Micro System Technologies 90: 1st International Conference on Micro Electro, Opto, Mechanic Systems and Components Berlin, 10–13 September 1990

Front Matter....Pages I-XV
Front Matter....Pages 1-1
Microsystems: A Challenge for CAD Development....Pages 3-8
A Specification Driven Environment for Microsystem Design....Pages 9-16
Conceptual Design of Micro-Electro-Mechanical Systems....Pages 17-22
Intelligent CAD for Micro Mechanics....Pages 23-28
Computer Aided Engineering for Microsystems - Status and Trends....Pages 31-37
Numerical Simulation of Optical Devices....Pages 38-43
CAD-Tool for Integrated Optic Coupling Gratings....Pages 44-51
Simulation on Lateral Detector-Optical Waveguide Coupling....Pages 52-58
Electrical Connections Through Silicon Wafer: Application to 3D-Multichip Modules....Pages 61-70
Design Methods for Multichip Systems....Pages 71-78
A Fully-Automatic Macromodeling Procedure for the Electrical Simulation of Integrated Circuits....Pages 79-84
KOSIM — A Multi-Level Simulator for the Design of Integrated Circuits....Pages 85-90
Waveform Estimation and Hazard Detection in Digital MOS Circuits....Pages 91-96
Modelling of Interconnects by Boundary Element Method....Pages 97-102
Thermal Analysis of Integrated Circuits....Pages 103-108
Sensitivity Analysis in Thermal Wave Measurement....Pages 109-114
Design and Simulation of Sensors....Pages 117-124
Finite-Element Simulation of Silicon Accelerometers....Pages 125-130
Accelerometer Design Considerations....Pages 131-136
Front Matter....Pages 137-137
Development of a Thermal Test Chip....Pages 139-145
Front Matter....Pages 137-137
Infrared Microscopy - Contactless Temperature Measurement on Miniaturized Electronic Components....Pages 146-152
Highly Sensitive Strain Sensor for the Qualification of Epoxy Compounds Designed for the Encapsulation of Microsystems....Pages 153-158
Mechanical Reliability of Electronic Devices....Pages 161-176
Measurement of Internal Stress in Thin Silicon Membranes....Pages 177-182
Mesurement of the Thermal Diffusivity of Electrically Nonconducting Substrates....Pages 183-189
Characterization of Supersmooth Surfaces with Roughness Below 0.1 nm....Pages 190-195
Non-Destructive Testing of Semiconductor Materials Using Microwave Photoconductivity....Pages 199-204
Electrical Characterization of III/V Materials for Heterostructure Devices....Pages 205-210
Assessment of III–V Epitaxial Layers by Optical Methods....Pages 213-218
Ellipsometry for Process Control in Reactive Ion Etching....Pages 219-224
Thin Film Ellipsometric Measurements - A Tool for Research and Production....Pages 225-230
High Precision Non-Contacting Metrology Based on Short Coherence Interferometry....Pages 231-237
VIS-IR-Ellipsometry for Control and Characterization of Thin Film Processes....Pages 238-243
Front Matter....Pages 245-245
Deposition, Patterning, Properties and Applications of Al 2 O 3 Films....Pages 247-254
PECVD-Passivation Layers for Printheads in Micro-System-Technology....Pages 255-260
Hybrid Integrated Circuits on Polycrystalline Aluminium Nitride....Pages 261-266
High Performance Resin System for Printed Circuit Boards....Pages 267-272
Z-Axis Conductive, Stress Free, Thermally Conductive Adhesive Films and Pastes for Die- and Component Attach....Pages 273-274
Integrated Optics in Silicon....Pages 277-282
Integrated Optics on Silicon with PECVD-Fabricated Waveguides....Pages 283-288
Front Matter....Pages 245-245
Polymer Waveguides in Integrated Optics....Pages 289-294
Front Matter....Pages 295-295
Laser Induced Gold Deposition on Polyimide Layers....Pages 325-329
Selective Pattern Deposition of SnO 2 Thin Film by Laser Pyrolysis....Pages 330-334
Plane Surface Embedding Technique for Thin Film Hybrids....Pages 335-340
Pulsed Laser-Plasma Deposition of Polycomponent Thin-Film Structures - A Review....Pages 341-347
Laser-Induced Chemical Vapour Deposition of Thin Films in Microelectronics....Pages 348-353
Solderable Bumps for TAB and Flip-Chip Bonding....Pages 421-422
Electroless Bumping....Pages 423-428
Aspects of Patterning Inorganic-Organic Copolymers (ORMOCERs)....Pages 297-306
Photopatternable Layers from Amorphous, Diamond-Like Carbon - An Innovative Material for Microsystems Technology....Pages 307-312
Submicrometer Photolithography by Surface Imaging - Experiments and Simulation....Pages 313-318
X-Ray Imaging System....Pages 319-322
Plasma-Assisted Etching....Pages 357-365
Reactive Etching with ECR Plasma Source....Pages 366-371
Production of Resist Masks by Means of RIE....Pages 372-377
A new Explanation for the Degradation of Gold-Aluminium Bonds....Pages 381-388
Simulation of the Inner Lead Bonding Process....Pages 389-399
The Application of an Eutectic Gold-Tin Cushion for TAB-Inner Lead Bonding with Reduced Bonding Pressure....Pages 400-406
Bonding Techniques on Microsystem in Cryogenics and Microelectronic Engineering....Pages 407-412
Laser Soldering of TAB Inner Lead Bonds....Pages 413-418
Front Matter....Pages 295-295
Hybridization of Cooled Mosaic Sensors by Indium-Bumps....Pages 429-434
