programmable Memory
		Flash Memory
		Solid-State Drive
		Multimedia Card and Embedded MMC
		Multi-Chip Package Memory and eMCP Memory
		X86 Processors
		IA-64 Processors
		POWER Family Processors
		MIPS Processors
		ARM Processors
		UltraSPARC Processor
		C-SKY Processors
		Graphics Processing Unit (GPU)
		Microcontroller Unit
		Digital Signal Processor
		RISC-V ISA and RISC-V Processors
		Field Programmable Gate Array
		Application-Specific Integrated Circuit and System on Chip
		Network Processor Unit
		Secure Cryptoprocessor and Cryptographic Processor
		Advanced Processors
		References
	14 Analog and Mixed-Signal IC Products
		Analog IC
		Analog-to-Digital Converter (ADC)
		Digital-to-Analog Converter (DAC)
		Comparator
		Operational Amplifier
		Instrumentation Amplifier
		Specialty Amplifier
		Power Management IC
		AC/DC Converter
		DC-DC Converter
		Switching Power Supply Controller
		Low Dropout Regulator (LDO)
		Light-Emitting Diode Driver
		Liquid Crystal Display Driver
		Motor Controller
		Serializer/Deserializer
		Serial Communication and Universal Serial Bus Interfaces
		Ethernet Interface IC
		Interface for Standard-Definition Television and High-Definition Television
		High-Definition Multimedia Interface IC
		Advanced Technology Attachment Interface
		DDR SDRAM Interface
		Protocol Converter IC
		Controller Area Network Bus
		Inter-Integrated Circuit Bus
		High-Frequency Tuner
		Digital Video Broadcasting Modulation/Demodulation
		Mobile Communication IC
		Audio Codec IC
		Video Codec
		Power Line Communication (PLC)
		Digital Subscriber Line (DSL)
		Passive Optical Network and Cable Modem
		References
	15 Radio Frequency IC Products
		RF and Microwave IC Products
		Radio Frequency Power Amplifier
		Low-Noise Amplifier
		RF Mixer
		RF Oscillator
		RF Duplexer
		RF Filter
		Microwave Devices
		Millimeter Wave Devices
		Terahertz Devices
		Radio (Receiver) Integrated Circuit
		Navigation Receiver IC
		Wireless Fidelity Products
		Bluetooth Products
		ZigBee Products
		Radio Frequency Identification Products
		References
	16 Products of Power Devices
		Power Devices
		Power Diode
			PiN Diode
			Unipolar Schottky Diode
		Fast Recovery Diode (FRD)
		Thyristor
		Power BJT
		Power MOSFET
		Insulated Gate Bipolar Transistor
		Wide-Bandgap Semiconductor Devices
		Superjunction Thyristor
		Gate Turn-Off Thyristor
		Integrated Gate-Commutated Thyristor
		Emitter Turn-Off Thyristor
		MOS-Controlled Thyristor
		References
	17 Products of Optoelectronic Devices
		Optoelectronic Devices
		Photodiodes
		Avalanche Photodiode
		Light-Emitting Diode
		Organic Light-Emitting Diode
		Active Matrix Organic Light-Emitting Diode
		Micro Light-Emitting Diode
		Quantum Dot Light-Emitting Diode
		Thin-Film Transistor
		Laser Diode
		Photomultiplier Tube (PMT)
		Infrared Devices
		Optical Communication Devices
		References
	18 Products of Sensors and MEMS
		Sensors and MEMS Devices
		Resistance Sensor
		Capacitance Sensor
		Inductance Sensor
		Piezoelectric Sensor
		Temperature Sensor
		Hall Effect Sensor
		Pressure Sensor
		MEMS Inertial Sensor
		RF MEMS Switch
		Microfluidics
		MEMS Magnetic Sensor
		Infrared Sensor
		Charge-Coupled Device (CCD)
		CMOS Image Sensor
		Fingerprint Recognition Chip
		Touch Controller IC
		Bio-MEMS IC
		References
	19 Applications of IC Products in Consumer, Computer, and Communication Electronics
		Electronic Games and Toys
		Home Appliances
		Consumer Electronics
		Smart Card
		Application in Internet of Things
		Smart Home
		Smart City
		Personal Computer, Desktop, and Their Peripherals
		Supercomputers
		Mobile Phone
		Data Center
		Networking and Communication Equipment
		Telecommunication Core Network and Access Network
		Unified Communication
		References
	20 Applications of IC Products in Automotive, Industrial, and Medical Equipment
		In-Vehicle Infotainment
		Body Control Module
		Powertrain Control Module
		Automotive Active Safety System
		New Energy Vehicles
		Advanced Driver-Assistance System (ADAS)
		Rail Transit System
		Smart Grid
		Application of New Energy Sources
		Medical Imaging Equipment
		Medical Electronic Equipment
		Medical Monitoring Equipment
		Medical Electronic Devices
		Implanted Medical Electronic Devices
		Medical Robot
		References
	21 Applications of IC Products in Aero-Mil
		Radar
		Aircraft Flight Control
		Applications of ICs in Satellites
		Military Communications
		Electronic Warfare IC
		Missile Guidance and Control Systems
		Infrared Night Vision
		Avionics Instruments
		Airborne Early Warning Aircraft
		Environmental Cognitive Sensors in Smart Robots
		Robot Network Communication System
		Intelligent Manufacturing Systems
		Unmanned Aerial Vehicle System
		Binocular Vision System
		Virtual Reality/Augmented Reality/Mixed Reality
		AI System
		References
Section III
	Introduction
	22 Economic and Financial Theories Related to IC Industry
		IC Industry and Macroeconomy
		Effect of Scale Economies in the IC Industry
		Economic View of Moore´s Law
		Scope Economy and Industrial Cluster in IC Industry
		Blue Ocean and Red Ocean of IC Industry
		Globalization and Open Market for IC Industry
		Global Value Chain and Smiling Curve of IC Industry
		Life Cycle of IC Products
		Longtail Effect and Customized Products in IC Industry
		Equity Valuation Model of IC Enterprises
