Trilogy of Magnetics: Design Guide for EMI Filter Design, SMPS & RF Circuits

Cover
Title
Imprint
Content
Preface
Thank you!
The Authors
I Basic principles
	1 Basic principles of inductive components
		1.1 Ampère’s Law and magnetic field strength H
			1.1.1 Straight current conductor
			1.1.2 Toroidal coil
			1.1.3 Long solenoid
		1.2 Magnetic induction B
		1.3 Magnetic flux Φ
		1.4 Faraday’s law
		1.5 Core materials and their losses
		1.6 Permeability μ
			1.6.1 Complex permeability
			1.6.2 Comparing core materials
		1.7 Inductance L
			1.7.1 Definition of inductance L
			1.7.2 Definition of the AL value
		1.8 Impedance Z
			1.8.1 Self-resonant frequency (SRF)
		1.9 Resistive losses
			1.9.1 Copper losses
			1.9.2 Skin Effect
			1.9.3 Proximity Effect
			1.9.4 AC loss calculations
			1.9.5 Definition of quality factor Q
		1.10 Temperature behavior
		1.11 Rated current
		1.12 Saturation current
		1.13 Differentiating EMC ferrite ↔ inductor
	2 Equivalent circuits and simulation models
		2.1 The most important types of equivalent circuits
		2.2 EMC ferrite equivalent circuits
		2.3 Simulation with LTspice
		2.4 Design of optimized EMC filters for real operatingenvironments
	3 Filter Basics
		3.1 Filter circuits
		3.2 The principle of filtering, functionality and structure of filters
		3.3 The low-pass filter
		3.4 Filter circuitry
			3.4.1 Filter ground reference
		3.5 Symmetrical filter/common-mode filter
		3.6 Filters for frequencies over 500 MHz
	4 Transformers Basics
		4.1 Functionality of a transformer
		4.2 Parasitic Effects
		4.3 Transformer: Parasitic parameters and equivalent circuit
		4.4 Function and application areas of transformers
		4.5 Requirements for data and signal transformers
		4.6 A transformer’s effect on return loss
	5 Ethernet and Power-over-Ethernet Basics
		5.1 The history of Ethernet
		5.2 The OSI reference model
		5.3 What is Ethernet (standard 802.3)?
		5.4 The different types of encoding for Ethernet
		5.5 Bob Smith termination
		5.6 Power over Ethernet (PoE)
		5.7 Important safety points to consider
		5.8 Infrastructure and signal integrity
		5.9 Power classes, supply voltage
	6 Switched mode power supply (SMPS)
		6.1 Basic circuits
		6.2 Buck converter/step-down converter
			6.2.1 Isolated output from buck converter
			6.2.2 PolyPhase™ for high output currents
		6.3 Boost converter/step-up converter
		6.4 SEPIC switching controller with low input ripple current
		6.5 Input filter
		6.6 Transformers in switched mode power supplies
		6.7 The flyback converter
			6.7.1 Quasi-resonant flyback
		6.8 The forward converter
			6.8.1 Active clamp forward
		6.9 The push-pull converter
		6.10 The half-bridge converter
		6.11 The full-bridge converter
		6.12 Isolated soft switching topologies
		6.13 LLC converters
		6.14 Current transformers
		6.15 Gate drive transformers
		6.16 An introduction to frequency compensation
	7 Wireless Power Transfer Basics
		7.1 Transmission paths for wireless power transfer
		7.2 Basics
		7.3 Construction and calculation of the resonant circuit
		7.4 Coupling and efficiency
		7.5 Shielding
		7.6 EMC measurements
		7.7 The dominating standards
	8 RF basics
		8.1 RF inductor characteristics
			8.1.1 Inductance (L) and tolerance (%)
			8.1.2 Self-Resonant Frequency (SRF)
			8.1.3 Quality factor (Q)
			8.1.4 DC resistance (RDC)
