Compatibility and Testing of Electronic Components

Content: 
Front Matter, Page iii
Copyright, Page iv
Preface, Pages v-vi
Chapter 1 - Introduction, Pages 1-13
Chapter 2 - Integrated Circuit Compatibility, Pages 14-38
Chapter 3 - Survey of Semiconductor Joining Techniques, Pages 39-62
Chapter 4 - Commercial Application of Thick Film Hybrids, Pages 63-84
Chapter 5 - Thin Film Hybrid Approach to Integrated Circuits, Pages 85-92
Chapter 6 - Factors affecting thick film devices, Pages 93-109
Chapter 7 - Adhesion of platinum-gold glaze conductors, Pages 110-116
Chapter 8 - Thin inlays for electronic applications, Pages 117-129
Chapter 9 - Humidity corrosion of metallic resistors, Pages 130-138
Chapter 10 - The interface between glaze resistors, Pages 139-142
Chapter 11 - Confusion in Multilayer Systems, Pages 143-148,148a,148b,149-154
Chapter 12 - Dielectric formulations for Screened Ceramic Microcircuit Substrates, Pages 155-162
Chapter 13 - Failure modes in thin film circuits, Pages 163-168
Chapter 14 - Specifying resistance temperature stability, Pages 169-175
Chapter 15 - Poly—para—xylylene in thin film applications, Pages 176-183
Chapter 16 - Thin film Al—Al2O3—Al capacitors, Pages 184-196
Chapter 17 - Compatible fabrication of tantalum thin film integrated circuits, Pages 197-204
Chapter 18 - Silicon oxide micromodule capacitors, Pages 205-214
Chapter 19 - Chip capacitors in hybrid microelectronics, Pages 215-225
Chapter 20 - Design, construction and testing of miniature relays, Pages 226-235
Chapter 21 - Compatibility of flexible film wiring, Pages 236-243
Chapter 22 - The purpose of testing, Pages 244-264
Chapter 23 - Reliability screening using infrared radiation, Pages 265-274
Chapter 24 - Environmental and life testing of magnetic components, Pages 275-292
Chapter 25 - Searching for incompatibility in integrated circuits, Pages 293-320
Chapter 26 - Encapsulated component stress testing, Pages 321-332
Bibliography, Pages 333-334
Index, Pages 335-345