Introduction to Flexible Electronics

Cover
Half Title
Title Page
Copyright Page
Contents
Preface
Author
PART I: Introduction
	Chapter 1: Introduction
		1.1. The Semiconductor Revolution
		1.2. History of Flexible Electronics
		1.3. Need for Flexible Electronics
		1.4. Example Applications
	Chapter 2: Physics of Flexible Electronics
		2.1. Why Are Things Flexible?
		2.2. Bending Radius and Curvature
		2.3. Plate Flexure
			2.3.1. Flexure
			2.3.2. Buckling
		2.4. The Ball-Spring Model
		2.5. Flexibility in Polymers
		Exercises
	Chapter 3: Semiconductor Basics
		3.1. The Silicon Atom
		3.2. The Silicon Lattice
		3.3. Doping Silicon
		3.4. Semiconductor Fabrication Techniques
			3.4.1. The Silicon Wafer
			3.4.2. Deposition
			3.4.3. Lithography
			3.4.4. Etching
		3.5. Silicon Transistors
			3.5.1. Thin-Film Transistors
		Exercises
PART II: Materials
	Chapter 4: Flexible Silicon
		4.1. The Story of Silicon
		4.2. Silicon Substrates
			4.2.1. Crystallography
			4.2.2. Charge Transport
			4.2.3. Semiconductor/Oxide Interface
		4.3. Flexible Monocrystalline Silicon
			4.3.1. Device-Last Approach
			4.3.2. Device-First Approach
				4.3.2.1. Top-Down Method
				4.3.2.2. Bottom-Up Method
		4.4. Silicon TFTs
		Exercises
	Chapter 5: Organic Electronic Materials
		5.1. Introduction
		5.2. Conduction in Organic Molecules
		5.3. Properties of Organic Conduction
			5.3.1. Carrier Mobility
			5.3.2. Electron-Hole Stability
			5.3.3. Polaron Transport
		5.4. Organic Small Molecules
		5.5. Organic Polymers
			5.5.1. Copolymers
		5.6. Organic Thin Film Deposition
		5.7. Organic Single-Crystals
		5.8. Organic Field-Effect Transistors (OFETs)
		Exercises
	Chapter 6: Metal Oxide Semiconductors
		6.1. Introduction
		6.2. Metal Oxide Semiconductor Properties
		6.3. Ternary and Quaternary Metal Oxides
		6.4. Deposition Techniques
			6.4.1. Vacuum Deposition
			6.4.2. Solution Processing
		6.5. Metal Oxide TFTs
			6.5.1. Wavy Channel TFTs
		Exercises
	Chapter 7: III-V Semiconductors
		7.1. Introduction
		7.2. Properties
		7.3. III-V Wafers
			7.3.1. Epitaxy
		7.4. Flexible III-V Semiconductors
		7.5. III-V Thin Films
		Exercises
	Chapter 8: Nanostructured Materials
		8.1. Introduction
		8.2. Two-Dimensional Materials
			8.2.1. Graphene
			8.2.2. Transition Metal Dichalcogenides (TMDs)
			8.2.3. Hexagonal Boron Nitride (H-BN)
			8.2.4. Other 2D Materials
		8.3. One-Dimensional Materials
			8.3.1. Carbon Nanotubes (CNTs)
			8.3.2. Metal Nanowires
			8.3.3. Semiconducting Nanowires
			8.3.4. Other 1D Materials
		8.4. Zero-Dimensional Materials
			8.4.1. Metal Nanoparticles
			8.4.2. Semiconducting Nanoparticles
		Exercises
PART III: Integration Strategies
	Chapter 9: Substrates, Transfer, and Bonding
		9.1. Introduction
		9.2. Flexible Substrates
			9.2.1. Metal Foil Substrates
			9.2.2. Flexible Glass Substrates
			9.2.3. Polymer Substrates
		9.3. Transfer Printing
			9.3.1. Viscoelastic Stamp
			9.3.2. Thermal Release Stamp
			9.3.3. Solvent Release Stamp
		9.4. Adhesive Bonding
		Exercises
	Chapter 10: Barriers, Insulators, and Packaging
		10.1. Introduction
		10.2. Barrier Thin Films
			10.2.1. Permeation Mechanisms
