Solid Circuits and Microminiaturization. Proceedings of the Conference Held at West Ham College of Technology, June, 1963.

Content: 
Inside Front Cover, Page ii
Front Matter, Page iii
Copyright, Page iv
LIST OF DELEGATES, Pages 1-13
OPENING ADDRESS TO THE CONFERENCE, Pages 15-16, G.W.A. Dummer
1.1 - STATUS AND TRENDS IN MICROMINIATURIZATION, Pages 17-21, J.S. Walker
1.2 - SOLID STATE CIRCUIT TECHNOLOGY, Pages 23-36, C.P. Sandbank
1.3 - THE DESIGN AND MANUFACTURE OF SOLID CIRCUITS: With special reference to Micrologic, Pages 37-40, J.T. Kendall
1.4 - CURRENT DEVELOPMENTS IN MICROMINIATURIZATION AT SESCO-MCP, Pages 41-61, A. Bobenrieth
DISCUSSION, Pages 62-66
2.1 - THE SCOPE OF THE SOLID CIRCUIT CIRCUIT DESIGNER, Pages 67-73, R.W.A. Scarr
2.2 - SOLID CIRCUIT FABRICATION TECHNIQUES AND THE RESULTING PASSIVE COMPONENT CHARACTERISTICS, Pages 75-80, B.L.H. Wilson
2.3 - CHARACTERISTICS AND APPLICATIONS OF MICROLOGIC ELEMENTS, Pages 81-101, P.J. Bénéteau, S. Iannazzo
DISCUSSION, Pages 102-105
3.1 - EQUIPMENT DESIGN PHILOSOPHY USING INTEGRATED CIRCUITS, Pages 107-111, P.R. Thomas
3.2 - TECHNIQUES FOR THE USE OF SOLID CIRCUITS TOGETHER WITH CONVENTIONAL COMPONENTS IN MINIATURISED ASSEMBLIES, Pages 113-123, E.F. Grube, D. Popplewell, J.L. Storr-Best
3.3 - A TUNABLE SOLID-CIRCUIT FILTER FOR USE IN AN I.F. AMPLIFIER, Pages 125-132, T.E. Price
3.4 - A PUNCHED-TAPE COMPARATOR USING INTEGRATED CIRCUITS, Pages 133-141, P.D. Forte
3.5 - AN EQUIPMENT MAKER'S VIEWS ON SOME MICROMINIATURE SYSTEMS, Pages 143-158, A.T. Lawton
DISCUSSION, Pages 159-165
4.1 - CHARACTERISTICS OF A SERIES OF COMPATIBLE DIGITAL LOGIC NETWORKS, Pages 167-174, J.A. Cayzer
4.2 - THE APPLICATION OF SOLID STATE CIRCUITS TO COMPUTER DESIGN, Pages 175-179, M.W. Gribble
4.3 - SOLID CIRCUIT LOGIC ELEMENTS USING MULTIPLE EMITTER TRANSISTORS, Pages 181-188, B.A. Boulter
4.4 - HIGH SPEED INTEGRATED DIGITAL CIRCUITS, Pages 189-201, R.S. Dunn
5.1 - A GROUP OF INTEGRATED CIRCUITS FOR LINEAR AMPLIFICATION, Pages 203-214, K. Gurnett, A. Bardsley
5.2 - A SOLID CIRCUIT AMPLIFIER, Pages 215-220, W. Holt
5.3 - INTEGRATED TUNNEL DIODE CIRCUITS, Pages 221-230, C.P. Sandbank
DISCUSSION, Pages 231-237
5.4 - DESIGN OF AN EXPERIMENTAL ELECTRON BEAM MACHINING APPARATUS, Pages 239-255, P.A. Einstein
5.5 - ELECTRON BEAM ETCHING IN MICROMINIATURISATION, Pages 257-269, W.C. Nixon
6.1 - PREPARATION OF SILICON DEVICE MATRICES FOR SOLID CIRCUITS, Pages 271-277, E.G. Sandifer
6.2 - CHARACTERISTICS AND APPLICATIONS OF SOLID CIRCUITS FROM SILICON DEVICE MATRICES, Pages 279-284, J.A. Chandler
6.3 - THE ROLE OF THIN FILM CIRCUITS IN MICROMINIATURIZATION, Pages 285-299, E.E. Smith
7.1 - WHY MAKE CIRCUITS SOLID ?, Pages 301-307, D.H. Roberts
7.2 - A COMPARISON OF THE MICROELECTRONIC SYSTEMS, Pages 309-319, J.W. Granville
DISCUSSION, Pages 320-333
APPENDIX 1 - THE SUITABILITY OF SOLID CIRCUITS FOR USE IN COMMERCIAL DIGITAL COMPUTERS, Pages 335-339, G.C. Rowley
INDEX - SUBJECTS, Pages 340-343
INDEX - AUTHORS AND DISCUSSION PARTICIPANTS, Pages 344-346