Electronic Systems Maintenance Handbook, Second Edition

Cover......Page 3
Preface......Page 5
Contents......Page 10
General Introduction to Probability and Statistics......Page 13
Probability......Page 15
Statistics......Page 20
Basics on Components......Page 27
Systems......Page 28
Modeling and Computation Methods......Page 29
1.3 Markov Models......Page 30
Basic Constructions......Page 31
Model for a Reconfigurable Fourplex......Page 32
Computational Examples......Page 34
1.4 Summary......Page 36
References......Page 37
Further Information......Page 38
2.1 Introduction......Page 39
2.2 The Life Cycle Usage Environment......Page 40
2.4 Failure Mechanisms......Page 41
2.5 Design Guidelines and Techniques......Page 42
Protective Architectures......Page 43
Derating......Page 44
2.6 Qualification and Accelerated Testing......Page 45
Process Qualification......Page 46
Manufacturability......Page 47
Process Verification Testing......Page 48
Defining Terms......Page 49
Further Information......Page 50
3.1 Introduction......Page 51
The Waterfall Life Cycle Model......Page 52
The Spiral Model......Page 53
Classification of Software Reliability Models......Page 55
Predictive Models: The Rome Air Development Center Reliability Metric......Page 56
Models for Software Reliability Assessment......Page 58
Criticisms and Suggestion for New Approaches......Page 68
3.4 Conclusions......Page 71
References......Page 73
Further Information......Page 75
4.2 Fundamentals of Heat......Page 76
Thermal Conductivity......Page 77
Liquids......Page 78
Semiconductors......Page 79
Melting Point......Page 80
Temperature Coefficient of Resistance......Page 81
Temperature Compensation......Page 82
Further Information......Page 83
5.1 Introduction......Page 84
5.2 Heat Transfer Fundamentals......Page 86
Basic Heat Flow Relations, Data for Heat Transfer Modes......Page 87
Thermal Resistance......Page 95
Thermal Modeling/ Simulation......Page 96
Experimental Characterization......Page 99
of Packaging Systems......Page 101
Nomenclature......Page 103
Defining Terms......Page 105
References......Page 106
Further Information......Page 109
6.2 Cables and Connectors......Page 111
Shielding Effectiveness......Page 112
Different Levels of Shielding......Page 113
6.4 Aperture- Leakage Control......Page 116
Viewing Apertures......Page 117
Ventilating Holes......Page 118
Electrical Gaskets......Page 120
Shielding Composites......Page 121
6.5 System Design Approach......Page 122
Defining Terms......Page 123
Further Information......Page 124
Wire- Wound Resistor......Page 125
Adjustable Resistors......Page 126
Attenuators......Page 127
Further Information......Page 133
8.1 Introduction......Page 134
Operating Losses......Page 135
Film Capacitors......Page 136
Polarized- Capacitor Construction......Page 138
Capacitor Failure Modes......Page 139
Further Information......Page 141
Magnetic Shielding......Page 142
Losses in Inductors and Transformers......Page 143
Shielding......Page 144
Further Information......Page 150
10.1 Introduction......Page 151
10.2 Board Types, Materials, and Fabrication......Page 152
10.3 Design of Printed Wiring Boards......Page 156
10.4 PWB Interconnection Models......Page 158
10.5 Signal- Integrity and EMC Considerations......Page 164
Defining Terms......Page 166
Further Information......Page 167
11.1 Introduction......Page 168
11.2 Substrates for Hybrid Applications......Page 169
Thick- Film Materials......Page 170
Thick- Film Conductor Materials......Page 171
Thick- Film Resistor Material......Page 173
Properties of Thick- Film Resistors......Page 174
Properties of Thick- Film Dielectric Materials......Page 176
Processing Thick- Film Circuits......Page 177
11.4 Thin- Film Technology......Page 178
Deposition Technology......Page 179
Photolithographic Processes......Page 180
Thin- Film Resistors......Page 181
11.5 Resistor Trimming......Page 182
11.7 The Hybrid Assembly Process......Page 183
The Chip- and- Wire Process......Page 184
Tape Automated Bonding and Flip- Chip Bonding......Page 186
Defining Terms......Page 188
Further Information......Page 189
12.2 Definition......Page 190
Considerations in the Implementation of SMT......Page 191
12.3 Surface Mount Device (SMD) Definitions......Page 193
12.4 Substrate Design Guidelines......Page 194
12.5 Thermal Design Considerations......Page 196
12.6 Adhesives......Page 199
12.7 Solder Paste and Joint Formation......Page 201
12.8 Parts Inspection and Placement......Page 202
12.9 Reflow Soldering......Page 203
12.10 Prototype Systems......Page 206
References......Page 207
Further Information......Page 208
13.1 Introduction......Page 210
13.2 Terminology......Page 211
13.3 Semiconductor Device Assembly......Page 212
Packaging the Die......Page 213
VLSI and VHSIC Devices......Page 214
13.4 Semiconductor Reliability......Page 215
Reliability Analysis......Page 216
Bond Pad Structure......Page 217
