Advances in Electronic Circuit Packaging: Volume 3

Front Matter....Pages i-vi
Keynote Address....Pages 1-8
Economic Aspects of Display Panel Packaging....Pages 9-20
Designing and Packaging Electronic Modular Enclosures That Never Leave the Ground....Pages 21-41
Flexibility in Control/Display Panel Packaging....Pages 42-54
Packaging the Lenkurt 76A Microwave Radio....Pages 55-71
Packaging for Maintainability of an Airborne Computer: A Case History....Pages 72-84
Digital Micromodular Equipment (MICROPAC) Design Concepts....Pages 85-114
Selection of Packaging Materials for Oceanographic Instruments....Pages 115-133
A Unique Approach to Welded Packaging....Pages 134-152
INTERCON—Prefabricated Weldable Circuitry....Pages 153-167
How Altitude Affects Forced Air Cooling Requirements of Electronic Equipment....Pages 168-181
Space Seal Study....Pages 182-193
An Analysis of Forced Convection Heat Transfer in High-Density Circuit Packages....Pages 194-212
Transient Thermal Analysis of the Weld-Pak Package....Pages 213-230
Packaging of Electronic Systems Utilizing Commercially Available Integrated Circuits....Pages 231-243
A Packaging Method for Thin-Film Microelectronic Systems....Pages 244-263
Microcircuitry: An Approach to the Fabrication of Microelectronic Circuitry....Pages 264-276
Microelectronics and Megaheadaches....Pages 277-294
Microelectronic Connections....Pages 295-319
Mechanical Design of Electronic Circuit Packages for Missile Environments....Pages 320-337
A Composite Approach for Packaging Interim Analog Electronics....Pages 338-351
Miniaturization of IF Circuitry....Pages 352-363
The IMP—A New Concept in Miniature Module Construction....Pages 364-370
High-Frequency Analog Circuitry....Pages 371-383
The Design of a Chemically Milled and Adhesive-Bonded Airborne Indicator Unit....Pages 384-402
Design for Automation....Pages 403-418
Status Report: “Swiss Cheese” Method of Circuit Packaging....Pages 419-429
Electronic Networks from Pellets....Pages 430-448
Panel Discussion....Pages 449-457