Explosion Resistant Design of Offshore Structures

Content:
 Front Matter 
• Preface to the Sixth Edition 
• Table of Contents 
•Section 1. Introduction 1. The Failure Analysis Process 
•Section 2. Failure Analysis Process Overviews 2. System Level Failure Analysis Process: Making Failure Analysis a Value Add Proposition in Today\'s High Speed Low Cost PC Environment 
 3. Board Level Failure Mechanisms and Analysis in Hand-Held Electronic Products 
 4. Failure Analysis Flow for Package Failures 
 5. Chip-Scale Packages and Their Failure Analysis Challenges 
 6. Wafer Level Failure Analysis Process Flow 
 7. Failure Analysis of Microelectromechanical Systems (MEMS) 
 8. Failure Analysis and Reliability of Optoelectronic Devices 
 9. Solar Photovoltaic Module Failure Analysis 
 10. DRAM Failure Analysis and Defect Localization Techniques 
 11. Failure Analysis of Passive Components 
•Section 3. Failure Analysis Topics 12. Reliability and Quality Basics for Failure Analysts 
 13. Electronics and Failure Analysis 
 14. Submicron CMOS Devices 
 15. Analog Device and Circuit Characterization 
 16. Screening for Counterfeit Electronic Parts 
•Section 4. Fault Verification and Classification 17. An Overview of Analog Design for Test and Diagnosis 
 18. An Overview of Integrated Circuit Testing Methods 
 19. Diagnosis of Scan Logic and Diagnosis Driven Failure Analysis 
 20. Interpretation of Power DMOS Transistor Characteristics Measured with Curve Tracer 
 21. High-Volume Scan Analysis: Methods to Avoid Failure Analysis 
 22. Differentiating between EOS and ESD Failures for ICs 
 23. The Power of Semiconductor Memory Failure Signature Analysis 
•Section 5. Localization Techniques 24. Beam-Based Defect Localization Techniques 
 25. Electron Beam Probing 
 26. Failure Localization with Active and Passive Voltage Contrast in FIB and SEM 
 27. Fundamentals of Photon Emission (PEM) in Silicon - Electroluminescence for Analysis of Electronic Circuit and Device Functionality 
 28. Picosecond Imaging Circuit Analysis - PICA 
 29. Current Imaging Using Magnetic Field Sensors 
 30. Thermal Defect Detection Techniques 
 31. Thermal Failure Analysis by IR Lock-in Thermography 
 32. Principles of Thermal Laser Stimulation Techniques 
 33. Introduction to Laser Voltage Probing (LVP) of Integrated Circuits 
 34. CAD Navigation in FA and Design/Test Data for Fast Fault Isolation 
 35. Acoustic Microscopy of Semiconductor Packages 
 36. Electronic Package Fault Isolation Using TDR 
•Section 6. Deprocessing and Sample Preparation 37. Delayering Techniques: Dry Processes Wet Chemical Processing and Parallel Lapping 
 38. The Art of Cross Sectioning 
 39. Delineation Etching of Semiconductor Cross Sections 
 40. Special Techniques for Backside Deprocessing 
 41. Deprocessing Techniques for Copper, Low K, and SOI Devices 
•Section 7. Inspection 42. Optical Microscopy 
 43. Scanning Electron Microscopy 
 44. Ultra-High Resolution in the Scanning Electron Microscope 
 45. Transmission Electron Microscopy for Failure Analysis of Semiconductor Devices 
 46. X-ray Imaging Tools for Electronic Device Failure Analysis 
 47. Atomic Force Microscopy: Modes and Analytical Techniques with Scanning Probe Microscopy 
•Section 8. Materials Analysis 48. Energy Dispersive X-ray Analysis 
 49. Analysis of Submicron Defects by Auger Electron Spectroscopy (AES) 
 50. SIMS Solutions for Next Generation IC Processes and Devices 
•Section 9. Focused Ion Beam Applications 51. Focused Ion Beam (FIB) Systems: A Brief Overview 
 52. Circuit Edit at First Silicon 
 53. The Process of Editing Circuits through the Bulk Silicon 
•Section 10. Management and Reference Information 54. Education and Training for the Analyst 
 55. Management Principles and Practices for the Failure Analysis Laboratory 
 56. Managing the Unpredictable - A Business Model for Failure Analysis Service 
 57. Failure Analysis Terms and Definitions 
 Author Index 
 Subject Index