Development of a Fine Pitch Bumping Process....Pages 435-440
Tape Automated Bonding for High-Density Electronic Packaging....Pages 441-446
Adhesiveless Copper-Polyimide Laminates for TAB’s....Pages 447-454
Application of Micromachining and Micromechanics to Components for Optical Communication....Pages 457-464
Thermal Tunable Minimized Semiconductor Laser-Module....Pages 465-470
Micro Collimated Light Source Using Micro Fresnel Lens....Pages 471-476
Monomode Fused Optical System Elements....Pages 477-491
Sensor Packaging....Pages 495-502
A Method for Thermal Insulation of Microstructures....Pages 503-508
Machining of Metal Foils for Use in Microcompact Heat Exchangers....Pages 509-514
Novel Stress Free Assembly Technique for Micromechanical Devices....Pages 515-520
The LIGA Process for Microsystems....Pages 521-528
Movable Microstructures Manufactured by the LIGA Process as Basic Elements for Microsystems....Pages 529-537
Ion Beam Techniques for Micro Electro Mechanical Systems....Pages 538-544
A Novel Mask Compensation Pattern for Etched Microstructures with Several Convex Corners....Pages 545-550
Wafer Bonding and Etchback Techniques for Silicon-on-Isulator Systems....Pages 551-556
Front Matter....Pages 557-557
Silicon Microsystems as an Industry....Pages 559-561
Micromachined Silicon Devices Integrated with Standard IC Processes....Pages 562-567
Design of an Integrated Humidity Sensor with Digital Output in Double Metal CMOS Technology....Pages 568-573
Front Matter....Pages 557-557
CMOS Compatible Capacitive Pressure Sensor with Read-Out Electronics....Pages 574-580
Piezoresistive Pressure Sensors Representing the 2nd Generation Avoid the Physical Limits Based on Conventional Designs....Pages 581-586
High Performance Miniaturized Piezoresistive Pressure Transducers....Pages 587-592
Fully Integrated Silicon Pressure Sensor with On-Chip CMOS Evaluation Circuit and On-Chip Trimming....Pages 593-598
Optimization of Bipolar Magneto-Transistors....Pages 599-604
Silicon RF Power Sensor from DC to Microwave....Pages 605-610
Self-testable Accelerometer Microsystem....Pages 611-616
Micromechanical Capacitive Acceleration Sensor with Force Compensation....Pages 617-622
Capacitive Accelerometer Made by Silicon Micromechanics....Pages 623-628
Micromechanical Acceleration Sensor....Pages 629-635
CMOS Readout Electronics for Capacitive Acceleration Sensors....Pages 636-641
Development of Basic Structures for Integrated Chemical Sensors for SO 2 and NH 3 ....Pages 645-650
Technology and Application of Suspended Gate Field Effect Transistors for Gas Detection....Pages 651-656
Preparation of TiO 2 Films for Oxygen Sensors....Pages 657-662
Solid State Chemical Sensors in Thick Film Technique....Pages 663-668
Ionic Sensor Layers on Microelectronic Structures for the Detection of Solvent Vapours....Pages 669-674
An Integrated ISFET-Sensorarray with a CMOS Signal-Processing Circuits....Pages 675-680
CVD-Al 2 O 3 -Layers: Applicability in Sensor Devices....Pages 681-684
Biochemical Sensors for Microsystems....Pages 687-698
Miniaturised Thin-Film Biosensors....Pages 699-705
Front Matter....Pages 557-557
Chip-Biosensors - Integration of Bioactive Components with Transducers Made in Silicon Technology....Pages 706-709
Smart Silicon System for a Multi Sensor Catheter....Pages 710-715
A Digital Output Monolithic Temperature Sensor for Invasive Applications....Pages 716-721
New Nanomechanical Integrated Optical Devices as Modulators, Switches, and Microphones; Integrated Optical (Bio-)Chemical Sensors....Pages 725-732
High Resolution Interferometric Displacement Sensor Using Integrated Optics in Glass....Pages 733-738
Integrated Optical Devices in LiNbO 3 for Sensors....Pages 739-746
Optoelectronic Components and Modules for Multigigabit/s Fibre Optic Transmission....Pages 749-754
Elements for Integrated Optics Coherent Receiver Networks....Pages 755-760
Wavelength Division Multiplexers for Optical Communication Systems....Pages 761-766
Pin Photodiodes and Field-Effect Transistors for Monolithically Integrated InP/InGaAs Optoelectronic Circuits....Pages 767-772
Semiconductor Laser Amplifiers as Multifunctional Devices....Pages 773-778
Fibre Optical Amplifiers: Technology and System Applications....Pages 779-784
Integrated Optic Polarimetric Refractometer....Pages 785-790
Integrated Fluid Control Systems on a Silicon Wafer....Pages 793-798
Micro Liquid-Handling Devices - A Review....Pages 799-805
Electrically-Activated, Micromachined Diaphragm Valves....Pages 806-811
An Electrohydrodynamic Injection Pump - A Novel Actuator for Microsystem Technology....Pages 812-817
Electrostatic and Superconducting Microactuators....Pages 818-825
Levitational Bearing Systems by Meissner Effect....Pages 826-831
Rotational Behaviour of Living Cells with Reference to Micro-Motors....Pages 832-837
Front Matter....Pages 557-557
Magnetically Driven Microactuator: Design Considerations....Pages 838-843
Development of Micro Grippers....Pages 844-849
Micro-Actuator for Micro-Particles....Pages 850-855
Back Matter....Pages 856-858