		Principal-Agent System in IC Enterprise Management
		Capital Structure of IC Enterprises
		References
	23 Development Law and Development Index of IC Industry
		Developing Trend of IC Industry
		Business Characteristics of Memory IC Industry
		Government Policies and IC Industry Development
		Investment and Growth of IC Industry
		Technomic Factors for IC Industry Evolution
		Changes in Total Investment and Market Scale of Worldwide Semiconductor Industry
		CAPEX and R&D Expense of IC Industry
		Entry Barriers of IC Industry
		Regional Migration of IC Industry
		IC Industry Investment and Industrial Ecology Development
		Relationship Between Investment and Technology Advancement in IC Industry
		Cost Structure Analysis of IC Products
		Production Scale Optimization for IC Manufacturing Industry
		Profit and Loss Characteristics of IC Manufacturing Industry
		Shareholder Structure of IC Foundry
		Prosperity Indicators of Statistics for IC Industry
		Prosperity Indicators of Securities for IC Industry
		References
	24 Financial Management Practice and Analysis of Enterprises
		Financial Statements and Analysis Methods
			Balance Sheet
			Income Statement
			Cash Flow Statement
		Capital Expenditure
		Shipment
		Market Share
		Product Category
		Gross Margin Rate
		Depreciation
		EBITDA
		Other Financial Indexes
		Price-to-Earnings Ratio
		Goodwill
		Equity Incentive
		References
	25 Investment and Financing of IC Industry
		Venture Capital and Private Equity
		Major Financing Sources for IC Companies
		Financing Sources for IC Manufacturing
		Investment Methods of Industry Funds
		China Integrated Circuit Investment Fund and Sino IC Capital
		Government Investment Funds on IC
		International IC R&D Investment
		Mergers and Acquisitions in IC Industry
		IPO and Going Private
		Procedure of Venture Investment for IC Companies
		Due Diligence in IC Enterprises
		Asset Evaluation of IC Enterprises
		References
Section IV
	Introduction
	26 Development History of IC Production Lines
		History of IC Production Lines
		History of IC Production Lines in China
		References
	27 Location and Environmental Impact Assessment of IC Production Lines
		Guidelines for Selecting Locations for IC Production Plants
		Environmental Evaluation of Air
		Environmental Evaluation of Surface Water
		Environmental Evaluation of Ground Water
		Environmental Evaluation of Noise
		Environmental Evaluation of Soil
		Environment Risk Assessment
		Environmental Assessment Factors
		Analysis of Contamination in IC Production Line
		Contaminant and Treatment in IC Production Lines
		References
	28 Designing IC Production Lines
		Technology Considerations
		Investment and Expenses
		Buildings and Structures
		Green Plant Design
		Automated Material Handling Systems (AMHS)
		Water Supply and Drainage Systems
		Fire Safety System
		Power Systems
		Ultrapure Water System
		Wastewater Treatment System
		Facility Monitoring and Control Systems (FMCS)
		Hook-Up System
		References
	29 Clean Room and Air Conditioning Systems
		Clean Room System
		Air Conditioning Systems
		Circulating and Cooling Water System
		Vacuum System
		Exhaust System
		References
	30 Central Gas and Chemical Supply Systems
		Bulk Gas Systems
		Special Gas Systems
		Chemical Supply Systems
		References
	31 Construction and Management of IC Production Lines
		Organization and Responsibility
		Project Planning and Design
		Project Bidding Procedure
		Government Approval
		Construction Management
		Contract Management
		Schedule Control
		Quality Inspection (QI) and Quality Assurance (QA)
		Utilities Equipment Space Management
		Construction Safety Management
		Monitoring of Central Supply System
		References
	32 Hazardous Chemicals Management
		Procurement
		Transportation
		Storage
		Usage
		Disposal
		References
	33 Energy Savings and Development Trends
		Energy Consumption
		Main Measures for Saving Energy and Reducing Consumption
		Current Status and Development Direction
		Development Status and Opportunity in China
		References
Section V
	Introduction
	34 Overview of IC Design
		Overview of Global IC Design
		Overview of IC Design in China
		Supporting Role of IC Design to System
		Design and Technology Co-Optimization (DTCO)
		References
	35 Basics of Integrated Circuit Design
		Design Specifications
		Design Flow
			Digital IC Design Flow
			Analog IC Design Flow
			Process Design Kit
			Customer-Owned Tooling
			Standard Cell Library
			Circuit Schematics
			Input/Output Cells
			IC Clock
			Leakage Current
			Power Consumption
			Design Simulation
			Functional Verification
			Placement and Routing
			Physical Verification
			Layout
			Tape-out
			Electrostatic Discharge Protection Design
		References
	36 Digital Integrated Circuit Design
		Digital IC
		Hardware Description Language (HDL)
		Circuit Partitioning
		Floor Planning and Placement
		High-Level Synthesis
		Logic Synthesis
		Timing Analysis
		Formal Verification
		Design for Testability
		Hardware Emulation
		References
	37 Analog Integrated Circuit Design
		Analog IC
		Operation Amplifier Design
		Bandgap Reference Design
		Filter Design
		Analog-to-Digital Convertor
		Characteristic Parameters of Analog-to-Digital Converter
		Analog-to-Digital Converter Design
		Characteristic Parameters of Digital-to-Analog Converter
		Digital-to-Analog Converter Design
