Heat management in integrated circuits : on-chip and system-level monitoring and cooling

Content: Machine generated contents note: 1.Heat in integrated circuits and systems --
1.1.Technology trends driving thermal issues --
1.1.1.Design closure concerns --
1.1.2.Reliability concerns --
1.1.3.Performance concerns --
1.1.4.Cost-and user-driven, economic concerns --
1.2.Heat dissipation in chips --
1.2.1.Examples of thermal responses in high-performance chips --
1.2.2.Heat dissipation paths --
References --
2.On-chip temperature sensing --
2.1.Operational conditions and performance specifications for on-chip temperature sensors --
2.2.Analog sensors --
2.2.1.Thermal diode-based sensors --
2.2.2.Resistive sensors --
2.2.3.Thermocouples and thermopiles --
2.2.4.Other types of analog sensors --
2.3.Digital sensors --
2.3.1.MOSFET-based voltage/current output sensors --
2.3.2.Time-to-temperature (delay-line) sensors --
2.3.3.Leakage-based temperature sensors --
2.4.Sensor front-end --
2.4.1.Sigma-Delta ADCs for temperature sensors --
2.4.2.SAR ADCs for temperature sensors --
Note continued: 2.4.3.PTDCs for temperature sensors --
2.5.Design challenges for sensors --
2.5.1.Ideality and linearity --
2.5.2.Robustness against variations --
2.5.3.Calibration --
2.6.Improving temperature monitoring accuracy with systematic placement --
2.6.1.Enhancing uniform grids with interpolation --
2.6.2.Non-uniform sensor allocation and placement --
2.6.3.Sensor allocation and placement for reconfigurable fabrics --
2.6.4.Recent developments in sensor allocation and placement --
2.7.Indirect temperature sensing --
References --
3.Dynamic thermal management --
3.1.Interfacing temperature sensors and DTM systems --
3.1.1.Biasing networks for temperature sensors --
3.1.2.Communication networks for temperature sensor outputs --
3.2.Dynamic power and thermal management using on-chip temperature sensor feedback in industrial designs --
3.2.1.Early methods for DTM --
3.2.2.Second-generation methods for DTM --
3.2.3.Latest generation methods for DTM --
Note continued: 3.3.Methods on the use of on-chip temperature sensor feedback for dynamic optimizations beyond commercial designs --
3.3.1.Hardware-based thermal management --
3.4.Guiding thermal management for memory systems with feedback from on-chip temperature sensors --
3.4.1.Using sensor feedback for DRAM refresh and write timing optimization --
3.4.2.Using sensor feedback in architectural optimizations for DRAMs --
3.4.3.Using sensor feedback for thermal management in hard drives --
3.5.A closer look at the control systems for thermal management --
3.5.1.Closed loop (feedback) controller --
3.5.2.Stochastic control --
3.5.3.Model predictive control --
References --
4.Active cooling --
4.1.Air cooling --
4.1.1.Managing cooling fans --
4.1.2.Beyond fan-based forced air cooling systems --
4.2.Liquid cooling --
4.2.1.Optimization of efficiency and cost of liquid cooling systems --
4.2.2.Liquid cooling in 3D ICs --
4.2.3.Direct liquid cooling --
Note continued: 4.3.Thermoelectric cooling --
4.3.1.Principles of operation and performance metrics for TEC devices --
4.3.2.Design of latest generation on-chip coolers --
4.3.3.A theoretical analysis framework for thermoelectric coolers --
4.3.4.Using TEC devices for thermal management of ICs --
4.4.Phase change cooling --
References --
5.Mitigating thermal events at the system level and above --
5.1.Mitigating heat dissipation at the OS level --
5.1.1.Thermal-aware optimizations --
5.2.OS-level thermal policies for embedded and real-time systems --
5.3.Thermal-aware virtualization --
5.4.The role of the application layer in shaping thermal profiles --
5.5.Thermal-aware optimizations in datacenters and supercomputers --
5.5.1.Characterization of heat dissipation in data centers and performance metrics --
5.5.2.Software environments and provisioning at the system-level for thermal-aware management --
References --
6.Emerging directions in thermal-aware systems --
Note continued: 6.1.Considering user comfort in thermal design --
6.2.Thermal harvesting from within integrated circuits --
6.3.New materials and designs for on-chip temperature sensors --
6.4.Hardware security --
References.