Reliability of VLSI Devices......Page 218
Case Histories......Page 219
Forward Bias Safe Operating Area......Page 221
Power Handling Capability......Page 222
Safe Operating Area......Page 223
Discrete Transistor Failure Modes......Page 225
Thermal Stress- Induced Failures......Page 226
Package Improvements......Page 227
MOSFET Device Failure Modes......Page 228
Failure Modes......Page 229
13.7 Heat Sink Considerations......Page 230
Mounting Power Semiconductors......Page 232
Fastening Techniques......Page 233
Air Handing Systems......Page 234
References......Page 237
14.1 Introduction......Page 239
Assessing the Lightning Hazard......Page 240
FIPS Publication 94......Page 243
Transient Protection Alternatives......Page 244
14.2 Motor- Generator Set......Page 248
System Configuration......Page 249
Motor- Design Considerations......Page 250
Maintenance Considerations......Page 253
Motor- Generator UPS......Page 254
14.3 Uninterruptible Power Systems......Page 257
UPS Configuration......Page 259
Power- Conversion Methods......Page 260
Redundant Operation......Page 264
Output Transfer Switch......Page 266
Battery Supply......Page 267
Ferroresonant Transformer......Page 269
Isolation Transformer......Page 271
Tap- Changing Regulator......Page 272
Variable Voltage Transformer......Page 276
Line Conditioner......Page 277
Active Power Line Conditioner......Page 278
References......Page 281
Further Information......Page 282
15.1 Introduction......Page 283
Terms and Codes......Page 284
15.2 Establishing an Earth Ground......Page 288
Grounding Interface......Page 289
Chemical Ground Rods......Page 292
Ufer Ground System......Page 294
Bonding Ground- System Elements......Page 296
Ground- System Inductance......Page 297
Grounding Tower Elements......Page 299
Ground- Wire Dressing......Page 301
Facility Ground Interconnection......Page 302
Grounding on Bare Rock......Page 305
Transmission Line......Page 306
Satellite Antenna Grounding......Page 307
15.4 Designing a Building Ground System......Page 308
Bulkhead Panel......Page 310
Lightning Protectors......Page 315
Checklist for Proper Grounding......Page 317
Single- Point Ground......Page 320
Separately Derived Systems......Page 321
Grounding Terminology......Page 322
Facility Ground System......Page 323
Power- Center Grounding......Page 328
Grounding Equipment Racks......Page 330
Analyzing Noise Currents......Page 332
Types of Noise......Page 333
Noise Control......Page 335
Patch- Bay Grounding......Page 337
Input/ Output Circuits......Page 338
Cable Routing......Page 340
References......Page 341
Further Information......Page 342
16.1 Introduction......Page 343
Multilayer Transport Model......Page 345
Physical Path vs Virtual Path......Page 346
Channel Formats for STM and ATM......Page 347
16.3 STM System Configuration and Operations......Page 350
16.4 ATM Cell Switching System Configuration and Operations......Page 351
16.6 Protection Switching Concept......Page 352
References......Page 354
Further Information......Page 355
17.2 OSI Model......Page 356
Data Link Layer......Page 357
Network Layer......Page 358
Application Layer......Page 359
Further Information......Page 360
18.1 Fundamentals of Data Acquisition......Page 362
Plug- In DAQ Boards......Page 363
Analog Input Architecture......Page 365
Basic Analog Specifications......Page 366
18.3 Digital Sampling......Page 367
Real- Time Sampling Techniques......Page 368
Preventing Aliasing......Page 369
External Sampling......Page 370
Multirate Scanning......Page 371
Interval Scanning......Page 372
Seamless Changing of the Sampling Rate......Page 373
Considerations When Seamlessly Changing the Sampling Rate......Page 374
ETS Counter/ Timer Operations......Page 375
Considerations When Using ETS......Page 376
18.5 Factors Influencing the Accuracy of Your Measurements......Page 377
Differential Nonlinearity......Page 378
Integral Nonlinearity......Page 380
Settling Time......Page 381
The Low- Noise Voltmeter Standard......Page 383
Where Does Noise Come from?......Page 384
Source Impedance Considerations......Page 385
Pinpointing Your Noise Problems......Page 386
Filtering......Page 387
Types of Measurement Inputs......Page 388
Basic Signal Conditioning Functions......Page 389
Variety of Signal Conditioning Architectures......Page 391
Defining Terms......Page 392
Further Information......Page 393
19.2 PSPICE......Page 394
Passive Components Description......Page 395
Semiconductor Component Description......Page 397
Independent Sources......Page 398
Running PSpice: Control Shell......Page 400
Op- Amp Description......Page 402
Simulation Example 2......Page 404
Time- Domain Analysis......Page 407
Simulation Example 3......Page 409
Fourier Analysis......Page 410
Simulation Example 4......Page 411
Subcircuits......Page 412
Simulation Example 5......Page 413
Simulation vs Practical......Page 414
Digital Simulators......Page 417