		References
	38 RF Integrated Circuit Design
		Radio Frequency Integrated Circuit (RFIC)
		Microwave and Millimeter Wave Integrated Circuit
		Software Defined Radio (SDR)
		Radio Frequency Transceiver Design
		Low Noise Amplifier (LNA) Design
		Mixer Design
		Frequency Synthesizer Design
		Radio Frequency Power Amplifier (RF PA) Design
		Radio Frequency Switch Design
		Digital Radio Frequency Integrated Circuit (RFIC) Design
		References
	39 Power Integrated Circuit
		Power Device and BCD Process
		Smart Power Integrated Circuit (SPIC)
		Power Management Integrated Circuits (PMIC)
		Energy Harvesting and Transformation Control
		AC/DC Converter and Driver
		DC/DC Converter and Driver
		References
	40 Design of Processors
		Processors
		Instruction Set Architecture (ISA)
		Datapath
		Control Logic
		Coprocessor
		Data Processing Pipeline
		Multiple Instruction Issue
		Single Instruction Multiple Data (SIMD)
		Multithreading
		Multicore
		Manycore Processors
		Memory Hierarchy
		Digital Signal Processor (DSP)
		Graphics Processing Unit (GPU)
		Further Reading
	41 Memory Design
		Memory Categories
		Memory Cell and Periphery Circuit
		Memory Controller
		SRAM
		DRAM
		Flash Memory
		3D NAND Flash Memory
		FeRAM
		STT-MRAM
		ReRAM
		PCRAM
		Further Reading
	42 SoC Design
		System-on-Chip (SoC)
		Intellectual Property Core (IP Core)
		Embedded Processor
		System Bus
		Peripheral IP Core
		Interrupt Controller
		Driver
		Hardware/Software Codesign
		Security Enhancement Design
		IC Design for Artificial Intelligence
		References
	43 Programmable Logic Circuit Design
		Programmable Logic
		Field-Programmable Gate Array
		Electrically Programmable Logic Device
		Programmable System-on-Chip
		Reconfigurable Computing Chip
		References
	44 Electronic Design Automation Tools
		IC Design Automation
		Flow Management Tool
		System Level Simulator
		Schematic Capture Tool
		Circuit Simulator
			Analog Circuit Simulator
			Digital Circuit Simulator
			Analog/Digital Mixed-Circuit Simulator
		Logic Synthesis Tool
		Formal Verification Tool
		Design for Testability Tool
			Auto Generation of Test Circuit
			Automatic Generation and Optimization of Testing Vector
		Physical Design Tool
		Parasitic Extraction
			Accurate Computation Method
			Fast Modeling Method
		Layout Verification Tool
			Design Rule Check
			Layout vs Schematic (LVS)
			Electrical Rule Check (ERC)
			Layout vs Layout (LVL)
		Timing and Power Analysis Tool
			Static Timing Analysis (STA)
			Dynamic Timing Analysis (DTA)
			Power Analysis Tool
		Design for Manufacturing (DFM)
		Design for Yield
		Design for Reliability
		References
Section VI
	Introduction
	45 The Evolution of IC Manufacturing Technology
		Moore´s Law and Technology Scaling
		Process of Post Moore´s Law Era
		Technology Roadmap
		FEOL, MOL, and BEOL
		References
	46 Silicon-Based Integrated Circuits
		Bipolar Junction Transistor (BJT)
		MOSFET
		Fin Field Effect Transistor (FinFET)
		Fully Depleted SOI (FD-SOI)
		Super Junction
		Laterally Diffused MOSFET(LDMOS)
		Integrated Passive Devices (IPD)
			Integrated Resistors
			Integrated Capacitors
			Integrated Inductors
			Interconnections
		References
	47 Compound Semiconductor Device and IC
		Compound Semiconductor Power Devices and Integration
			SiC Integrated Circuits
			GaN Integrated Circuits
		High Mobility Channel ICs
			III-V CMOS
			Tunneling FET
			2D Material for Channel
		Si Photonics ICs
			Waveguides
			Photodetectors, Modulators, and Lasers
		Radio Frequency Integrated Circuits (RFICs)
		Microwave Monolithic Integrated Circuits (MMIC)
			Si-MMIC
			GaAs-MMIC
			SiGe
			GaN
			InP
			Graphene
		References
	48 Micro Electro-Mechanical Systems (MEMS)
		Wet Etching
		Dry Etching
		Sacrificial Layer Technology
		Bonding Technology
			Electrostatic Bonding Technology
			Thermal Bonding Technology
		Cavity-Silicon on Insulator (Cavity-SOI)
		MEMS and CMOS Integration
			Pre-CMOS/MEMS Technology
			Intra-CMOS/MEMS Technology
			Post-CMOS/MEMS Technology
		References
	49 Unit Processes
		Photolithography (Lithography)
		Phase-Shift Mask (PSM)
		Immersion Lithography
		Extreme UV (EUV)
		Computational Lithography
			Physical Simulation of Photolithography Imaging
			Optical Proximity Correction (OPC) Technology
			The Source-Mask Optimization (SMO) Technique
		Oxidation Process
		Diffusion Processes
		Ion Implantation
		Plasma Doping
		Thermal Annealing
		Physical Vapor Deposition and Sputtering
		Chemical Vapor Deposition
		Atom Layer Deposition (ALD)
		Chemical Mechanical Polishing
		Epitaxy
			Solid Phase Epitaxy
			Gas Phase Epitaxy
		Dry Etching and Cleaning
		Wet Etching and Cleaning
		References
	50 Module Processes
		Twin-Well or Dual Well
		Isolation
		Channel Process
		Polysilicon Gate
		High-κ Metal Gate
		Silicidation
		Contact Process
		Al/Cu Interconnect and Dual Damascene
		Double Patterning Technology (DPT)
		Strained Silicon (Compressive/Tensile Stresses)
		Embedded Source and Drain Selective Epitaxy
		References
	51 Integration
		Frontend-of-Line (FEOL) Integration Flow
			Shallow Trench Isolation (STI)
			Dual-Well and Deep n-Well Formation
			Gate-Oxide and Poly-Gate Formation
			Off-Set Spacer and n/p LDD Formation
			Main Spacer and n+/p+ Source/Drain Formation
			SiGe Epi for p-MOS S/D
			Stress Memorization (SMT) for n-MOS