			8.1.5 Rated current (IR)
			8.1.6 Size
		8.2 S-Parameters – Basic principles
			8.2.1 Basic theoretical principles
			8.2.2 Conceptual design of a matching circuit by means of a Smith chart
II Components
	1 Overview of components
	2 EMC Components
		2.1 Various forms of ferrites
		2.2 WE-CBF SMD Ferrites
			2.2.1 Design guidelines
		2.3 WE-PBF, WE-SUKW High Current Beads
		2.4 WE-MPSB SMD multilayer power suppression bead
		2.5 Through Hole Components
			2.5.1 WE-UKW 6-Hole Ferrite Bead “VHF suppression choke”
			2.5.2 WE-MLS Ferrite Bridge
		2.6 Snap ferrites
			2.6.1 STAR-TEC, STAR-RING, STAR-CLIP
			2.6.2 STAR-GAP – Snap ferrites with a defined air gap
		2.7 WE-MI Multilayer Inductor
		2.8 WE-FI Radio interference suppression choke
		2.9 Common Mode Chokes
		2.10 Common Mode Chokes for Data and Signal Lines
		2.11 WE-SL, WE-SLM, WE-SL1, WE-SL2, WE-SL3, WE-SL5
		2.12 Common Mode Chokes for Power Lines
		2.13 WE-ExB Common Mode Power Line Choke
		2.14 WE-LPCC Common Mode Power Line Choke
	3 Power Magnetics – Inductors
		3.1 WE-PMI – Power Multilayer Inductors
		3.2 WE-MAPI Shielded SMD Metal Alloy Power Inductor
		3.3 WE-SI Power Inductors
		3.4 WE-PD SMD Power Inductors
		3.5 WE-TPC, WE-HCI, WE-HCC Power Inductors
		3.6 WE-HCF SMD High Current Inductor
		3.7 WE-PD HV, WE-PD2 HV, WE-TI HV – High Voltage Inductors
		3.8 WE-PFC Power Factor Correction Choke
		3.9 WE-EHPI Energy Harvesting Coupled Inductor
		3.10 WE-DD double chokes
		3.11 WE-DPC SMD Dual Power Choke
		3.12 WE-MCRI – SMD Molded Coupled Inductor
		3.13 WE-MTCI SMD Multi-Turn Ratio Coupled Inductor
		3.14 WE-DPC HV, WE-CPIB HV, WE-TDC HV SMD Coupled Inductors
	4 Power Magnetics – Transformers
		4.1 WE-FLEX & WE-FLEX+ Transformers
		4.2 WE-FLEX HV Flexible Transformer High Voltage
		4.3 WE-PoE Power-over-Ethernet Transformers
		4.4 WE-PoEH Power over Ethernet High Power Transformer
		4.5 WE-LLCR Resonant Converter Transformer
		4.6 WE-UNIT Offline Transformers
		4.7 WE-GDT Gate Drive Transformer
		4.8 WE-CST Current Sense Transformers
	5 Wireless Power Transfer
		5.1 WE-WPCC, Wireless Power Transfer Coils
	6 Signal & Communications
		6.1 LAN transformers
		6.2 WE-LAN HPLE – 1000BASE-T High Performance, Low EMI
		6.3 WE-RJ45 LAN/WE-RJ45 HPLE Transformers integrated with RJ45 connector
		6.4 WE-LAN 10G LAN Transformer PoE/PoE+
		6.5 Telecom transformers
	7 RF Inductors
		7.1 RF Inductors
		7.2 WE-KI, WE-KI HC, WE-FRI, WE-RFH Ceramic wire wound inductors
		7.3 WE-MK Multilayer ceramic inductor
		7.4 WE-TCI Thinfilm Chip Inductors
		7.5 WE-CAIR, WE-AC HC High Current Air Coil
		7.6 WE-AC HC High Current Air Coil
	8 LTCC Components
		8.1 LTCC (Low Temperature Co-fired Ceramic)
		8.2 WE-LPF Multilayer Chip Low-Pass Filter
		8.3 WE-BPF Multilayer Chip Band-Pass Filter
		8.4 WE-BAL Multilayer Chip Balun
		8.5 WE-MCA Multilayer Chip Antenna
	9 ESD and Surge Protection
		9.1 Basic principles
		9.2 Varistors
		9.3 The ESD suppressor
		9.4 TVS diodes
		9.5 Design layout
III Applications
	1 Filter Circuits (Including ESD)
		1.1 Use of filters in interface applications
		1.2 Filter circuit layout
		1.3 Component placement
		1.4 Conductor track routing and layer structure
		1.5 Selection of filter components for frequencies over 500 MHz
			1.5.1 Capacitors for use in filters for frequencies over 500 MHz
			1.5.2 Inductors for use in filters for frequencies over 500 MHz
