MEMS and Microstructures in Aerospace Applications

Contents......Page 7
1.1 INTRODUCTION......Page 9
1.2 IMPLICATIONS OF MEMS AND MICROSYSTEMS IN AEROSPACE......Page 10
1.3.1 DIGITAL MICRO-PROPULSION PROGRAM STS-93......Page 12
1.3.4 MEPSI......Page 13
1.4 MICROELECTROMECHANICAL SYSTEMS AND MICROSTRUCTURES IN AEROSPACE APPLICATIONS......Page 14
1.4.1 AN UNDERSTANDING OF MEMS AND THE MEMS VISION......Page 15
1.4.2 MEMS IN SPACE SYSTEMS AND INSTRUMENTATION......Page 16
1.4.3 MEMS IN SATELLITE SUBSYSTEMS......Page 17
1.4.4 TECHNICAL INSERTION OF MEMS IN AEROSPACE APPLICATIONS......Page 18
1.5 CONCLUSION......Page 19
REFERENCES......Page 20
2.1 INTRODUCTION......Page 21
2.2.1 NMP ST5 THERMAL LOUVERS......Page 24
2.2.2 JWST MICROSHUTTER ARRAY......Page 26
2.2.3 INCHWORM MICROACTUATORS......Page 28
2.2.4 NMP ST6 INERTIAL STELLAR CAMERA......Page 29
2.2.6 OTHER EXAMPLES OF SPACE MEMS DEVELOPMENTS......Page 31
2.3 POTENTIAL SPACE APPLICATIONS FOR MEMS TECHNOLOGY......Page 33
2.3.2 AFFORDABLE MICROSATELLITES......Page 34
2.3.3 SCIENCE SENSORS AND INSTRUMENTATION......Page 35
2.3.5 SPACE PARTICLES OR MORPHING ENTITIES......Page 36
2.4.2 FUTURE NEEDS......Page 37
2.5 CONCLUSIONS......Page 40
REFERENCES......Page 41
3.1 INTRODUCTION......Page 43
3.2 MEMS FABRICATION TECHNOLOGIES......Page 44
3.3 LIGA......Page 46
3.4 BULK MICROMACHINING......Page 48
3.4.1 WET ETCHING......Page 49
3.4.2 PLASMA ETCHING......Page 52
3.5 SACRIFICIAL SURFACE MICROMACHINING......Page 54
3.5.1 SUMMiT V™......Page 60
3.6 INTEGRATION OF ELECTRONICS AND MEMS TECHNOLOGY......Page 63
3.7.1 SILICON CARBIDE......Page 68
3.7.2 SILICON–GERMANIUM......Page 69
3.8 CONCLUSIONS......Page 70
REFERENCES......Page 71
4.1 INTRODUCTION......Page 75
4.2.1 THERMAL MECHANICAL EFFECTS......Page 76
4.2.2 MECHANICAL EFFECTS OF SHOCK, ACCELERATION, AND VIBRATION......Page 79
4.2.3 CHEMICAL EFFECTS......Page 80
4.2.4 ELECTRICAL STRESSES......Page 81
4.3 DESIGN THROUGH MISSION OPERATION ENVIRONMENTS......Page 82
4.4 SPACE MISSION-SPECIFIC ENVIRONMENTAL CONCERNS......Page 84
4.6 MILITARY SPECIFICATIONS AND STANDARDS REFERENCED......Page 89
REFERENCES......Page 90
5.1 INTRODUCTION......Page 91
5.1.1 THE SPACE RADIATION ENVIRONMENT......Page 92
5.1.2 EARTH ORBITS......Page 94
5.2 RADIATION EFFECTS......Page 99
5.2.1 SPACE RADIATION INTERACTION WITH MATERIALS AND DEVICES (IONIZATION)......Page 101
5.2.2 SPACE RADIATION INTERACTION WITH MATERIALS AND DEVICES (DISPLACEMENT DAMAGE)......Page 104
5.3 EXAMPLES OF RADIATION EFFECTS IN MEMS......Page 105
5.3.1 ACCELEROMETER......Page 106