		Middle-of-Line (MOL) Integration Flow
			Self-Aligned Silicide Formation
			High-k Dielectric and Replacement Gate (RMG) Formation
			Contact and W-Plug Formation
		Back-End-of-Line (BEOL) Integration Flow
			Metal-1 Formation (Single Damascene)
			Dual Damascene and Multi-interconnection
		CMOS Integration Technology
			CMOS Integration Flow
			Planar CMOS Integration Flow with HKMG [4]
			FinFET Integration [5]
		Non-volatile Memory (NVM) Integration
			Floating-Gate Flash Memory Integration Flow
			Phase Change RAM (PCRAM) Integration
			Resistive RAM (RRAM) Integration
			Magnetic RAM (MRAM) Integration [7]
		3D NAND Integration
		Dynamic RAM (DRAM) Integration
		Design-Technology Co-optimization (DTCO)
		References
	52 Types of Integrated Circuit Corporations
		Integrated Device Manufacturer (IDM)
		Fabless Design Houses [1, 2]
		Module Manufacturers
		Memory Manufacturers
		Wafer Foundry
		IP Design and Service
		Outsourced Semiconductor Assembly and Test (OSAT)
		Photomask Manufacturer
		Semiconductor Equipment Manufacturers
		Semiconductor Material Manufacturers
			Wafer Substrates Vendors
			Photoresist Vendors
			Semiconductor Assembly/Packaging Materials
		Electronic Design Automation (EDA) Companies
		Distributors and Sales Representatives
		References
	53 Management and Modes of IC Manufacturing Enterprises
		Organizational Structure
			Production Groups
			Collaboration Groups
			Administration Groups
		Strategy Management
			Strategy Management of the IDM Enterprises
			Strategy Management of the Foundry Enterprises
		Planning Management
		Technology Management
			Module Management
			Product Management
		Quality Management
			Chip Development
			Chip Production
			Clean Room Control
			Standard
		Marketing and Sales Management
		Cleanroom Management
			Dustproof Management
			Temperature/Humidity Management
			Anti-Static Management
		Materiel Management and Control
			Material Control Management
			Inventory Management
		Equipment Management
			The Equipment Inspection
			The Equipment Maintenance
			Equipment Repair
			Preventative Maintenance
			Equipment Maintenance Management
		Waste Material Treatment Management
		Environmental Protection Management
		Safety Management
		Information Security Management
		References
Section VII
	Introduction
	54 Development of Packaging and Testing Industry
		Developing of Global PT Industry
		The Status and Characteristics of PT Industry in China
		The Collaborative Innovation of PT Industry Chain in China
		Main Business Model of Global PT Industry
		The PT Business of Major Global IDMs
			IBM Microelectronics
			Intel
			Samsung Electronics
		Semiconductor PT Research Institutes in China
			Universities
			Research Institutes
		References
	55 Integrated Circuit Package Types
		Definition and Function of Conventional Packaging
			Definition
			Effect
			Function
			Classification
			Grading
		Progresses of Major Package Types
		Conventional Packaging
			Single-Inline Package (SIP)
			Dual-Inline Package (DIP)
			Small-Outline Package (SOP)
			Small-Outline Transistor (SOT)
			Transistor Outline (TO)
		Advanced Packaging
		Through-Hole and Surface-Mount Packages
			Through-Hole Packages (THP)
			Surface-Mount Package (SMP)
		Quad Flat Packages
			Quad Flat Package (QFP)
			Quad Flat No-Lead (QFN)
			Characteristics of QFP and QFN
			Applications
		Organic Substrate Packaging
		Wafer Level Packaging (WLP)
		System-in-Package (SiP)
		Microsystem Packaging (MSP)
		Multi-chip Modules (MCM)
		Embedded Packaging
		Three-Dimensional Packaging
		Chip-on-Board (COB) Packaging
		Substrate Packaging
			Ceramic Substrate
			Organic Substrate
			Glass Substrate
		Classification of Packaging
			Plastic Packaging
			Metal Packaging
			Ceramic Packaging
			Glass Packaging
		Package Interconnects
			Wire Bonding (WB)
			Tape Automated Bonding (TAB) [7]
			Flip-chip Bonding
		Lead Frame Package
		Hermetic Package and Non-hermetic Package
			Hermetic Packages
			Non-hermetic Package
		Package Type Selection
		References
	56 Key Technologies and Processes for Traditional Packaging
		Wafer Thinning Process
			Mechanical Grinding
			Dry Etching
			Wet Etching
		Wafer Dicing Process
		Die-Attach Process
		Wire Bonding (WB) Process
		Molding Process
		Plating
		SOP Process
		QFN Process
		Wire Bond BGA Process
			Back Grind
			Die Saw
			Die-Attach
			Plasma Cleaning
			Wire Bonding
			Molding
			Post Curing
			Marking
			Reballing
			Cut & Sort
		Technology and Processing of Metal Packaging
			Assembly
			Wire Bonding
			Sealing
			Marking
			Leak Detection
		Ceramic Packaging Process
			Sealing
			Leak Detection [7]
			Plant Column
		References
	57 Process and Key Technology of Typical Advanced Packaging
		Bumping Process and Technology
		Flip-Chip Process and Technology
		Flip-Chip BGA Process and Technology
			Wafer Grinding
			Flip-Chip
			Underfill
		Flip-Chip Chip-Scale Package (FC-CSP) Process and Technology
		Package-on-Package (PoP) Process and Technology
		Wafer-Level Chip-Scale-Package (WL-CSP) Process and Technology
		Fan-Out Wafer-Level Package (FO-WLP) Process Flow and Technology
		Through-Si-Via (TSV) Technology
		3D Package Process Flow and Technology
			Chip-Stacked 3D Packages
			Hybrid 3D Packages
		Panel-Level Embedded Assembly Process Flow and Technology
