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از ساعت 7 صبح تا 10 شب
ویرایش:
نویسندگان: Zoran Stamenkovic
سری:
ISBN (شابک) : 9789811210716, 9789811210730
ناشر:
سال نشر: 2020
تعداد صفحات: 430
زبان: English
فرمت فایل : PDF (درصورت درخواست کاربر به PDF، EPUB یا AZW3 تبدیل می شود)
حجم فایل: 30 مگابایت
در صورت تبدیل فایل کتاب Silicon Systems For Wireless Lan به فرمت های PDF، EPUB، AZW3، MOBI و یا DJVU می توانید به پشتیبان اطلاع دهید تا فایل مورد نظر را تبدیل نمایند.
توجه داشته باشید کتاب سیستم های سیلیکونی برای شبکه بی سیم نسخه زبان اصلی می باشد و کتاب ترجمه شده به فارسی نمی باشد. وبسایت اینترنشنال لایبرری ارائه دهنده کتاب های زبان اصلی می باشد و هیچ گونه کتاب ترجمه شده یا نوشته شده به فارسی را ارائه نمی دهد.
Contents Foreword Part-1 Design Chapter 1 System Architecture 1.1 Introduction 1.2 Wireless Communication Systems 1.2.1 Mobile communication 1.2.2 Long-range communication 1.2.3 Mid-range communication 1.2.4 Short-range communication 1.2.5 Why do we focus on WLAN only? 1.3 WLAN Transceiver Architecture 1.3.1 WLAN MAC sublayer 1.3.2 WLAN physical layer References Chapter 2 Digital Baseband 2.1 Introduction 2.2 Scrambling/Descrambling 2.3 Channel Coding and Error Correction 2.3.1 Error detection schemes 2.3.2 Error correction codes 2.3.3 Common metrics of FEC codes 2.3.4 Block codes 2.3.5 Convolutional codes 2.4 Interleaving/Deinterleaving 2.5 Mapping/Demapping 2.6 Pilot Insertion 2.7 IFFT/FFT 2.9 Pulse Shaping 2.10 Synchronization 2.11 Channel Estimation 2.11.1 Time-domain windowing 2.11.2 Frequency-domain interpolation 2.11.3 Selection of a comb-type estimator 2.11.4 Decision-directed channel estimators 2.12 Equalization References Chapter 3 Analog Front-End 3.1 Introduction 3.1.1 Basic concepts in communication 3.1.2 Modulation schemes in IEEE 802.11bag/n/ac 3.2 Specifying Transceiver 3.2.1 IEEE 802.11 transmitter constraints 3.2.2 IEEE 802.11 receiver constraints 3.3 Transmitter Architecture 3.3.1 Direct conversion transmitter 3.3.2 Heterodyne transmitter 3.3.2.1 Conventional architecture 3.3.2.2 RF synthesizer sharing: Variable-IF Transmitter 3.3.2.3 Digital IQ implementation: Real-IF Transmitter 3.3.3 Polar transmitter 3.4 Receiver Architectures 3.4.1 Direct conversion 3.4.1.1 Pros and Cons 3.4.1.2 Non-ideal Effects and Countermeasures in the Architecture 3.4.2 Heterodyne receiver References Part-2 Modeling Chapter 4 System Models 4.1 Introduction 4.2 WLAN MAC Model 4.3 WLAN Baseband Model 4.4 What is Next? References Chapter 5 Digital Circuit Models 5.1 Introduction 5.2 General Purpose Processors 5.3 Digital Signal Processors 5.3.1 Scrambler/descrambler 5.3.2 Interleaver/deinterleaver 5.3.3 Convolutional encoder and Viterbi decoder 5.3.4 Constellation mapper/demapper 5.3.5 Pilot insertion and pulse shaping 5.3.6 IFFT/FFT processor 5.3.7 Time and frequency synchronizer 5.3.8 Channel estimator 5.4 System Bus 5.5 Memory Controller 5.6 Debug Support Unit 5.7 Peripherals References Chapter 6 AMS Circuit Budgets 6.1 Introduction 6.2 From High-Level Specifications to Low(er)-level Requirements 6.2.1 Block-level metrics 6.2.1.1 Noise metrics 6.2.1.2 Distortion metrics 6.2.1.3 Signal definition 6.2.2 Error sources 6.2.2.1 The receiver case 6.2.2.2 The transmitter case 6.3 Budgeting the Transceiver References Chapter 7 Embedded Memories 7.1 Introduction 7.2 Memory Systems: Current Landscape 7.2.1 Embedded memory 7.2.2 Alternatives to current memory landscape 7.2.3 Memory hierarchy 7.3 Memory Technologies 7.3.1 SRAM 7.3.2 DRAM 7.3.3 Flash 7.3.4 Emerging