			1.5.3 Example circuit and layout of a HF filter
		1.6. Combining filtering with ESD protection
	2 Audio circuitry
		2.1 Symmetrical audio transmission
		2.2 Stereo power amplifier for multimedia applications
		2.3 HiFi audio processors in multimedia applications
		2.4 Class D amplifiers
		2.5 350 W Low Frequency amplifier
	3 Video circuitry
		3.1 3x video amplifer/multiplexer
		3.2 Video multiplexer with coax transmission line
		3.3 LVDS Interfaces
			3.3.1 The LVDS Signal
		3.4 HDMI Interface
	4 Interfaces
		4.1 Industrial Computer Boards
		4.2. CAN interface
		4.3 GPIO Interface
			4.3.1 16-Channel Digital I/O
			4.3.2 8-Channel Push-Pull Outputs
			4.3.3 4-Channel Analog Inputs
		4.4 USB 2.0 Interface
		4.5 USB 3.0 Interface
		4.6 The AS-Interface
		4.7 Alphanumeric display interface
		4.8 Hall sensor switch
	5 Motor control unit
		5.1 Radio interference suppression of DC motors
		5.2 Stepping motor driver
	6 Transformers Switch Mode Power Supplies
		6.1 Switching converter applications
		6.2 DCM Flyback transformer design
		6.3 CCM Flyback transformer design
		6.4 Manufacturing considerations
	7 Mains filters
		7.1 Mains filters
		7.2 Power supply filters for DC applications
		7.3 Power supply in general
		7.4 Filtering an external AC/DC interface
		7.5 Broadband filter for voltage supply
	8 Power supply
		8.1 Power inductors
			8.1.1 Energy harvesting with LTC3108
			8.1.2 Micropower step-up converter IC LT1615
			8.1.3 5 V/1 A DC/DC converter
			8.1.4 Step-up and SEPIC DC/DC converter with LT1613
			8.1.5 Step-down converter with LM2655
			8.1.6 Step-down converter with LM2678 (5A)
			8.1.7 White LED high efficiency DC/DC converter NCP5007 (ON Semiconductor)
			8.1.8 Step-down regulator with L5973 (STMicroelectronics)
			8.1.9 Switching controller for battery operated devices with TPS6420x (Texas Instruments)
			8.1.10 SEPIC LED driver using HV9911
			8.1.11 Power Factor Correction (PFC) with UC3854
		8.2 Example circuits for WE-FLEX transformers
		8.3 Power Transformers
			8.3.1 Flyback converter for Power-over-Ethernet with LM5070
			8.3.2 Flyback converter with LTC1871 and WE-FLEX
			8.3.3 AC/DC Flyback for worldwide mains input with NCP1014
			8.3.4 LinkSwitch-II® isolated 4.2 W LED driver
			8.3.5 LinkSwitch-II® non-isolated 350 mA, 12 V LED driver
			8.3.6 25 W Quasi-resonant power supply
			8.3.7 Forward converter with the LTC1681 and synchronous rectifier
			8.3.8 Push-pull converter with LT1683
			8.3.9 150 W LLCR Half bridge with WE-LLCR
	9 The influence of wide band gaps devices
		9.1 SiC diodes
		9.2 SiC MOSFETs
		9.3. GaN devices
		9.4. Example circuit
	10 Wireless Power Transfer
		10.1 Data transmission between transmitter and receiver
		10.2 Wireless charger with LTC1420
		10.3 100 W Classic self-resonant converter
	11 RF circuits
		11.1 Criteria for the selection of RF components for a 20 dBm Bluetooth® front-end module
		11.2 Bluetooth® transceiver with integrated GFSK modem
		11.3 Functionality of a WLAN module
		11.4 VHF/UHF broadband amplifier
		11.5 Antenna systems
		11.6 Using antennas
IV Appendices
	1 Technical dictionary
	2 Keyword index
	3 Formulary
		3.1 Collection of formulas to calculate the most important parametersfor the flyback converter
		3.2 Core geometries and typical transformable power at 100 kHz
		3.3 Snubber-Design