		System-in-Package (SiP) Process Flow and Technology
		References
	58 Design Technologies for Advanced Packaging
		Typical Advanced Packaging Selection and Design Essentials
			SiP Technology
			2.5D Packaging
			Wafer-Level Packaging
			Package-on-Package (PoP) Technology
		Chip-Package-PCB Codesign
			Electrical Codesign of Chip-Package-PCB
			Heat Dissipation Codesign of Chip-Package-PCB
			Thermal-Mechanical Reliability Codesign of Chip-Package-PCB
		Electrical Considerations for Package Design
			Signal Integrity (SI)
			Power Integrity (PI)
			Power Dissipation and Power Capacity
		Thermal Design of Electronic Package
			Metrics of Thermal Design of Traditional Packages
			Demands of Thermal Design
			Thermal Design of Internal Heat Conduction Resistance in Package
			Thermal Design of External Heat Sink in Package
		General Rules for Packaging Material Selection and Structure Design
		Electro-Thermo-Mechanical Multiphysics Design [9, 10]
		DFM/DFR/DFT Codesign
			Design for Manufacture (DFM) [11, 12]
			Design for Reliability (DFR) [13, 14]
			Design for Test (DFT) [15, 16]
		The Design and Simulation Flow for IC Packages
			System Function Analysis
			Device Selection
			Selection of the Package Type
			Structure Design
			Layout Design
			Verification of the Key Process
			Product Manufacture and System Testing
		Current Status and Development Trend of Design and Simulation Tools
			Package Layout Design Tools
			Package Electrical Simulation Tool
			Package Thermal Management Simulation Tool
			Package Mechanical and Process Simulation Tools
			Developing Trend of Packaging Multiphysical Field Tools
		Codevelopment of SiP and SoC
		References
	59 Integrated Circuit Testing Technology
		Definition of IC Testing
		Digital IC Testing
		Analog IC Testing
		Mixed-Signal IC Testing
		Memory IC Testing
		High Speed IC Testing
		RF IC Testing
		Programmable Device Testing
		SoC Testing
		IoT/MEMS Chip Testing
		Optimization of Testing Cost
		Fault Models
			Common Fault Model for Digital Logic
			Common Fault Model for Memories
		Design-for-Testability (DFT)
		Management of Testing Data
		Test Platforms
		References
	60 Integrated Circuits Packaging Reliability
		Definition of IC Package Reliability
		Reliability Design of Integrated Circuit Package
			Design Principles for Packaging Reliability
			Design Methods for Package Reliability
			Structural Design for Package Reliability
			Thermal Design for Package Reliability
			Environment Resistance Design for Package Reliability
			Manufacturability Design for Packaging Reliability
		Reliability Testing for IC
			Classification of Reliability Tests for ICs
			The Function of Reliability Tests for ICs
		Standards for Reliability Testing of ICs
			National Standards of China
			International, Inducing, and Other Foreign Standards
		Package Reliability Test Procedures for ICs
			Package Reliability Screening Test Procedures
			Package Reliability Quality Consistency Procedures
		Failure Analysis Methods for IC Packages
			Nondestructive FA Methods
			Destructive FA Methods
		Procedure of FA for IC Packages
		Typical Failure Modes and Classification of IC Packages
			Typical Failure Modes of Monolithic IC Packages
			Typical Failure Modes of Hybrid IC Packages
			Failure Classification of IC Packages
		Failure Mechanisms of IC Packages
			Failure Mechanism of Electrical Stress
			Temperature-Mechanical Stress Failure Mechanism
			Failure Mechanism of Climatic and Environmental Stress
			Failure Mechanism of Radiation Stress
		Simulation Analysis of Package Reliability of ICs
			The Reliability Test Methods
			The Reliability Simulation Methods
		References
	61 Standardization of Integrated Circuits Packaging
		International Packaging Standardization Organizations
			International Electro-Technical Commission (IEC) [1, 2]
			Semiconductor Equipment and Materials International (SEMI) [3]
			Association Connecting Electronics Industries (IPC)
			Joint Electronic Devices Engineering Council (JEDEC) [7, 8]
		China Packaging Standardization Organizations
		Standardization of Package Outlines and Package Naming
		National Standards for IC Packaging
		China´s National Military Standard (GJB) and US Military Standards
		Joint Electronic Device Engineering Council (JEDEC) Standards
		Association Connecting Electronics Industries (IPC) Standards
		Automotive Electronics Council (AFC)-Q100 Standards [11, 12]
		References
Section VIII
	Introduction
	62 The Development of the IC Equipment Industry
		The Development of International IC Equipment Industry
			Development of the Global Semiconductor Equipment Market
			Overview of Major Global Semiconductor Equipment Suppliers
		Development Characteristics of the Worldwide IC Equipment Industry
			Overview and Characteristics of the Semiconductor Equipment Industry in the United States
			Overview and Characteristics of the Semiconductor Equipment Industry in Europe
			Overview and Characteristics of the Semiconductor Equipment Industry in Japan
			Overview and Characteristics of the Semiconductor Equipment Industry in the Republic of Korea
		The Development Phases of IC Industry in China
			``Self-Reliant´´ Entrepreneurship (1956-1979)
			Exploration and Development with ``Introduction and Transformation´´ (1980-1999)
			Rapid Pursuit with ``Strategic Adjustment and Policy Support´´ (2000-present)