memory technologies 7.3.4.1 PCM 7.3.4.2 STT-RAM 7.3.4.3 RRAM 7.4 Conclusion References Part-3 Implementation and Integration Chapter 8 Implementation Methodologies 8.1 Introduction 8.2 Semi-Custom Methodology 8.2.1 ASIC implementation flow 8.2.2 FPGA implementation flow 8.3 Full-Custom Methodology References Chapter 9 Semi-Custom Implementation of Digital Circuits 9.1 Introduction 9.2 MAC Processor 9.3 Digital Baseband Processor References Chapter 10 Full-Custom Implementation of Analog and Mixed-Signal Circuits 10.1 Introduction 10.2 Technology Selection 10.2.1 RF considerations 10.2.2 Baseband considerations 10.3 AMS-RF Top-Level Implementation 10.3.1 Modern full-custom design flow 10.3.2 Analog and digital co-simulation 10.3.3 Layout considerations 10.3.4 Co-simulation with package and PCB models References Chapter 11 Integration 11.1 Introduction 11.2 Package Technology 11.2.1 System-on-Chip (SoC) 11.2.1.1 Packaging 11.2.1.2 Horizontal extension 11.2.1.3 Vertical extension 11.2.2 System-In-Package (SiP) 11.3 Antennas 11.3.1 Antenna metrics 11.3.2 Selection of antenna type 11.4 RF-MIMO Transceiver Example 11.4.1 Analog front-end 11.4.2 Baseband processor 11.4.3 MAC processor 11.4.4 System integration and test References Part-4 Verification and Testing Chapter 12 Verification 12.1 Introduction 12.1.1 Verification Plan 12.1.1.1 Stimuli generation 12.1.1.2 Response checking 12.1.2 Verification environment implementation, device bring-up and regression 12.1.3 Static or formal 12.1.3.1 Automated theorem proving 12.1.3.2 Model checking 12.1.3.3 Equivalence checking 12.1.4 Dynamic or Simulation-based 12.1.5 Code coverage metrics 12.1.6 Metrics based on the device activity 12.1.7 Metrics based on FSM 12.1.8 Error-based coverage metrics 12.1.9 Typical UVM Testbench architecture 12.1.9.1 UVM Test 12.1.9.2 UVM Environment 12.1.9.3 UVM Scoreboard 12.1.9.4 UVM Agent 12.1.9.5 UVM Sequencer 12.1.9.6 UVM Sequence 12.1.9.7 UVM Driver 12.1.9.8 UVM Monitor 12.1.10 UVM Class library Conclusions References Chapter 13 Digital Testing 13.1 Introduction 13.2 Test for What? Defects and Fault Modelling 13.3 Which Test Sequence Do I have to Apply? Test Generation 13.3.1 Fault Manager 13.3.2 TPG Algorithm 13.3.2.1 Sensitization 13.3.2.2 Propagation 13.3.2.3 Justification 13.3.3 Fault Simulation 13.3.3.1 PI1@0 13.3.3.2 PI2@1 13.3.3.3 G2/b@1 13.4 How the Test Sequence is Applied? Design-for-Test 13.5 Conclusions References Chapter 14 Analog, Mixed-Signal, and RF Circuits Test 14.1 Introduction 14.2 System-Level Considerations 14.2.1 A generic approach: Analog test-bus 14.2.2 An approach for transceivers: Loop-back 14.3 Performance-Oriented Testing 14.3.1 Design-for-testability and built-in self-test 14.3.1.1 RF blocks 14.3.1.2 Baseband circuits 14.3.2 Machine-learning indirect test 14.4 Defect-Oriented Testing 14.4.1 Simulation 14.4.1.1 Defect models 14.4.1.2 Defect simulation 14.4.2 Generic defect-oriented approaches 14.4.2.1 IDDQ 14.4.2.2 DC probes 14.4.2.3 OBT References Chapter 15 Embedded Memory Test 15.1 Introduction 15.2 SRAM Memory Test 15.2.1 Describing faulty behaviors 15.2.2 Representation of functional faults 15.2.3 Classification of faults 15.2.4 Test solutions and algorithms 15.3 Flash Memory Test 15.3.1 Flash memory test flow 15.3.2 Functional tests 15.3.3 Reliability tests 15.3.4 Repair strategies 15.4 Test Challenges of Emerging Memories 15.4.1 Test and reliability of PCMs 15.4.2 Test and reliability of STT-MRAMs 15.4.3 Test and reliability of RRAMs References Index