5.3.2 MICROENGINE WITH COMB DRIVE AND GEARS......Page 109
5.3.3 RF RELAY......Page 111
5.3.4 DIGITAL MIRROR DEVICE......Page 113
5.5 CONCLUSION......Page 115
REFERENCES......Page 116
6.1 INTRODUCTION TO SPACE TECHNOLOGY DEVELOPMENT......Page 119
6.2.1 ‘‘SPIDER WEB’’ BOLOMETERS FOR HERSCHEL SPACE OBSERVATORY AND PLANCK SURVEYOR MISSIONS......Page 121
6.2.3 MEMS VIBRATORY GYROSCOPE......Page 122
6.2.5 CARBON NANOTUBE-BASED THERMAL INTERFACE......Page 124
6.2.6 RF MEMS SWITCH......Page 125
6.2.7 MICROCHEMICAL SENSORS......Page 126
6.2.8 MEMS VARIABLE EMITTANCE CONTROL INSTRUMENT......Page 127
6.2.10 FREE MOLECULE MICRO-RESISTOJET......Page 128
6.3.1 TECHNOLOGY MATURATION TEAM APPROACH......Page 130
6.3.2 LOW-COST, RAPID SPACE FLIGHT......Page 131
REFERENCES......Page 133
7.1 INTRODUCTION......Page 135
7.2 ELECTROMAGNETIC FIELD AND PARTICLE DETECTION FOR SPACE SCIENCE......Page 136
7.2.1 PLASMA PARTICLE SPECTROMETERS......Page 137
7.2.2 MAGNETOMETERS AND ELECTRIC FIELD DETECTORS......Page 140
7.3.1 THE JAMES WEBB SPACE TELESCOPE NEAR-IR SPECTROGRAPH......Page 142
7.3.2 ADAPTIVE OPTICS APPLICATIONS......Page 146
7.3.3 SPECTROMETER APPLICATIONS......Page 147
7.4 MEMS SENSORS FOR IN SITU ANALYSIS......Page 149
7.5 CONCLUSION......Page 150
REFERENCES......Page 151
CONTENTS......Page 157
8.2 MEMS RF SWITCHES FOR SPACECRAFT COMMUNICATION SYSTEMS......Page 158
8.2.1.1 Switch Configuration......Page 159
8.2.1.2 Contacting Modes......Page 161
8.2.1.3 Actuation Mechanism......Page 162
8.2.1.5 Fabrication Methods and Materials......Page 163
8.2.2.1 Figures of Merit......Page 164
8.2.2.3 Failure Modes......Page 165
8.3.1 SWITCHED-LINE PHASE SHIFTERS......Page 166
8.3.3 REFLECTION PHASE SHIFTERS......Page 167
8.5.1 ELECTRICALLY STEERED ANTENNAS......Page 169
8.5.2 FRACTAL ANTENNAS......Page 170
8.6 MEMS MIRRORS FOR FREE-SPACE OPTICAL COMMUNICATION......Page 171
8.6.1 FABRICATION ISSUES......Page 172
8.6.2 PERFORMANCE REQUIREMENTS......Page 174
8.6.3 PERFORMANCE TESTING FOR OPTICAL BEAMSTEERING......Page 176
8.7.1 OPTICAL BEAM STEERING......Page 177
8.7.2 RECENT PROGRESS......Page 181
REFERENCES......Page 184
9.1 INTRODUCTION......Page 191
9.2 PRINCIPLES OF HEAT TRANSFER......Page 192
9.2.1 CONDUCTION......Page 193
9.2.3 RADIATION......Page 194
9.3.1 SPACECRAFT THERMAL CONTROL HARDWARE......Page 196
9.3.2 HEAT TRANSFER IN SPACE......Page 197
9.4.1 THERMAL SENSORS......Page 199
9.4.2 MEMS LOUVERS AND SHUTTERS......Page 200
9.4.3 MEMS THERMAL SWITCH......Page 203
9.4.4 MICROHEAT PIPES......Page 205
9.4.5 MEMS PUMPED LIQUID COOLING SYSTEM......Page 206
9.4.6 MEMS STIRLING COOLER......Page 207