		The Development Status of the IC Equipment Industry in China
			Overview of the Chinese IC Equipment Market
			Recent Development of Chinese IC Equipment
			A Few Thoughts on the Chinese IC Equipment Industry
		References
	63 Manufacturing Equipment for Silicon Wafer
		Overview of Manufacturing Equipment for Si Wafers
		Single Crystal (Czochralski) Growth Furnace
		Float Zone Crystal Growth Furnace
		Ingot Grinding Machines
		Slicing Machines
		Silicon Wafer Annealing Furnaces
		Edge Rounding Machines
		Lapping Machines
		Wafer Etching Machines
		Polishers
		Double-Side Grinders
		Single-Side Grinders
		Edge Polishers
		Double-Side Polishers
		Single-Side Polishers
		Final Cleaning Machines
		References
	64 Mask Manufacturing Equipment
		The Development and Prospect of Photomask Manufacturing Equipment
		Overview of Photomask Manufacturing Equipment
		Photomask Inspection Equipment
		Laser Differential Confocal Microscope, LDCM
		Photomask CD Measurement System
		Inspection System for Photomask Defects and Contamination
		Automatic Photomask Inspection System
		Photomask Repair System
		Optical Pattern Generator
		Photo-Repeater
		Laser Direct Writing System
		DMD-Based Laser Photomask Direct Writing System
		Electron Beam System for Photomask-Making
		Electron Beam Projection Lithography System for Photomask-Making (EBPLS for Photomask-Making)
		Resist Processing and Cleaning Equipment for Photomask-Making
		Photoresist Coater for Photomask-Making
		Photoresist Stripper
		Photomask Duplicator (Photomask Copier)
		Photomask Wet Etching Equipment
		Photomask Dry Etching Equipment
		Pellicle Mounting Instrument
		Photomask Pattern Data Processing System
		References
	65 Lithography Equipment
		Introduction
		History of Photolithography Equipment
		Contact/Proximity Aligner
		The Wafer Stepper
		Wafer Scanner
		Immersion Scanner
		Extreme Ultraviolet (EUV) Lithography System
		Maskless Lithography (ML2) System
		Electron Beam Lithography (EBL) System
		Nano-Electron Beam Direct Writing System
			Proximity Effect Correction Technique for Electron Beam Lithography
			Mix-and-Match Lithography
			Processes of Nanometer Fabrication by Electron Beam
		Multiple Electron Beam Lithography System
		Nanoimprint Equipment
		Wafer Track
			Coating Subsystem
			Developing Subsystem
			Baking Subsystem
		Wet Stripping System
		References
	66 Diffusion and Ion Implantation Equipment
		Introduction to Diffusion and Ion Implantation Equipment
		Horizontal Diffusion Furnace
		Vertical Diffusion Furnace
		Annealing Furnace
		High-Pressure Oxidation Furnace
		Medium-Current Ion Implanter
		High-Current Ion Implanter
		High-Energy Ion Implanter
		Rapid Thermal Processing (RTP) System
		References
	67 Thin Film Growth Equipment
		Principles of Thin Film Growth and Equipment
		Physical Vapor Deposition (PVD) Equipment
		Chemical Vapor Deposition (CVD) and Epitaxy Equipment
		Vacuum Evaporator
		Direct Current Physical Vapor Deposition (DCPVD) System
		Radio Frequency Physical Vapor Deposition (RFPVD) System
		Magnetron Physical Vapor Deposition (Magnetron-PVD) System
		Ionized Physical Vapor Deposition (Ionized-PVD) System
		Atmospheric Pressure Chemical Vapor Deposition (APCVD) System
		Low-Pressure Chemical Vapor Deposition (LPCVD) System
		Plasma-Enhanced Chemical Vapor Deposition (PECVD) System
		High-Density Plasma Chemical Vapor Deposition (HDP-CVD) System
		Metal Chemical Vapor Deposition (Metal-CVD) System
		Atomic Layer Deposition System
		Photo Chemical Vapor Deposition (Photo-CVD)
		Laser-Assisted Chemical Vapor Deposition (LA-CVD)
		Electron Cyclotron Resonance CVD (ECR-CVD) System
		Metal Organic Chemical Vapor Deposition (MOCVD) System
		Molecular Beam Epitaxy System
		Vapor Phase Epitaxy (VPE) System
		Liquid Phase Epitaxy (LPE) System
		Chemical Beam Epitaxy (CBE) System
		Ion Beam Epitaxy (IBE) System
		Low-Energy Ion Beam Epitaxy (LE-IBE) System
		Spin Coater
		References
	68 Plasma Etch Equipment
		Introduction to Principles of Plasma Etching and Equipment
		Types of Plasma Etching Equipment
		Plasma Etching Equipment Application and Outlook
		Ion Beam Etching (IBE) Equipment
		Plasma Etching Equipment
		Reactive Ion Etching (RIE) Equipment
		Magnetically Enhanced Reactive Ion Etching (MERIE) Equipment
		Capacitively Coupled Plasma (CCP) Etching Equipment
		Inductively Coupled Plasma (ICP) Etching Equipment
		Electron Cyclotron Resonance (ECR) Plasma Etching Equipment
		Helicon Wave Plasma (HWP) Etching Equipment
		Surface Wave Plasma (SWP) Etching Equipment
		Atomic Layer Etching (ALE) Equipment
		Plasma Stripping Equipment
		Dry Cleaning Equipment
		Plasma Etching Equipment Platforms
		Materials Used for Chamber Parts in Plasma Etching Equipment
		The Electrostatic Chuck (ESC) in Plasma Etching Equipment
		References
	69 Wet Cleaning Equipment
		Overview of Wet Processing and Wet Equipment
		Bench-Type Wet Cleaning System
		Bench-Type Wet Etcher
		Single-Wafer Cleaning Equipment
		Single-Wafer Cleaning System
			Nanospray Cleaning [6, 7]
			Megasonic Cleaning
		Single-Wafer Scrubber
		Single-Wafer Wet Etcher
		Single-Bath Wafer Cleaner
		Cryogenic-Aerosol Wafer Cleaner [11, 12]
		Chemical Mechanical Polisher (CMP)
		Stress-Free Polish Equipment
		Copper Electrochemical Plating (Cu-ECP) Equipment [13]
