Smart Card Manufacturing - A Practical Guide

Contents......Page 6
Preface......Page 10
1.1.1 Structure of a smart card with contacts......Page 12
1.1.2 Standards......Page 14
1.1.4 Different types of smart cards......Page 16
1.1.5 Applications......Page 18
1.2 Contactless smart card......Page 23
1.2.1 Structure of a contactless smart card......Page 24
1.2.2 Standards......Page 26
1.2.3 Applications......Page 27
1.3.3 Applications......Page 28
2.1 History......Page 31
2.2 Materials......Page 32
2.4 Card elements......Page 34
2.4.1 Plastic foils......Page 35
2.4.2 Printing......Page 37
2.4.3 Signature panel......Page 41
2.4.4 Magnetic stripes......Page 43
2.4.5 Embossing......Page 45
2.4.6 Laser engraving......Page 47
2.4.7 Hologram......Page 49
2.4.8 Multiple laser image (MLI)......Page 50
2.4.9 Additional card elements......Page 51
3.1 Laminating technology......Page 55
3.1.1 Laminating process......Page 59
3.1.2 Card structure......Page 61
3.2 Injection moulding......Page 65
3.3 Paper card......Page 66
4.1 Embedding by lamination technology......Page 68
4.2 Embedding by mounting technology......Page 69
4.2.1 Dimensions of the cavity......Page 70
4.2.2 Gluing technology......Page 77
4.3 In-mould technology......Page 89
5.1 Basics of integrated circuits technology......Page 91
5.2 Production processes for chips......Page 97
5.3 Paper-thin wafer......Page 107
5.4 Types of memory chips......Page 109
6.1 Why chip modules?......Page 113
6.2 Different types for chip modules......Page 114
6.3 Structure and materials of chip modules......Page 118
6.4 Production processes for chip modules......Page 123
7.1 Smart cards with contacts......Page 141
7.1.1 Chip module incoming test......Page 142
7.1.2 Production of the card body cavity......Page 144
7.1.3 Connection technology between chip module and card body......Page 151
7.1.4 Embedding of the chip module......Page 155
7.2.1 Different types of antennas for contactless smart cards......Page 160
7.2.2 Connecting technologies for contactless smart cards......Page 164
7.3.1 Exposing of the antenna contacts in the card body......Page 169
7.3.2 Connection technology for the antenna......Page 171
8.1 MOSAIC......Page 178
8.2 Shellpack......Page 180
8.3 Flip-chip connection technology......Page 182
9.1 Quality control, AQL, LTPD......Page 187
9.2 Electrical reliability tests......Page 191
9.3 Physical reliability tests......Page 197
10 Personalization and mailing of smart cards......Page 205
10.1 Work flow for personalization......Page 206
10.2 Personalization technologies......Page 207
10.3 Smart card mailing......Page 210
11.1 Smart cards with electronical input/output devices......Page 212
11.2 Smart cards with sensors......Page 213
11.3 New applications for smart cards......Page 215
12 Short cuts......Page 217
13 Bibliography......Page 220
14.1 Company overview......Page 221
14.2.2 Contactless memory chip......Page 227
14.2.3 Microcontroller chips......Page 228
14.2.4 Microcontroller chips—dual-interface......Page 229
E......Page 230
P......Page 231
X......Page 232