Materials for Rigid and Flexible Printed Wiring Boards (Electrical and Computer Engineering)

Materials For Rigid And Flexible Printed Wiring Boards......Page 2
Electricaland Computer Engineering......Page 3
Acknowledgments......Page 11
Authors......Page 12
Contents......Page 14
Dedication......Page 20
1.1 Glass......Page 21
1.2.1 D- Glass......Page 22
1.2.2 E- Glass......Page 23
1.2.4 Quartz......Page 24
1.3 Glass Fiber Manufacturing......Page 25
1.5 Glass Types and Construction......Page 27
1.6.2 Twill Weave......Page 29
1.6.4 Basket Weave......Page 30
1.7 Surfacing Mat, Paper, or Veil......Page 31
1.9 Quartz......Page 32
1.10.2 Electrical Properties......Page 33
1.11.1 Nonwoven Aramid ( Thermount......Page 34
1.12 Constraining Dielectric Materials ( Kevlar)......Page 36
References......Page 39
2.0 Introduction......Page 40
2.1 Polyester Resin......Page 41
2.2 Epoxy......Page 42
2.2.1 Difunctional Epoxy......Page 43
2.2.2 Multifunctional Epoxy......Page 44
2.2.2.2 Higher- Performance Multifunctional Epoxies with a Tg between 150 and 165   C......Page 45
2.2.4 Curing Agent......Page 46
2.2.5 High- Tg Epoxy......Page 49
2.3 Polyimide......Page 50
2.3.1 Epoxy- Blended Polyimide......Page 51
2.4.1 Cyanate Ester Resins......Page 52
2.5 Polyphenylene Oxide ( PPO) Epoxy Blends......Page 53
2.6 Polytetrafluoroethylene Resin ( PTFE)......Page 54
References......Page 56
3.0 Introduction......Page 57
3.1.1 Polyethylene Terephthalate ([ PET] Polyester)......Page 58
3.1.3 Fluorocarbons ( FEP)......Page 60
3.1.4 Polyimide......Page 62
3.1.4.2 Dimensional Stability......Page 63
3.1.5 Aramid......Page 64
3.2 Adhesives......Page 66
3.2.1 Types and Use of Adhesive......Page 67
3.2.2.1.3 Acrylic Adhesive......Page 68
3.2.3 Adhesiveless Systems......Page 70
3.2.3.3 Direct Vapor/ Sputter Metallization onto Polyimide Film......Page 71
3.2.4.1 Electrical Advantage......Page 72
3.3 Cover Coat/ Cover Layer......Page 73
3.5 Conductive Materials......Page 75
3.5.1 Electrodeposited Copper......Page 76
3.6 Copper- Clad Laminates......Page 77
References......Page 81
4.1 Electrodeposited Copper Foil ( also called ED foil)......Page 82
4.2.1 Fabricating Rolled Copper Foils......Page 84
4.2.2.2 Foil Processing......Page 86
4.3.1.2 Grade- 2 or High- Ductility Electrodeposited Foils ( HDE- Type E)......Page 88
4.3.1.3 Grade- 3 or High- Temperature Elongation Foil ( HTE- Type E)......Page 89
4.3.2.2 Grade- 6 or Light Cold Rolled Wrought ( LCR- Type W Special Temper)......Page 90
4.3.2.3 Grade- 7 or Rolled Annealed Wrought ( ANN- Type W)......Page 91
4.4 Nickel Foil......Page 92
References......Page 93
5.1.1 Paper- Based Laminates......Page 94
5.1.2.1 XPC......Page 95
5.1.2.4 FR- 2......Page 96
5.2 Composite Laminates......Page 97
5.2.1 Reinforcing Mats......Page 99
5.2.1.3 Polyester Glass Mat......Page 103
5.2.2.3 CRM- 5......Page 104
5.2.3 Storage......Page 105
5.3 Rigid Laminates ( Glass- Reinforced)......Page 109
5.3.2 Laminate Thickness......Page 111
5.4.1 Epoxy Laminate ( FR- 4)......Page 112
5.4.1.1 Difunctional Epoxies......Page 113
5.4.2 Cyanate Ester......Page 115
5.4.3.1 Polyimide/ Glass......Page 117
5.4.3.3 Polyimide Quartz......Page 118
5.5.1 Epoxy Thermount......Page 119
5.5.2 Epoxy on Woven Kevlar......Page 121
5.6.1 Manufacturing Prepreg......Page 123
5.7.2 Semiadditive Laminates......Page 124
5.7.2.2 Unclad......Page 125
5.7.2.4 Catalytic or Seeded......Page 126
References......Page 127
6.1 High- Speed/ High- Frequency Laminates......Page 129
6.1.3 Two Major Classes of Reinforcements......Page 130
6.1.4 Goal of Each Application Area......Page 131
6.3.1 Polytetrafluoroethylene Laminates......Page 132
6.3.3 New Fluoropolymer Composite Materials......Page 136
6.4.1 GRN Type Laminates with Glass Microfibers......Page 138
6.4.1.1 GRN Type Laminates with Nonwoven Fiberglass......Page 139
6.4.3 Type GXN Laminates with E- Glass......Page 140
6.4.4 GYN Type Laminates with E- Glass......Page 141
6.4.5 High- Dk ( 6.0 to 10.5) Laminates with E- Glass......Page 142
6.4.6 Temperature- Stable Dielectric Constant and Low- CTE Laminates with E- Glass......Page 143
6.4.7 Commercial- Grade Laminates......Page 144
6.5.1 Cross- Plied and Non- Cross- Plied Construction ( meet type GT)......Page 145
6.7 Dimensional Stability......Page 146
References......Page 147
7.0 Introduction......Page 148
7.1 Copper- Invar- Copper ( CIC)......Page 149
7.2 Copper- Molybdenum- Copper ( CMC)......Page 150
7.3 Silicon Carbide - Reinforced Aluminum ( SiC/ Al)......Page 153
7.4 Coefficient of Thermal Expansion Trade- Offs ( CTE)......Page 155
References......Page 156
A. 2 Coefficient of Thermal Expansion (CTE) and Thermal Coefficient of Expansion ( TCE) Have the Same Meaning......Page 157
A. 5 Coordinates......Page 158
A. 10 Dielectric Constant ( Dk [ Also Called Permittivity or Er])......Page 159
A. 12 Dimensional Stability......Page 160
A. 16 Flammability......Page 161
A. 18.1 Typical Tg Values for Common Resin Systems......Page 162
A. 22 Moisture Absorption......Page 163
A. 26 Tg (see A.18)......Page 164
A. 28 X, Y, Z (see A.5)......Page 165