Self-Organized 3D Integrated Optical Interconnects: with All-Photolithographic Heterogeneous Integration

Cover
Half Title
Title Page
Copyright Page
Dedication
Table of Contents
Preface
Chapter 1: Introduction
Chapter 2: Guidelines toward Self-Organized 3D Integrated Optical Interconnects
	2.1: Advantages of Lightwave Implementation into Boxes of Computers
	2.2: Integrated Optical Interconnects
	2.3: Self-Organization of 3D Integrated Optical
Interconnects
	2.4: E-O and O-E Signal Conversion in Integrated Optical
Interconnects
	2.5: Core Technologies for Self-Organized 3D Integrated
Optical Interconnects
Chapter 3: Scalable Film Optical Link Modules
	3.1: Concept of S-FOLM
	3.2: 3D Integrated Optical Interconnects Built by S-FOLMs
		3.2.1: 3D OE Platforms
		3.2.2: Structures within Boxes of Computers
	3.3: Various OE Structures Built by S-FOLMs
		3.3.1: OE-Film/Electrical Substrate Stack
		3.3.2: OE-Film/OE-Film Stack and Backside
Connection
		3.3.3: Both-Side Mounting
		3.3.4: Micro Optical Link Module
		3.3.5: OE Tap Guide
		3.3.6: WDM Transceiver and WDM Inter-PCB Connect
		3.3.7: 3D Optical Circuits for WDM
	3.4: Optoelectronic Amplifier/Driver-Less Substrate
		3.4.1: Concept of OE-ADLES
		3.4.2: Power Dissipation and RC Delay in OE-ADLES
Chapter 4: Optical Waveguide Films with Vertical Mirrors and 3D Optical Circuits
	4.1: Built-In Mask Method
	4.2: Fabrication of Optical Waveguides and Vertical Mirrors
		4.2.1: Waveguide Cores
		4.2.2: Vertical Mirrors
	4.3: Vertical Mirrors with Multi-Core-Layer Skirt-Type Structures
		4.3.1: Observation of Beam Leakage and Scattering at Vertical Mirrors
		4.3.2: Three-Core-Layer Skirt-Type Vertical Mirrors
		4.3.3: Simulations of Beam Leakage/Scattering at Vertical Mirrors
		4.3.4: Fabrication of Multi-Core-Layer Skirt-Type Vertical Mirrors
	4.4: 3D Optical Circuits
		4.4.1: Structures
		4.4.2: Type I: Stacked Waveguide Films with Vertical Mirrors
			4.4.2.1: Demonstration of 3D optical wiring
			4.4.2.2: Loss measurements
			4.4.2.3: Loss at Optical Z-Connection
		4.4.3: Type II: Waveguide Films with Vertical Waveguides
	4.5: Optical Waveguide Films Stacked on Electrical Boards
		4.5.1: Process Flow
		4.5.2: Waveguide-Film Stacking on PCBs
	4.6: Nanoscale Waveguides Made of PRI Sol–Gel Thin Films
		4.6.1: Linear, Bending, and Branching Waveguides
			4.6.1.1: Fabrication processes
			4.6.1.2: Linear waveguides
			4.6.1.3: Bending and branching waveguides
		4.6.2: Vertical Mirrors and All-Air-Cladding Waveguides
Chapter 5: Resource-Saving All-Photolithographic Heterogeneous Integration: PL-Pack with SORT
	5.1: Advantages of PL-Pack with SORT over Conventional Packaging
	5.2: PL-Pack with SORT
		5.2.1: Whole Process Flow of PL-Pack with SORT
		5.2.2: Process Flow of SORT
	5.3: Impacts of PL-Pack with SORT
		5.3.1: Material Consumption and Costs
		5.3.2: Mechanical Properties
		5.3.3: Transfer Step Count
		5.3.4: Small/Thin-Die Placement Density
	5.4: SORT of Polymer Waveguide Lenses
	5.5: SORT of Waveguide Cores
		5.5.1: SORT Process for Optical Waveguides
		5.5.2: Experimental Demonstration of SORT for Optical Waveguides
	5.6: Light-Assisted SORT
		5.6.1: LA-SORT
		5.6.2: Experimental Demonstration of LA-SORT
	5.7: SORT for Nanoscale Heterogeneous Integration
Chapter 6: High-Speed/Small-Size Light Modulators and Optical Switches
