Semiconductor Manufacturing Technology

Preface
Acknowledgments
Contents
Chapter 1 OVERVIEW
	1.1. Classification of Materials
	1.2. Evolution of Integrated Circuit (IC) Industry
	1.3. From Design to Chips
	1.4. The Wafer Substrate Manufacturing Flow
	Example 1.1.
	Example 1.2.
	1.5. Wafer Processing Flow
	1.6. What is the Semiconductor Industry Trying to Achieve?
	1.7. The Never-Ending Effort — Yield Improvement
Chapter 2 BUILDING BLOCKS FOR INTEGRATED CIRCUITS
	2.1. Fundamental Semiconductor Concepts
	2.2. Resistors
	2.3. The pn Junctions
	2.4. Capacitors
	2.5. The MOS Transistor
	2.6. Integrated Circuits
Chapter 3 THERMAL OXIDATION
	3.1. Introduction
	3.2. Oxidation Mechanism and Modeling
	3.3. Isolation Technology
	3.4. Gate Oxide
	3.5. Cleaning before Thermal Oxidation
Chapter 4 GAS KINETICS AND PLASMA PHYSICS
	4.1. Gas Kinetics and Ideal Gases
	4.2. What is Plasma? How is it Formed?
	4.3. Introduction to Plasma Physics
	4.4. Electron Impact Phenomena
	4.5. Fundamental Plasma Reactor Configurations
	4.6. Magnetic Field Confinement
Chapter 5 CHEMICAL VAPOR DEPOSITION
	5.1. Classification of CVD Reactors and Films
	5.2. CVD Reactor Design Concepts
	5.3. CVD Reactor Modeling
	5.4. Characterization of Thin Films
	5.5. Applications of CVD Films
Chapter 6 PLASMA-ENHANCED CHEMICAL VAPOR DEPOSITION AND ETCHING
	6.1. The Plasma Reaction Pathways and System Variables
	6.2. Introduction to PECVD and Film Characterization
	6.3. Applications of PECVD Films
	6.4. Introduction to Plasma Etching
	6.5. Applications of Plasma Etching
	6.6. Plasma-Enhanced CVD and Etching Reactor Modeling
Chapter 7 PATTERN TRANSFER: PHOTOLITHOGRAPHY
	7.1. Introduction
	7.2. Preexposure Steps
	7.3. Resist Chemistry
	7.4. Fundamentals of Image Formation
	7.5. The Exposure System Evolution and Photoprocess Variations
	7.6. Postexposure Steps
Chapter 8 PATTERN GENERATION
	8.1. Introduction
	8.2. Electron Beam Writing and Resists 8.2.1.
	8.3. Back-End Processing for Mask Making
	8.4. Resolution Enhancement Technology
Chapter 9 DOPING TECHNOLOGY
	9.1. Introduction
	9.2. Dopant Diffusion
	9.3. Ion Implantation
	9.4. Implant Damages and Annealing
	9.5. Applications of Doping Technology
Chapter 10 METALLIZATION AND SILICIDATION
	10.1. Introduction
	10.2. Sputtering Systems
	10.3. Aluminum Metal System
	10.4. Meeting the Step Coverage Requirements
	10.5. Why Silicides?
Chapter 11 PLANARIZATION AND CMP TECHNOLOGY
	11.1. Introduction
	11.2. Interlayer Dielectrics
	11.3. Spin on Glass
	11.4. Intermetal Dielectrics
	11.5. Introduction to Chemical Mechanical Polishing and Its Applications 11.5.1.
	11.6. CMP Modeling
Chapter 12 COPPER AND LOW-
	12.1. Back-End Processes
	12.2. Cu Wiring
	12.3. Low-k Dielectrics
	12.4. Integration of Copper and Low-k Materials