Diffusion Bonding 2

Front Matter....Pages i-x
Diffusion Bonding — An Overview....Pages 1-12
Ambient-Temperature Creep Failure of Silver-Interlayer Diffusion Bonds between Steel....Pages 13-24
Diffusion Bonding by Hot Extrusion of Incoloy 825 and Duplex 2205 to a Low Alloy Steel....Pages 25-36
Study of the Microstructure Obtained after Diffusion Bonding Inconel 625 to Low Alloy Steel by Hot Uniaxial Pressing or Hipping....Pages 37-48
HIP Diffusion Bonding of Austenitic to Ferritic Steels....Pages 49-58
Control of Diffusion Bonding Quality....Pages 59-68
Development of Diffusion Bonding Techniques for Al-Li base Alloy AA8090....Pages 69-82
Diffusion Bonding of Superplastic Aluminium Alloys Using a Transient Liquid Phase Interlayer (Zinc)....Pages 83-100
Influence of Surface Preparation on the Diffusion Welding of High Strength Aluminium Alloys....Pages 101-110
Diffusion Bonding of Thin Aluminium Foils....Pages 111-118
Laser Surface Modification of 8090 Alloy with Silicon for Diffusion Bonding....Pages 119-129
Diffusion Bonding of Al-Li 8090 Alloy....Pages 130-143
Diffusion Bonding of Ti-6Al-4V Alloy: Metallurgical Aspects and Mechanical Promotes....Pages 144-157
Resistance Diffusion Bonding of a Titanium Aluminide....Pages 158-170
30 Seconds Solid State Bonding of Metals....Pages 171-182
The Diffusion Bonding of Engineering Ceramics to Nickel Based Superalloys by Hot Isostatic Pressing (Hipping)....Pages 183-199
Diffusion bonding of Inconel 600 to Alumina....Pages 200-223
Interfaces in Metal/Ceramic Diffusion Bonds....Pages 224-231
The Development of DB/SPF Titanium Technology for Military Aircraft Applications....Pages 232-241
The Application of SPF/DB to Dissimilar Metal Joints....Pages 242-249
HIP-diffusion bonding of ODS-materials by use of plasma sprayed encapsulation....Pages 250-260
Component Assembly Using HIP Diffusion Bonding....Pages 261-269
Diffusion Bonded Windows for Diagnostics of Fusion Plasmas....Pages 270-292
Low Temperature Diffusion Bonding of High Carat Gold Using in Situ Gold-Cadmium Alloys....Pages 293-301
A New Aspect of Eutectic Bonding for Gold Soldering....Pages 302-316