	6.1: Classification of Light Modulators and Optical Switches
	6.2: Variable Well Optical ICs and Waveguide Prism Deflectors
	6.3: Design and Predicted Performance of WPDs
		6.3.1: EO Materials for WPDs
		6.3.2: Model for 2 × 2 WPD Optical Switch
			6.3.2.1: Preliminary model
			6.3.2.2: Optimized model for performance evaluation
		6.3.3: Predicted Performance
	6.4: Advanced WPDs
		6.4.1: WPD Optical Switches with ADD Functions
		6.4.2: WPD Optical Switches with MUX/DEMUX Functions
	6.5: Transient Responses in Microring Resonators and Photonic Crystals
Chapter 7: Self-Organized Lightwave Networks
	7.1: Concept of SOLNETs
		7.1.1: Types of SOLNETs
		7.1.2: PRI Materials
		7.1.3: One-Photon and Two-Photon SOLNETs
		7.1.4: Fabrication Processes of Luminescent Targets and Luminescent Regions
	7.2: Performance of SOLNETs Predicted by Computer Simulations
		7.2.1: Simulation Models
		7.2.2: Simulation Procedures
		7.2.3: SOLNETs between Nanoscale Waveguides
			7.2.3.1: TB-SOLNET/P-SOLNET
			7.2.3.2: R-SOLNET
			7.2.3.3: LA-SOLNET
			7.2.3.4: Performance of couplings
		7.2.4: SOLNETs between Microscale and Nanoscale Waveguides
			7.2.4.1: TB-SOLNET/P-SOLNET
			7.2.4.2: R-SOLNET
			7.2.4.3: LA-SOLNET
			7.2.4.4: Performance of couplings
	7.3: Experimental Demonstrations of One-Photon SOLNETs
		7.3.1: One-Photon TB-SOLNETs
		7.3.2: One-Photon R-SOLNETs with Micromirrors Formed by Free-Space Write Beams
		7.3.3: One-Photon R-SOLNETs with Micromirrors
		7.3.4: One-Photon R-SOLNETs with Reflective Objects
		7.3.5: One-Photon R-SOLNETs with Luminescent Targets
			7.3.5.1: Coumarin 481 luminescent targets
			7.3.5.2: Alq3 luminescent targets
	7.4: Experimental Demonstrations of Two-Photon SOLNETs
		7.4.1: Two-Photon TB-SOLNETs
		7.4.2: Two-Photon R-SOLNETs
Chapter 8: Self-Organized 3D Integrated Optical Interconnects: Model Proposals
	8.1: 3D Integrated Optical Interconnects with P- and R-SOLNETs
	8.2: 3D Integrated Optical Interconnects with LA- and R-SOLNETs
Chapter 9: Self-Organized 3D Micro Optical Switching Systems: Model Proposals and Predicted Performance
	9.1: Advantages of 3D-MOSS
	9.2: Architecture of 3D-MOSS
		9.2.1: 3D-MOSS
		9.2.2: 3D-MOSS with SOLNET Implementation
	9.3: Predicted Performance of 1024 × 1024 3D-MOSS
		9.3.1: Structural Model
		9.3.2: Insertion Loss
		9.3.3: Electrical Characteristics
		9.3.4: Impact of HIC Waveguide Implementation into 3D-MOSS
Chapter 10: Film-Based Integrated Solar Energy Conversion Systems
	10.1: Integrated Solar Films
	10.2: Waveguide-Type Thin-Film Solar Cells
	10.3: Key Fabrication Processes for Integrated Solar Films
	10.4: Multilayer Waveguide-Type Light Beam Collecting Films
		10.4.1: Simulation Procedure
		10.4.2: Light Beam Collection by Light Beam Collecting Films
		10.4.3: Overall Consideration for Light Beam Collecting Efficiency
	10.5: Thin-Film Artificial Photosynthesis Cells
Chapter 11: Embodiments Disclosed in Patents
	11.1: Integrated OE MCMs
	11.2: 3D Optical Interconnects
		11.2.1: Horizontal Layer Attachment
		11.2.2: Vertical Layer Attachment
	11.3: Micro Optical Link Modules
	11.4: Active Optical Sheets, Boards, and Connectors
Chapter 12: Future Challenges
	12.1: Enhancement of the Pockels Effect by Controlling Wavefunction Shapes
	12.2: Molecular Layer Deposition (MLD)
	12.3: Growth of Polymer MQDs by MLD
Epilogue
Index