			10.2.2. Barrier Materials
		10.3. Flexible Dielectrics
			10.3.1. Inorganic Dielectrics
			10.3.2. Organic Dielectrics
			10.3.3. Hybrid Dielectrics
		10.4. Packaging Strategies
		Exercises
	Chapter 11: Flexible Printed Circuit Boards
		11.1. Introduction
		11.2. Flexible PCB Design
			11.2.1. Flexible PCB Materials
			11.2.2. Flexible PCB Fabrication Process
		11.3. Flexible Hybrid Electronic (FHE) Systems
			11.3.1. Small Silicon Chips
			11.3.2. Rigid-Flex Integration
		11.4. Fully Flexible Systems
		Exercises
	Chapter 12: Printed Electronics
		12.1. Introduction
		12.2. Ink Formulation
		12.3. Inkjet Printing
			12.3.1. Jet Formation
		12.4. Other 2D Printing Techniques
		12.5. Three-dimensional (3D) Printed Electronics
		12.6. Nanoimprint Lithography
			12.6.1. Self-Aligned Imprint Lithography (SAIL)
		Exercises
PART IV: Applications
	Chapter 13: Flexible Processors
		13.1. Introduction
		13.2. Conventional Electronics
			13.2.1. Dimensional Scaling
			13.2.2. CMOS Technology
		13.3. Flexible Transistors
			13.3.1. Organic Semiconductors
			13.3.2. Metal Oxide Semiconductors
			13.3.3. Nanostructured Semiconductors
		13.4. Flexible Circuits
		Exercises
	Chapter 14: Flexible Memory
		14.1. Introduction
		14.2. Volatile Memory
			14.2.1. Conventional Volatile Memory
			14.2.2. Flexible Volatile Memory
		14.3. Non-Volatile Memory
			14.3.1. Conventional Non-Volatile Memory
			14.3.2. Flexible Non-Volatile Memory
				14.3.2.1. Flexible ReRAM
				14.3.2.2. Flexible FeRAM
				14.3.2.3. Flexible PCRAM
				14.3.2.4. Flexible Flash Memory
		Exercises
	Chapter 15: Flexible Displays
		15.1. Introduction
		15.2. Conventional Displays
		15.3. Flexible Displays
			15.3.1. Organic LEDs
			15.3.2. Flexible AMOLED Displays
			15.3.3. Other Flexible Display Technologies
		Exercises
	Chapter 16: Flexible Energy Generation and Storage Devices
		16.1. Introduction
		16.2. Energy Generation
			16.2.1. Photovoltaic Devices
				16.2.1.1. Flexible Inorganic Photovoltaics
				16.2.1.2. Flexible Organic Photovoltaics
			16.2.2. Energy Harvesting Devices
		16.3. Energy Storage
			16.3.1. Flexible Batteries
			16.3.2. Flexible Supercapacitors
		Exercises
	Chapter 17: Flexible Sensors and Actuators
		17.1. Introduction
		17.2. Flexible Sensors
			17.2.1. Temperature Sensors
			17.2.2. Strain Sensors
			17.2.3. Pressure Sensors
			17.2.4. Other Sensors
		17.3. Flexible Actuators
			17.3.1. Microelectromechanical Systems (MEMs)
			17.3.2. Electroactive Polymers (EAPs)
				17.3.2.1. Dielectric Elastomer Actuators (DEAs)
			17.3.3. Piezoelectric Actuators
			17.3.4. Shape Memory Alloys
		Exercises
PART V: The Road Ahead
	Chapter 18: Stretchable Electronics
		18.1. Why Stretchable?
		18.2. Imparting Stretchability
			18.2.1. Stretchability by Material
			18.2.2. Stretchability by Design
		18.3. Stretchable Conductors
			18.3.1. Polymer Composites
			18.3.2. Metal Springs
			18.3.3. Liquid Metals
		18.4. Some Stretchable Electronics Applications
		Exercises
	Chapter 19: Reliability and Future Outlook
		19.1. Introduction
		19.2. Reliability in Flexible Electronics
		19.3. Future Outlook
References
Index