		References
	70 Metrology and Inspection Equipment
		Metrology and Inspection Equipment: Roles and Categories
		Overlay Metrology Equipment
		Critical Dimension Scanning Electron Microscope (CD-SEM)
			Operation Principle of CD-SEM
			Application of CD-SEM in IC Manufacture
			New Challenges for CD-SEM by the Development of Semiconductor Manufacture Process
		Optical Thin Film Metrology Equipment
		Optical Critical Dimension (OCD) Measurement Equipment
		Defect Inspection Equipment of Bright Field Optical Microscope for Patterned Wafer
		Defect Inspection Equipment of Dark Field Optical Microscope for Patterned Wafer
		Unpatterned Wafer Surface Inspection Tool
		Macrodefect Inspection Tool
		Electron Beam Wafer Defect Inspection Equipment (EBI)
		Defect-Review Scanning Electron Microscope
		X-Ray Metrology Equipment
			X-Ray Fluorescence Spectroscopy (XRF)
			X-Ray Diffraction and Reflectometry (XRD/XRR)
		Atomic Force Microscope (AFM)
			Contact Mode
			Noncontact Mode
			Tapping Mode
		Focused Ion Beam (FIB) Microscope
		Fourier Transform Infrared (FTIR) Spectrometer
		Film Stress Measurement Tool
			Curvature Method
			X-Ray Diffraction Method
		Four-Point Probe
		Surface Profiler
		References
	71 Packaging and Assembly Equipment
		Overview of Processes and Equipment for Assembly and Packaging
		Wafer Grinders
		Dicing Saws
		Laser Saw
		Temporary Bonding/Debonding Systems
		Wafer Bonders
		Wafer Bumping Equipment
		Die Bonders
		Wire Bonders
		Flip-Chip Bonders
		Flux Cleaning Equipment
		Reflow Ovens
		Molding Machines
		Electroplating and Wave Soldering Systems
		Cropping Machine
		Laser Marking Machines
		References
	72 Main Common Parts
		Equipment Front-End Module (EFEM)
		Robotic Manipulator
		Mass Flow Controller (MFC)
		RF Generator
		Local Scrubber
		Dry Pump
		Cryopump
		Turbo Pump
		Chiller
		Valves
		Gas Panel
		Electrostatic Chuck (E-Chuck)
		Process Chamber Showerhead
		Reaction Chamber
		References
	73 Integrated Circuit-Testing Equipment
		Overview of IC Testing Equipment
		Logic IC Test System
		Memory IC Test System
		SoC Test System
		Analog/Mixed-Signal IC Test System
		RF IC Test System
		Customized Test Equipment
		Test Instrument
		References
Section IX
	74 Silicon Materials
		Requirements of Si Materials for ICs
		High-Purity Polycrystalline Silicon
		Monocrystalline Silicon
		Amorphous Silicon Thin Film
		Nano-Silicon Materials
		Monocrystalline Si Epitaxial Films
		Silicon-on-Insulator
			Smart-Cut
			Silicon Direct Bonding (SDB)
			Separation by Implanted Oxygen (SIMOX)
		SiGe Film on Si Substrate
		Strained Si Film on Si Substrate
		Carbon Nanotubes on Si Substrate
		Graphene on Si Substrate
		Light-Emitting Materials on Si Substrate
		References
	75 Silicon Wafer Processing
		Heat Treatment of Crystal Ingot
		Orientation of Crystal
		Cutting Technology of Crystal Ingot
		Slicing Technology
		Lapping Technology
		Polishing Technology and Polished Wafer
		Cleaning and Packaging of Si Wafer
		References
	76 Defects and Impurities in Silicon Materials
		Point Defects
		Line Defects
		Planar Defects
		Bulk Defects
		Micro-Defects
		Oxygen in CZ Silicon
		Carbon in CZ Silicon
		Nitrogen in CZ Silicon
		Metallic Impurity in CZ Silicon
		Slip Dislocation
		Misfit Dislocation
		Oxidation-Induced Stacking Faults
		Epitaxial Defects
		Induced Micro-Defects
		References
	77 Compound Semiconductors
		Compound Semiconductor Materials
		Requirement of ICs for Compound Semiconductor Materials
		Fabrication of Monocrystalline GaAs
		Thermal Treatment of Gallium Arsenide and Wafer Processing
		GaAs Epitaxy
		Properties of InP
		Fabrication of Monocrystalline InP
		Indium Gallium Arsenic
		Monocrystalline GaN
		GaN Thin Film
		Crystalline Al2O3 and Substrate Materials
		Monocrystalline Si-Carbide
		Silicon Carbide Film
		Compound Quantum Well Materials
		Compound Quantum Dot Materials
		References
	78 Photomask and Photoresist
		Requirements of Photomask Materials and Development for ICs
		Photomask Substrate Material
		Photoresist Applied Chrome Thin-Film Photo-Plate [3, 4]
		Phase-Shift Mask (PSM)
		Extreme Ultraviolet Lithography Photomask
		Hard Mask
		Photoresist [9, 10]
		UV Photoresist
			UV Broadband PR
			G-Line (436 Nm) PR
			I-Line (365 Nm) PR
		Deep UV Photoresist (DUV Photoresist)
		EUV Photoresist [10]
		Next-Generation Lithography Materials [10]
			Nanoimprint PR [13, 14]
			Directed Self-Assembly of Block Copolymer (DSA BCP)
			Electron-Beam (e-Beam) PR
		Photo-Sensitive Polyimides
		Antireflection Coating [15, 16]
		Ancillaries
		References
	79 Auxiliary Material in Process
		Immersion Fluid
		High-Purity Specialty Gases
		Precise Processing Materials for Si Wafers
		Quartz Products
			Quartz Diffusion Tube
			Quartz Crucible
			Quartz Bell Jar
			Quartz Boat/Basket/Paddle
		Ultra-pure Chemicals
		Cleaning and Etching Chemicals
		Chemical Mechanical Polishing Slurry
		Chemical Mechanical Polishing Pads and Conditioning Discs
		Doping Reagents
		Aluminum Targets
		Titanium Targets
			Key Characteristics of Ti Targets
			Fabrication of Ti Target
		Tantalum Targets
			The Specific Requirement of Ta Target [9, 10]
			Fabrication of Ta Targets
		Copper Targets
		Precious Metal Targets
			Application of the Precious Metal Target
			Fabrication of the Precious Metal Targets
			Recycle of the Precious Metal Targets
