Microelectronic failure analysis: desk reference : 2001 supplement

Contents......Page 4
FIB Backside Isolation Techniques......Page 5
The SEM Lab, From Laboratory Logistics to Final Sample Preparation Techniques for SEM Analysis of Semiconductors......Page 23
Cross Sectioning with a Pivoting Sample Block......Page 39
Focused Ion Beam Cross Sectioning as a Compliment or an Alternative to Conventional Mechanical Sectioning Techniques......Page 45
Alternatives to Cross-Sectional Sample Preparation for Package and Board-Level Failure Analysis......Page 51
Automation To Boost Productivity And Increase Repeatability: (A sampling of available tools and vendors)......Page 61
Multi-Functional, Semi-Automatic Sample Preparation for Failure Analysis......Page 63
SMPT© - Sub-Micron Polishing Technology For Automated Sample Preparation......Page 69
Automated Techniques For SEM And TEM Sample Preparation......Page 73
Sample Preparation Techniques for Site-Specific Cross-Sectional Analysis of High-Aspect-Ratio FIB Repair Sites......Page 79
Deprocessing, Cross-Sectioning and FIB Circuit Modification of Parts Having Copper Metallization......Page 89
Scanning Capacitance Microscopy of Junction and Non-Junction Samples......Page 101
Electrical Probing of Deep Sub-Micron Integrated Circuits Using Scanning Probe Techniques......Page 117
Application of Tunneling Atomic Force Microscopy (TUNA) to Failure Analysis......Page 127
Glossary of Failure Analysis Tool Acronyms......Page 143
ISTFA Subject Index......Page 149