Wafer-Scale Fabrication Technology for Silicon Photonic Integrated Circuits

Dankwoord......Page 9
List of Acronyms......Page 17
Nederlandse samenvatting......Page 23
English summary......Page 27
 Motivation......Page 31
Photonic integrated circuit technology......Page 33
Silicon photonic integrated circuits......Page 36
 Losses......Page 40
Accuracy required......Page 41
Integration with electronics......Page 43
Overview of this work......Page 46
References......Page 48
Introduction......Page 53
Electron beam lithography......Page 54
Imprint/nano-imprint lithography......Page 55
Optical lithography......Page 56
Projection lithography......Page 57
Illumination System......Page 59
Reticle......Page 60
Projection Optics......Page 61
Photoresist......Page 62
Etch mechanisms in a plasma......Page 63
Etching chambers......Page 65
Capacitively Coupled Plasma reactor (CCP)......Page 66
Inductively Coupled Plasma reactor (ICP)......Page 67
References......Page 68
Introduction......Page 71
  Numerical Aperture and coherence......Page 72
Depth of Focus......Page 73
  Focus-Exposure Matrix......Page 74
Baking and developement......Page 76
 Lithography process for Photonic wires......Page 80
 Lithography process for Photonic crystals......Page 81
  Overlapping process window......Page 85
Optical proximity effect......Page 86
 Dry etching......Page 89
  Deep etch process......Page 90
Litho-etch bias......Page 94
Shallow etch process......Page 95
  Photonic crystal membrane......Page 96
Optical characterization......Page 97
Photonic wires and bend loss......Page 98
Photonic crystals waveguide loss......Page 99
Propagation loss reduction......Page 102
Low-loss waveguide geometry......Page 103
Si reflow......Page 106
SCROD treatment......Page 108
Conclusion......Page 110
References......Page 111
Uniformity of Silicon Photonic Devices......Page 115
  Effect of variability on Silicon photonic devices......Page 116
Classiffication of variability......Page 117
  Intra-die non-uniformity......Page 118
Batch-to-Batch (BtB) and Wafer-to-wafer (WtW)  non-uniformity......Page 119
 Critical Dimension Metrology......Page 120
 Fabrication process characterization......Page 122
Layer thickness variability......Page 123
Linewidth variability......Page 124
Wavelength selective device non-uniformity......Page 127
Intra-Die device non-uniformity......Page 131
Inter-Die device non-uniformity......Page 132
  Effect of pattern density on device non-uniformity......Page 135
Designing fabrication tolerant devices......Page 138
  Adaptive process flow......Page 140
Conclusion......Page 142
References......Page 144
Introduction......Page 147
Fabrication of high efficiency fiber couplers......Page 148
Raised Fiber Coupler Grating patterning......Page 152
Shallow Etch Patterning......Page 155
Waveguide Patterning......Page 156
Raised Fiber Coupler Efficiency......Page 157
Wavelength Selective Devices......Page 158
Conclusion......Page 159
References......Page 160
  Introduction......Page 161
Deposition techniques......Page 162
Conformality and Filling......Page 163
Material Composition......Page 164
  Surface roughness and planarization......Page 165
  Amorphous silicon......Page 167
Deposition process......Page 168
Optical absorption and scattering defects......Page 169
Design of experiment......Page 170
Material composition : Fourier transform infrared spectroscopy......Page 171
Crystallinity : X-ray diffraction and transmission electron microscopy......Page 175
Stress......Page 177
Optical characterization......Page 178
Wavelength selective devices in -Si:H......Page 181
  Thermal Trimming and Tuning of -Si:H photonic devices......Page 183
Experiment......Page 184
  Trimming action and the cause......Page 185
Summary......Page 188
Experiment......Page 189
Surface and film morphology......Page 190
Propagation loss characterization......Page 192
Conclusions......Page 193
References......Page 195
Introduction......Page 199
Design of optical via for multilayer photonic circuits......Page 200
Design of Directional Coupler Via (DCV)......Page 201
  Design of Grating Via (GV)......Page 203
Design of Multimode Interference Via (MMIV)......Page 204
Fabrication of double layer photonic circuit......Page 207
Optical characterization of double layer photonic circuits......Page 208
Fabrication of fiber couplers with bottom mirror......Page 210
Optical characterization of fiber couplers......Page 211
Conclusion......Page 212
References......Page 213
Conclusions......Page 215
Future work......Page 217
Publications in international journals......Page 229
Selected publications in international conferences......Page 231
Highlights and Awards.......Page 234
 Lithography simulation parameters......Page 239
Etch rate comparison......Page 243
Photonic wire loss summary......Page 245