Simulation Example 6......Page 418
Mixed Analog– Digital Simulators......Page 419
Simulation Example 7......Page 421
Block- Diagram Simulators......Page 423
Simulation Example 8......Page 425
Defining Terms......Page 427
References......Page 428
Further Information......Page 429
Purpose of Audio Measurements......Page 430
Average- Response Measurements......Page 431
Peak- Response Measurements......Page 432
Decibel Measurements......Page 433
20.4 Phase Measurement......Page 434
Harmonic Distortion......Page 435
Intermodulation Distortion......Page 437
Addition and Cancellation of Distortion Components......Page 438
20.6 Multitone Audio Testing......Page 439
Multitone vs. Discrete Tones......Page 441
FFT Analysis......Page 442
20.7 Considerations for Digital Audio Systems......Page 444
References......Page 446
Further Information......Page 447
21.1 Video Signal Spectra......Page 448
Maximum Video Frequency......Page 450
Video Frequencies Arising from Scanning......Page 451
21.2 Measurement of Color Displays......Page 453
Chromatic Adaptation and White Balance......Page 455
21.4 Display Resolution and Pixel Format......Page 456
21.5 Applications of the Zone Plate Signal......Page 458
Simple Zone Plate Patterns......Page 459
Producing the Zone Plate Signal......Page 460
Subjective CRT Measurements......Page 0
Objective CRT Measurements......Page 463
Defining Terms......Page 464
References......Page 465
Further Information......Page 466
22.1 Introduction......Page 467
Linear Distortion......Page 468
Nonlinear Distortion......Page 470
Distortion Due to Time- Variant Multipath Channels......Page 471
22.3 The Wireless Radio Channel......Page 472
Ground......Page 473
Sky Waves......Page 474
Demodulation of AM Signals......Page 475
Double- Sideband Suppressed- Carrier (DSB- SC) Demodulation Errors......Page 476
Single- Sideband Suppressed- Carrier (SSB- SC) Demodulation Errors......Page 477
Amplitude Modulation Effects of Linear Distortion......Page 479
Effects of Amplitude Nonlinearities on Angle Modulated Waves......Page 481
Phase Distortion in Angle Modulation......Page 483
Interference in Amplitude Modulation......Page 484
Interference in SSB- SC......Page 485
Interference in Angle Modulation......Page 486
References......Page 487
Further Information......Page 488
23.1 Introduction......Page 489
23.2 Logic Analyzer......Page 490
23.3 Signature Analyzer......Page 492
23.5 Checking Integrated Circuits......Page 493
23.6 Emulative Tester......Page 494
23.8 Automated Test Instruments......Page 495
Applications......Page 496
Operating Principles......Page 497
Digital Storage Oscilloscope (DSO) Features......Page 498
Triggering......Page 500
References......Page 503
Further Information......Page 504
24.1 Introduction......Page 505
24.2 The Mathematical Preliminaries for Fourier Analysis......Page 506
24.3 The Fourier Series for Continuous- Time Periodic Functions......Page 509
24.5 The Fourier Series for Discrete- Time Periodic Functions......Page 511
Using the DFT/ FFT in Fourier Analysis......Page 513
Total Harmonic Distortion Measures......Page 515
Defining Terms......Page 516
Further Information......Page 518
Signal Generation......Page 519
Statistical Data Analysis......Page 521
Signal Processing......Page 522
25.3 Symbolic Mathematics......Page 523
Defining Terms......Page 525
Further Information......Page 526
26.2 Systems Theory......Page 527
26.3 Systems Engineering......Page 528
Synthesis......Page 529
Evaluation and Decision......Page 531
Description of System Elements......Page 534
Design Development......Page 536
Electronic System Design......Page 537
Program Management......Page 543
Systems Engineer......Page 546
Defining Terms......Page 548
References......Page 549
Further Information......Page 550
27.1 Introduction......Page 551
27.2 Emergency Management 101 for Designers......Page 552
Starting Your Planning Process: Listing Realistic Risks......Page 554
Risk Assessment and Business Resumption Planning......Page 555
27.4 Workplace Safety......Page 556
Outside Plant Wire......Page 557
27.6 Emergency Power and Batteries......Page 558
27.9 Electromagnetic Pulse Protection (EMP)......Page 560
27.11 Security......Page 561
27.14 Business Rescue Planning for Dire Emergencies......Page 562
References......Page 563
Further Information......Page 564
Facility Safety Equipment......Page 565
28.2 Electric Shock......Page 567
Effects on the Human Body......Page 568
Circuit- Protection Hardware......Page 569
Working with High Voltage......Page 572
First Aid Procedures......Page 573
28.3 Polychlorinated Biphenyls......Page 574
Governmental Action......Page 575
PCB Components......Page 576
Identifying PCB Components......Page 577
Disposal......Page 578
28.4 OSHA Safety Requirements......Page 580
Grounding......Page 581
Management Responsibility......Page 582
Further Information......Page 584
Conversion Tables......Page 585