Interfacial Science in Ceramic Joining

Front Matter....Pages i-xiv
Front Matter....Pages 1-1
Structure, Composition and Thermal Stability of the Cu/Al 2 O 3 Interface....Pages 3-14
Diffusion Bonding of Si 3 N 4 -Ceramic to Transition Metals: Interfacial Microchemistry....Pages 15-25
Improvement of Wetting and Bonding of Dissimilar Materials....Pages 27-42
Front Matter....Pages 43-43
Wetting and Interfaces in Metal-Oxide Systems: Sensitivity to Experimental Conditions....Pages 45-55
Kinetics of Spreading of Some Metal Melts over Covalent Ceramic Surfaces....Pages 57-67
Chemical Interaction at the Initial Stage of Spreading....Pages 69-77
Wettability under Non-Reactive and Reactive Conditions in the Systems Ni/YSZ and Ni/Ti-TiO 2 /YSZ....Pages 79-86
Wettability of TiB 2 Ceramics by Liquid Cu and Ag-Cu Eutectic Alloys....Pages 87-94
Front Matter....Pages 95-95
The Brazing of Ceramics....Pages 97-109
Transient Liquid Phase (TLP) Routes to the Joining of Structural Ceramics....Pages 111-134
Joining of Si 3 N 4 Using Al and Ni Interlayers....Pages 135-142
Metallic Reaction for Joining of SiC Ceramics....Pages 143-150
Front Matter....Pages 151-151
Alumina — Aluminium Interfaces....Pages 153-160
Diffusion Processes at Liquid Metal/Ceramic Interfaces....Pages 161-168
Role of Interfacial and Strain Energy for the Formation of Native Metal-Oxide Interfaces....Pages 169-181
Phase Formation at Metal-Ceramic Interfaces....Pages 183-194
TEM Examinations of B 13 O 2 /Al Reaction Zone....Pages 195-202
Interfacial Reaction Kinetics of Silicon Nitride/Iron Alloys Diffusion Couples in the Range 1050°C/1250°C....Pages 203-209
The Role of Intergranular Phases in Silicon Nitride and Silicon Carbide Direct Joining....Pages 211-222
Interdiffusion at Metal/Oxide Interfaces Studied in Thin-Film Structures with AES Depth Profiling....Pages 223-232
Front Matter....Pages 151-151
FT-IR and FT-Raman Study of Surfaces and Thin Layers....Pages 233-245
Front Matter....Pages 247-247
Interfaces and Structural Integrity of Ceramic/Metal Joints....Pages 249-265
Fracture Criteria for Interface Cracks. A Case Study....Pages 267-279
Interfaces in High-Strength, High-Temperature Ceramic Joints....Pages 281-293
Dissipation Analysis of Interface Failure of Bimaterials....Pages 295-310
Calculation and Experimental Determination of the Residual Stresses in a Metal-Ceramic Bond....Pages 311-318
Application of the Blister Test to Adhesion Energy Measurements in Metal/Ceramic Film-on-Substrate Systems....Pages 319-327
Microstructure, Mechanical Properties and Stability of Brazed Metal/Ceramic Systems....Pages 329-340
Joining of Silicon Nitride Ceramics to Titanium Alloy with an Interlayer....Pages 341-348
Layered Composites — Relationship between Residual Stresses and Fracture Behaviour....Pages 349-356
Adhesion in Steel/Silicate Glass System....Pages 357-364
Front Matter....Pages 365-365
Reactive Coatings on Ceramic Substrates....Pages 367-381
Fabrication of Metal/Oxide Ceramic Functionally Graded Materials by Slip Casting....Pages 383-398
The Joining of Alumina Membranes....Pages 399-404
Joining Ceramics Using Preceramic Polymers....Pages 405-413
Front Matter....Pages 415-415
The Importance of the Ceramic Interface in Electronic Applications....Pages 417-428
Interaction of MLC BaTiO 3 Based Ceramic with Silver Termination Ink....Pages 429-442
Influence of Boundaries on Ionic Conductance....Pages 443-455
Interface Effects in Ferroelectric Thin Films....Pages 457-464
Characterisation of the Metal-Ceramic Direct Soldering by the Metal-Metal Diffusion Method....Pages 465-472
Back Matter....Pages 473-480