Handbook of Wafer Bonding

Content: 
Chapter 1 Glass Frit Wafer Bonding (pages 1–17): Roy Knechtel
Chapter 2 Wafer Bonding Using Spin?On Glass as Bonding Material (pages 19–32): Viorel Dragoi
Chapter 3 Polymer Adhesive Wafer Bonding (pages 33–61): Frank Niklaus and Jian?Qiang Lu
Chapter 4 Anodic Bonding (pages 63–80): Adriana Cozma Lapadatu and Kari Schjolberg?Henriksen
Chapter 5 Direct Wafer Bonding (pages 81–100): Manfred Reiche and Ulrich Gosele
Chapter 6 Plasma?Activated Bonding (pages 101–118): Maik Wiemer, Dirk Wuensch, Joerg Braeuer and Thomas Gessner
Chapter 7 Au/Sn Solder (pages 119–138): Hermann Oppermann and Matthias Hutter
Chapter 8 Eutectic Au?In Bonding (pages 139–159): Mitsumasa Koyanagi and Makoto Motoyoshi
Chapter 9 Thermocompression Cu?Cu Bonding of Blanket and Patterned Wafers (pages 161–180): Kuan?Neng Chen and Chuan Seng Tan
Chapter 10 Wafer?Level Solid–Liquid Interdiffusion Bonding (pages 181–214): Nils Hoivik and Knut Aasmundtveit
Chapter 11 Hybrid Metal/Polymer Wafer Bonding Platform (pages 215–236): Jian?Qiang Lu, J. Jay McMahon and Ronald J. Gutmann
Chapter 12 Cu/SiO2 Hybrid Bonding (pages 237–259): Lea Di Cioccio
Chapter 13 Metal/Silicon Oxide Hybrid Bonding (pages 261–278): Paul Enquist
Chapter 14 Microelectromechanical Systems (pages 279–299): Dr. Maaike M. V. Taklo
Chapter 15 Three?Dimensional Integration (pages 301–328): Philip Garrou, Prof. Dr. James Jian?Qiang Lu and Dr. Peter Ramm
Chapter 16 Temporary Bonding for Enabling Three?Dimensional Integration and Packaging (pages 329–345): Rama Puligadda
Chapter 17 Temporary Adhesive Bonding with Reconfiguration of Known Good Dies for Three?Dimensional Integrated Systems (pages 347–354): Armin Klumpp and Dr. Peter Ramm
Chapter 18 Thin Wafer Support System for above 250°C Processing and Cold De?Bonding (pages 355–365): Werner Pamler and Franz Richter
Chapter 19 Temporary Bonding: Electrostatic (pages 367–384): Christof Landesberger, Armin Klumpp and Karlheinz Bock