9.4.7 ISSUES WITH A MEMS THERMAL CONTROL......Page 208
REFERENCES......Page 209
10.1 INTRODUCTION......Page 211
10.2 MINIATURIZED MODULAR GN&C SUBSYSTEMS FOR MICROSATELLITES......Page 213
10.2.2 GSFC MICROSAT ATTITUDE AND NAVIGATION ELECTRONICS......Page 215
10.2.3 NMP ST6 INERTIAL STELLAR CAMERA......Page 216
10.3 MEMS ATTITUDE MEASUREMENT SENSORS......Page 219
10.3.1 MEMS MAGNETOMETERS......Page 220
10.3.3 EARTH SENSORS......Page 221
10.4 MEMS INERTIAL MEASUREMENT SENSORS......Page 222
10.4.1 MEMS GYROSCOPES......Page 224
10.4.2 A MEMS GYRO APPLICATION EXAMPLE: THE NASA/JSC AERCAM SYSTEM......Page 227
10.5 MEMS ATTITUDE CONTROL DEVICES......Page 228
10.6.1 MEMS ATOM INTERFEROMETERS FOR INERTIAL SENSING......Page 229
10.6.3 MEMS-BASED SENSITIVE SKIN FOR ROBOTIC SYSTEM CONTROL......Page 230
10.6.5 PRECISION TELESCOPE POINTING......Page 231
10.7 CONCLUSION......Page 232
REFERENCES......Page 234
CONTENTS......Page 237
11.1 INTRODUCTION......Page 238
11.2 ELECTRIC PROPULSION DEVICES......Page 241
11.2.1.1 Principle of Operation......Page 242
11.2.1.2 System Requirements......Page 243
11.2.2 VACUUM ARC THRUSTER......Page 244
11.2.2.1 Principle of Operation......Page 245
11.2.2.2 System Requirements......Page 246
11.2.3 FEEP......Page 247
11.2.3.1 Principle of Operation......Page 249
11.2.3.2 System Requirements......Page 250
11.2.4 LASER ABLATION THRUSTER......Page 251
11.2.4.1 Principle of Operation......Page 252
11.2.5 MICRO-ION THRUSTER......Page 254
11.2.5.1 Principle of Operation......Page 256
11.2.5.2 System Requirements......Page 257
11.2.6 MICRO-RESISTOJET......Page 258
11.2.6.1 Principle of Operation......Page 259
11.2.6.2 System Requirements......Page 260
11.2.7.1 Principle of Operation......Page 261
11.3 CHEMICAL PROPULSION......Page 263
11.3.1 COLD GAS THRUSTER......Page 264
11.3.1.2 System Requirements......Page 265
11.3.2.1 Principle of Operation......Page 267
11.3.3 MONOPROPELLANT THRUSTER......Page 268
11.3.3.1 Principle of Operation......Page 269
11.3.3.2 System Requirements......Page 270
11.4 RADIOISOTOPE PROPULSION......Page 271
11.5 CONCLUSION......Page 272
REFERENCES......Page 273
12.1 INTRODUCTION TO FUNCTIONS OF MEMS PACKAGES......Page 277
12.1.2.1 Simple — Mechanical Only......Page 278
12.1.3 ELECTRICAL CONNECTION TO OTHER SYSTEM COMPONENTS......Page 279
12.2.1 METAL PACKAGES......Page 280
12.2.2 CERAMIC PACKAGES......Page 281
12.2.4 PLASTIC PACKAGES......Page 282
12.3 PACKAGE-TO-MEMS ATTACHMENT......Page 283
12.4 THERMAL MANAGEMENT CONSIDERATIONS......Page 284
12.5.2 FLIP-CHIP......Page 286
12.5.3 SYSTEM ON A CHIP......Page 288
