Metallurgical Coatings 1988. Proceedings of the 15th International Conference on Metallurgical Coatings, San Diego, CA, U.S.A., April 11–15, 1988

Content: 
Front Matter, Page iii
Copyright, Page iv
PUBLICATION SCHEDULE, Page v
REACTION KINETICS IN TUNGSTEN/BARRIER METAL/SILICON SYSTEMS, Pages 1-14, K. SUGURO, Y. NAKASAKI, T. INOUE, S. SHIMA, M. KASHIWAGI
REACTIVELY SPUTTERED INDIUM OXIDE DIFFUSION BARRIER, Pages 15-20, E. KOLAWA, C.W. NIEH, J.M. MOLARIUS, L. TRAN, C. GARLAND, W. FLICK, M.-A. NICOLET, F.C.T. SO, J.C.S. WEI
Al3Ti FORMATION BY DIFFUSION OF ALUMINUM THROUGH TITANIUM, Pages 21-27, M. THUILLARD, L.T. TRAN, M.-A. NICOLET
CHEMICAL STABILITY OF VANADIUM BORIDE WITH ALUMINUM, Pages 29-35, E. KOLAWA, J.M. MOLARIUS, W. FLICK, C.W. NIEH, L. TRAN, M.-A. NICOLET, F.C.T. SO, J.C.S. WEI
THE DEPOSITION MECHANISMS AND MICROSTRUCTURES OF TUNGSTEN FILMS PRODUCED BY SILICON REDUCTION OF WF6, Pages 37-43, HEUNG LAK PARK, CHONG DO PARK, J.S. CHUN
A COMPARISON OF THE STEP COVERAGE OF ALUMINUM COATINGS PRODUCED BY TWO SPUTTER MAGNETRON SYSTEMS AND A DUAL-BEAM ION SYSTEM, Pages 45-53, J.K.G. PANITZ, B.L. DRAPER, R.M. CURLEE
REACTIVE-ION-ETCH-COMPATIBLE METALLIZATION FOR PARTIALLY COVERED CONTACT APPLICATIONS, Pages 55-62, JAMES G. RYAN, NEAL P. MARMILLION, JONATHAN P. FINEMAN, DENNIS P. BOULDIN
EFFECT OF ENCAPSULATION ON THE REACTION BETWEEN PALLADIUM AND GaAs THIN FILMS, Pages 63-68, E.T.-S. PAN, A. VENEZIA, E. KOLAWA, J.M. MOLARIUS, M.-A. NICOLET, J.L. TANDON, R. RUIZ
PROCESS TECHNOLOGY FOR PACKING APPLICATIONS, Pages 69-81, F.J. BRESNOCK
COATINGS FOR STRAIN COMPLIANCE IN PLASTIC PACKAGES: OPPORTUNITIES AND REALITIES, Pages 83-96, K.R. KINSMAN, B. NATARAJAN, C.A. GEALER
INTERFACE INTERACTIONS RELEVANT TO PACKAGING TECHNOLOGY, Pages 97-111, CHIN-AN CHANG
THE RELIABILITY OF INTEGRATED CIRCUITS PROTECTED WITH Ti–W/Au BUMPS, Pages 113-120, P.J. POKELA, T.M. PITKÄNEN, R. AHLROTH
FOCUSED ELECTRON AND ION BEAM REPAIR STRATEGIES FOR WAFER-SCALE INTERCONNECTIONS IN THIN FILM PACKAGING, Pages 121-130, H.T. LIN, J.F. McDONALD, J.C. CORELLI, S. BALAKRISHNAN, N. KING
CHARACTERIZATION OF HfBx FILMS DEPOSITED BY R.F. DIODE AND R.F. MAGNETRON SPUTTERING, Pages 131-138, W.Y. LEE, G. OLIVE, F. SEQUEDA, V. DELINE, T. HUANG, G. GORMAN, D.W. CHUNG
CERAMIC BEAMS AND THIN FILM GROWTH, Pages 139-148, J.I. BRAND, D.R. MILLER
NITRIDES OF TITANIUM, NIOBIUM, TANTALUM AND MOLYBDENUM GROWN AS THIN FILMS BY THE ATOMIC LAYER EPITAXY METHOD, Pages 149-154, L. HILTUNEN, M. LESKELÄ, M. MÄKELÄ, L. NIINISTÖ, E. NYKÄNEN, P. SOININEN
In0.30Al0.70As/In0.30Ga0.70As QUASI-INSULATING GATE STRAINED-LAYER FIELD EFFECT TRANSISTORS GROWN BY MOLECULAR BEAM EPITAXY, Pages 155-162, P. CHU, C.L. LIN, H.H. WIEDER
THERMALLY SPRAYED COATINGS OF YBa2Cu3O6 + x, Pages 163-170, P. McGINN, N. JAIN, V. ANAND, D. LEE
GROWTH AND PROPERTIES OF YBa2Cu3O7 – x SUPERCONDUCTING THIN FILMS, Pages 171-179, S.I. SHAH, C.R. FINCHER, M.W. DUCH, D.A. BEAMES, K.M. UNRUH, C.P. SWANN
EFFECTS OF DEPOSITION CONDITIONS ON THE SUPERCONDUCTING PROPERTIES OF R.F. AND D.C. MAGNETRON SPUTTER-DEPOSITED YBa2Cu3O7 – x FILMS, Pages 181-189, W.Y. LEE, J. SALEM, V. LEE, C.T. RETTNER, G. GORMAN, R. SAVOY, V. DELINE, T. HUANG, D.W. CHUNG
