Hybrid circuit design and manufacture

Cover......Page 1
Half Title......Page 2
Series Page......Page 3
Title Page......Page 4
Copyright Page......Page 5
Foreword......Page 6
Preface......Page 8
Contents......Page 10
 1.3 Why Hybrids?......Page 14
 1.5 Comparison with Discrete and Integrated Circuit Technologies......Page 17
 1.6 Hybrid Film Technologies......Page 19
 2.1 Substrate Properties......Page 22
 2.2 Substrate Materials......Page 23
 2.3 Electrical Substrate Specifications......Page 26
 2.4 Mechanical Substrate Specifications......Page 30
 2.5 Substrate Fabrication: Alumina......Page 32
 3.2 Thick-Film Conductors......Page 35
 3.3 Thick-Film Dielectrics......Page 40
 3.4 Thick-Film Resistors......Page 42
 3.5 Thick-Film Processing......Page 44
 4.2 Screening Reference Corner and Screening Procedure......Page 50
 4.3 Basic Design Rules for Thick-Film Resistors......Page 53
 4.4 Basic Design Rules for Thick-Film Conductors......Page 61
 4.5 Basic Design Rules for Thick-Film Capacitors......Page 71
 5.2 Thin-Film Processes......Page 75
 5.3 Thin-Film Conductor Materials......Page 79
 5.6 Thin-Film Processing (Conductor-Resistor Networks)......Page 80
 5.7 Environmental Protection of Thin-Film Resistors......Page 84
 6.1 Description of Thin-Film Resistors......Page 85
 6.3 Description of Thin-Film Capacitors and Crossovers......Page 88
 6.4 Thin-Film Snapstrates......Page 92
 7.1 The Need for Trimming......Page 94
 7.2 The Laser Trimming Process......Page 95
 7.3 Laser Trim System......Page 96
 7.4 Resistance Measurement Techniques......Page 98
 7.5 Trim Information for Top-Hat Resistors......Page 101
 8.2 Components Used in Hybrid Assembly......Page 108
 8.3 Assembly Techniques......Page 116
 8.4 Packaging......Page 128
 9.1 Documentation......Page 131
 9.2 Inspection and Reliability......Page 132
 9.4 Labor Aspects......Page 133
 9.6 In-House or External Manufacturing......Page 135
 10.2 Cooling Phenomena......Page 137
 10.3 Cooling of Hybrid Microcircuits......Page 138
 10.4 Analytical Techniques......Page 139
 10.5 Thermal Conductivity of Materials......Page 146
 10.6 Film Resistor Power Densities......Page 147
 10.7 Factors for Good Thermal Design......Page 149
 11.1 Partitioning......Page 151
 11.2 Monolithic, Hybrid, or Discrete?......Page 152
 11.3 Thick or Thin Film?......Page 154
 12.2 Circuit Analysis and Simulation......Page 157
 12.3 Layout......Page 159
 12.5 Test and Redesign......Page 160
 12.6 Reliability and Life Tests......Page 161
 12.7 Testing of Hybrid Circuits......Page 162
 12.8 Overall Design Cycle......Page 163
 13.2 Reliability Data......Page 165
 13.3 Reliability Definitions......Page 166
 13.4 Constant Failure Rate......Page 168
 13.6 Establishing Reliability Goals......Page 171
 13.7 Reliability Testing......Page 173
 13.8 Failure Mechanisms in Hybrids......Page 175
 13.10 Other Reliability Tests......Page 176
Glossary of Terms......Page 178
Index......Page 222