12.6.1 VARIABLE EMITTANCE COATING INSTRUMENT FOR SPACE TECHNOLOGY 5......Page 289
12.6.2 FLAT PLASMA SPECTROMETER FOR THE USAFA FALCONSAT-3......Page 290
12.6.3 MICROMIRROR ARRAYS FOR THE JAMES WEBB SPACE TELESCOPE......Page 292
12.7 CONCLUSION......Page 293
REFERENCES......Page 294
13.1 INTRODUCTION......Page 297
13.2 WAFER HANDLING......Page 298
13.3.2 HANDLING DURING RELEASE......Page 299
13.3.3 PACKAGING......Page 300
13.4 IN-PROCESS HANDLING AND STORAGE REQUIREMENTS......Page 301
13.5 ELECTROSTATIC DISCHARGE CONTROL......Page 302
13.6.1 CONTAMINATION CONTROL PROGRAM......Page 303
13.6.2 MEMS CONTAMINATION CONTROL......Page 304
13.6.4 MEMS PACKAGE CONTAMINATION CONTROL......Page 306
13.6.5 MEMS POSTPACKAGE CONTAMINATION CONTROL......Page 309
13.6.6 CONTAMINATION CONTROL ON SPACE TECHNOLOGY 5......Page 311
REFERENCES......Page 314
CONTENTS......Page 317
14.2 SCALING LAWS......Page 318
14.3 MATERIAL SELECTION......Page 319
14.4.2 DELAMINATION......Page 320
14.5.1 VIBRATION......Page 321
14.5.3 TEMPERATURE......Page 322
14.5.4 ATOMIC OXYGEN......Page 323
14.5.5 RADIATION......Page 324
14.5.7 VACUUM......Page 325
14.6.1 SINGLE CRYSTAL SILICON......Page 326
14.6.3 SILICON NITRIDE......Page 327
14.6.6 POLYCRYSTALLINE DIAMOND......Page 328
14.6.9 SU-8......Page 329
14.6.10 CP1®......Page 330
REFERENCES......Page 332
15.1 INTRODUCTION TO RELIABILITY PRACTICES FOR MEMS......Page 335
15.2 STATISTICALLY DERIVED QUALITY CONFORMANCE AND RELIABILITY SPECIFICATIONS......Page 336
15.3 PHYSICS OF FAILURE (POF) APPROACH......Page 337
15.4.1 MATERIAL INCOMPATIBILITIES......Page 339
15.4.2 STICTION......Page 340
15.4.4 FATIGUE......Page 341
15.5 ENVIRONMENTAL FACTORS AND DEVICE RELIABILITY......Page 342
15.5.1 COMBINATIONS OF ENVIRONMENTALLY INDUCED STRESSES......Page 343
15.5.2 THERMAL EFFECTS......Page 349
15.5.5 RADIATION......Page 350
15.5.6 ELECTRICAL STRESSES......Page 351
REFERENCES......Page 352
CONTENTS......Page 355
16.1.1 COMMERCIAL VS. SPACE ENVIRONMENT......Page 356
16.1.2 TAILORING OF TEST PLANS......Page 357
16.2.1 LIFE CYCLE ENVIRONMENT PROFILE......Page 358
16.2.2 DE-RATING AND REDUNDANCY......Page 359
16.3.1 DESIGN THROUGH FABRICATION......Page 360
16.3.2.2 MIL-STD-883 Test Method Standard, Microcircuits......Page 361
16.3.3 PACKAGING AND HANDLING......Page 364
16.4 REVIEWS......Page 366
16.5.1 SAMPLE ENVIRONMENTAL COMPONENT TEST REQUIREMENTS......Page 368
16.5.1.2 Test Documentation......Page 369
16.5.1.3 Test Methodology......Page 371
16.5.1.5 Acceptance Testing......Page 372
16.6 FINAL INTEGRATION......Page 373
REFERENCES......Page 374