ANALYSIS OF TiN BY CHARGED PARTICLE BEAMS: NUCLEAR REACTION ANALYSIS, NUCLEAR REACTION BROADENING AND RUTHERFORD BACKSCATTERING, Pages 191-199, V.H. ROTBERG, A.J. PERRY, C.C. STRANDBERG, G. WAS
AN EVALUATION OF FOUR COMPUTER MODELLING PROGRAMS FOR RUTHERFORD BACKSCATTERING SPECTROMETRY ANALYSIS OF OXIDIZED SURFACES, Pages 201-211, J. SAULITIS, G.R. JOHNSTON, J.L. COCKING
RESONANT LOW ENERGY ELECTRONS AND THEIR IMPACT ON NON-DESTRUCTIVE DEPTH PROFILING OF THIN FILM SAMPLES, Pages 213-224, J.S. ZABINSKI, B.J. TATARCHUK
CHEMICAL CHARACTERIZATION OF THE DEACTIVATION AND PROTECTION OF FeTi THIN FILMS USING COMPLEMENTARY NON-DESTRUCTIVE TECHNIQUES, Pages 225-233, J.H. SANDERS, B.J. TATARCHUK
STRUCTURAL CHANGES INDUCED BY HEATING IN ELECTROLESS NICKEL–PHOSPHORUS ALLOYS, Pages 235-247, Q.X. MAI, R.D. DANIELS, H.B. HARPALANI
PLASMA SPRAYING OF WO3: STRUCTURAL CHARACTERIZATION OF THE COATINGS, Pages 249-254, M. LADOUCEUR, J.P. DODELET, L. PARENT, S. DALLAIRE
ELECTRICAL INSULATING PROPERTIES OF R.F.-SPUTTERED MAGNESIA COATINGS, Pages 255-262, P. VUORISTO, J. WAHLROOS, T. MÄNTYLÄ, P. KETTUNEN
X-RAY MICROFLUORESCENCE ANALYZER FOR MULTILAYER METAL FILMS, Pages 263-272, BRIAN J. CROSS, DAVID C. WHERRY
A TRANSMISSION ELECTRON MICROSCOPY STUDY ON THE CRYSTALLIZATION OF AMORPHOUS Ni–P ELECTROLESS DEPOSITED COATINGS, Pages 273-280, MA ERMING, LUO SHOUFU, LI PENGXING
STRUCTURE AND PROPERTIES OF ION SULPHOCARBONITRIDED COATINGS ON SEVERAL STRUCTURAL STEELS, Pages 281-290, BUQIAN WANG, XUN LUAN, ZHENGLIN LI, JUN ZHANG
MECHANICAL BEHAVIOR OF ALUMINUM AND Al–Cu(2%) THIN FILMS, Pages 291-298, F.R. BROTZEN, C.T. ROSENMAYER, R.J. GALE
MICROHARDNESS AND MICROSTRUCTURE OF ION-BEAM-SPUTTERED, NITROGEN-DOPED NiFe FILMS, Pages 299-308, T.W. WU, C. HWANG, J. LO, P. ALEXOPOULOS
EFFECTS OF NEUTRAL GAS INCORPORATION IN MOLYBDENUM COATINGS PRODUCED BY MAGNETRON SPUTTERING, Pages 309-316, P. BOSLAND, J. DANROC, R. GILLET, L. LOMBARD
VARIABLE ANGLE SPECTROSCOPIC ELLIPSOMETRY: A NONDESTRUCTIVE CHARACTERIZATION TECHNIQUE FOR ULTRATHIN AND MULTILAYER MATERIALS, Pages 317-323, JOHN A. WOOLLAM, PAUL G. SNYDER, MARTIN C. ROST
SIMULTANEOUS DETERMINATION OF DISPERSION RELATION AND DEPTH PROFILE OF THORIUM FLUORIDE THIN FILM BY SPECTROSCOPIC ELLIPSOMETRY, Pages 325-334, S.Y. KIM, K. VEDAM
MICROSCOPIC BUBBLE FORMATION AND COLLAPSE AT LIQUID–SOLID INTERFACES DURING ELECTRICAL POWERING OF THIN FILM STRUCTURES, Pages 335-344, S. MATTS GOHO, T.E. ORLOWSKI
OPTICAL SECOND HARMONIC GENERATION AS A PROBE OF INTERFACE COMPOSITION AND STRUCTURE, Pages 345-348, J.C. HAMILTON, R.J. ANDERSON
SLOW POSITRON ANNIHILATION SPECTROSCOPY OF HETEROJUNCTIONS AND HOMOJUNCTIONS OF GaAs-BASED SEMICONDUCTOR THIN FILMS, Pages 349-357, R.L. FROST, A.B. DEWALD, J.P. SCHAFFER, A. ROHATGI, B. NIELSEN, K.G. LYNN
PREPARATION AND CHARACTERIZATION OF REACTIVELY SPUTTERED SILICON NITRIDE THIN FILMS, Pages 359-366, S.K. GHOSH, T.K. HATWAR
THE BOND STRUCTURES AND PROPERTIES OF CHEMICALLY VAPOUR DEPOSITED AMORPHOUS SiC, Pages 367-374, YOUNG JIN PARK, YOUNG WOOK PARK, JOHN S. CHUN
WEAR OF Co–Ni THIN FILM MAGNETIC RECORDING TAPE AGAINST METALLIC AND CERAMIC SURFACES, Pages 375-385, D.R. SRINIVASAN, D.T. GAWNE, J.L.S. WALES
INSERT-MOUNTED THIN FILM SENSORS FOR REAL-TIME MONITORING OF TOOL CONDITIONS, Pages 387-396, W.P. ROBBINS, B. BISCHOFF, S. RAMALINGEN
Author Index, Pages 397-398
Subject Index, Pages 399-402