		References
	80 Package Structure Materials
		Lead Frame Materials
			Cu-Based Lead Frame Materials
			Iron-Based Lead Frame Material
		Plastic Packaging Materials
		Ceramic Packaging Materials
			High-Temperature Co-Fired Ceramic (HTCC)
			Low-Temperature Co-Fired Ceramic (LTCC)
		Metal Packaging Materials
			Traditional Metal Packaging Materials
			New Metal Packaging Materials
		Ceramic Substrate Materials
		Organic Packaging Substrates
		Precious Metals and Their Bonding Wires as Internal Lead Materials
			Gold (Au) and Au Alloy Bonding Wires
			Silver (Ag) Bonding Wires
			Gold-Silver (Au-Ag) Bonding Wires
			Silver (Ag) Alloy Bonding Wires
		Cu, Cu-Alloy, Al, Al Alloy Bonding Wires as Inner Lead Materials
			Cu Bonding Wires
			Palladium (Pd)-Plated Cu Bonding Wires
			Cu-Alloy Bonding Wires
			Aluminum (Al) and Al Alloy Bonding Wires
		Electrically Conductive Adhesives (ECA)
		Die Attach Adhesives (DAA)
		Solder
		Under-Fill
		References
Section X
	Introduction
	81 Non-traditional New Structure Devices
		Gate-All-Around (GAA) Device
		Tunneling Field-Effect Transistor
		Impact Ionization MOS
		Spin Field-Effect Transistor
		Negative Capacitive FET
		Magnetoresistive Random-Access Memory (MRAM)
		Spin-Transfer Torque Magnetoresistive RAM(STT-MRAM)
		Phase-Change Random Access Memory (PCRAM)
		Resistive Random Access Memory (RRAM)
		Memristor
		Quasi-SOI Devices
		References
	82 New Type ICs
		Artificial Neural Network (ANN)
		Brain-Inspired Chip
		Reconfigurable Computing Integrated Circuits
		Terahertz Integrated Circuit (THz IC)
		Quantum Integrated Circuit
		Cognitive Radio Integrated Circuits
		Nonvolatile Logic Integrated Circuit
		Biomedical Chip
		References
	83 New Materials Used in IC
		Diamond
		Graphene
		Graphene-Like Materials
		Nanowires
		Carbon Nanotubes
		Germanium-Tin (GeSn)
		Quantum Wire Materials
		Topological Insulator
		References
	84 Advanced IC Manufacturing Processes
		Low K Dielectric and Air Gap
		Plasma Doping
		Nanoimprint Lithography (NIL)
		Directed Self-Assembly Lithography (DSA)
		References
	85 New Technology in Integration and Interconnection
		3D Interconnect Technology
		TSV-Based 3D IC
		On-Chip Optical Interconnect
		References
	86 Modeling and Simulation of Nano-devices
		Technology Computer-Aided Design (TCAD)
		Monte Carlo Simulation for Device
		Quasi-ballistic Transport
		Nonequilibrium Green´s Function (NEGF)
		Molecular Dynamics Simulation
		First Principles Method
		Density Functional Theory (DFT)
		Atomic Device Simulation
		References
	87 Flexible Semiconductor Devices (FSD)
		Stretchable Inorganic Semiconductor Devices
		Foldable Silicon Integrated Circuit
		Flexible Thin-Film Transistors
		Organic Field-Effect Transistors
		Flexible Memory
		Flexible Substrate Technology
		Flexible RFID
		Flexible Micro-electromechanical Systems
		Organic Semiconductor Materials
		Organic Heterojunctions
		Organic Light-Emitting Diodes
		Organic Photodetectors
		Organic Solar Cells
		References
	88 Integrated Microsystem Technology
		Implantable Microsystem
		Nano Energy Devices
		Bulk Silicon Micromachining Process
		Surface Silicon Micromachining Process
		Lithographie-Galvanoformung-Abformung (LIGA) Process
		Smart Sensors
		References
	89 Advanced Characterization and Testing Techniques
		Conductive Atomic Force Microscope (C-AFM)
		Atom Probe Tomography (APT)
		Inelastic Electron Tunneling Spectroscopy
		Technology of Femtosecond Lasers
		Power-Aware Testing
		3D IC Testing
		Embedded Core Test
		Defect Tolerance
		Adaptive Test
		Hardware Security and Trust
		References
	90 Aerospace Microelectronics
		Space Radiation Environment
		Radiation Effects on Integrated Circuits
		Radiation Hardening Technology of Integrated Circuits
		Radiation Test
		Simulation of Radiation Effects on Integrated Circuit
		References
Appendix A: List of Semiconductor Enterprises
	Partial List of Semiconductor Companies with Technical Focus
	Lists of Top Ten Semiconductor Companies in Various Technical Sectors
		Top Ten IC Design Companies
		Top Ten Semiconductor Manufacturing Enterprises
		Top Ten Semiconductor Device Manufacturers
		Top Ten IC Packaging and Testing Companies
		Top Ten Semiconductor Equipment Providers
		Top Ten Automotive Semiconductor Suppliers
		Top Ten O-S-D Companies
Appendix B: Reference Tables
	Greek Alphabet (Table B.1)
	Reference Tables of Physics and Chemistry
		Periodic Table of Elements (Table B.2)
		Chemical Elements Used in IC Manufacturing (Table B.3)
		Physicochemical Properties of Gases (Table B.4)
		Physicochemical Properties of Liquids (Table B.5)
		Properties of Semiconductor Materials (Table B.6)
		Chemistry and Physics Constants (Table B.7)
	Mathematical Constants (Table B.8)
	Physics Constants
		General Physics Constants (Table B.9)
		Electromagnetic Constants (Table B.10)
		Atomic and Nuclear Constants (Table B.11)
	SI Units
		Basic SI Units
		Derived SI Units
		Non-SI Units (Table B.14)
		SI Prefix (Table B.15)
	Conversion Tables of Commonly Used Units
		Conversion of Length Units (Table B.16)
		Conversion of Area Units (Table B.17)
		Conversion of Volume and Capacity Units (Table B.18)
		Conversion of Miscellaneous Units (Table B.19)
		Monetary Conversion Table (Table B.20)
Appendix C: Abbreviations of IC Terminology
Appendix D: Common Glossaries of IC Industry