Energy management handbook

EEn......Page 0
PRACTICAL GUIDE TO THE PACKAGING OF ELECTRONICS......Page 1
PREFACE......Page 5
ACKNOWLEDGMENTS......Page 6
CONTENTS......Page 7
ISSUES IN ELECTRONICS PACKAGING DESIGN......Page 10
PACKAGING/ENCLOSURE DESIGN......Page 11
RELIABILITY......Page 12
BASIC EQUATIONS AND CONCEPTS......Page 13
GENERAL EQUATIONS......Page 14
GRASHOF NUMBER......Page 15
REYNOLDS NUMBER......Page 16
CHAPTER 3 CONDUCTIVE COOLING......Page 17
SAMPLE PROBLEM AND CALCULATIONS......Page 18
SAMPLE PROBLEM AND CALCULATIONS......Page 19
TEMPERATURE AT INTERMEDIATE POINTS......Page 22
EXERCISE: 1C TEMPERATURE DETERMINATION......Page 23
HEAT SPREADING......Page 26
EXAMPLE......Page 27
JUNCTION-TO-CASE RESISTANCE......Page 28
MODELING THE INTERFACE......Page 29
EXERCISE - CALCULATE THE COMPONENT TEMPERATURE......Page 30
A SECOND APPROACH......Page 32
A THIRD APPROACH......Page 33
2-D OR 3-D HEAT CONDUCTION......Page 35
FACTORS INFLUENCING RADIATION......Page 40
SURFACE PROPERTIES......Page 41
VIEW FACTOR CALCULATIONS......Page 42
ELECTRONICS PACKAGING PROBLEM......Page 44
FLOW IN A VERTICAL OPEN-ENDED CHANNEL......Page 49
CABINET SURFACE TEMPERATURE......Page 50
CHAPTER 5 FUNDAMENTALS OF CONVECTIVE COOLING......Page 52
FLOW REGIMES, TYPES AND INFLUENCES......Page 54
FREE (OR NATURAL) CONVECTION......Page 55
ESTIMATES OF HEAT TRANSFER COEFFICIENT......Page 56
APPROACH 2......Page 59
DESIGN TIPS......Page 62
CABINET INTERIOR AND SURFACE TEMPERATURE......Page 63
HEAT BALANCE......Page 64
BASIC PROCEDURE......Page 67
CALCULATION OF INTERNAL TEMPERATURE......Page 68
FIN DESIGN......Page 70
FORCED CONVECTION......Page 71
THE REQUIRED FLOW RATE......Page 73
BOARD SPACING AND CONFIGURATIONS......Page 76
ELEMENTS IN PARALLEL:......Page 78
SYSTEM\'S IMPEDANCE CURVE......Page 80
FAN SELECTION AND FAN LAWS......Page 84
COMPONENT HOT SPOT......Page 87
INDIRECT FLOW SYSTEM DESIGN......Page 91
RESISTANCE NETWORK REPRESENTATION......Page 92
CHAPTER 6 BASICS OF SHOCK AND VIBRATION......Page 94
HARMONIC MOTION......Page 95
VIBRATION TERMINOLOGY......Page 96
FREE VIBRATION......Page 98
FIRST APPLICATION......Page 99
SECOND APPLICATION......Page 102
MODE SHAPES......Page 103
IMPACT OF DAMPING......Page 105
FORCED VIBRATION......Page 107
SAMPLE PROBLEM......Page 110
EXAMPLE 1......Page 112
EXAMPLE 2......Page 113
A PULSE SHOCK ISOLATION EXAMPLE......Page 117
A VELOCITY SHOCK ISOLATION EXAMPLE......Page 120
INDUCED STRESSES......Page 123
RANDOM VIBRATION......Page 126
EXCITATION SPECTRUM......Page 127
EQUIPMENT RESPONSE......Page 130
DYNAMIC LOADS......Page 131
EXERCISE......Page 132
CHAPTER 7 INTRODUCTION TO FINITE ELEMENT METHOD......Page 135
AN EXAMPLE OF FINITE ELEMENT FORMULATION......Page 136
FORMULATION OF CHARACTERISTIC MATRIX AND LOAD VECTOR......Page 139
WAVE PROPAGATION TYPE......Page 144
VIBRATION TYPE......Page 146
CONSISTENT MASS MATRIX......Page 147
LUMPED MASS MATRIX......Page 149
LUMPED FORMULATION......Page 150
FINITE ELEMENT FORMULATION OF HEAT CONDUCTION......Page 152
SOME BASIC DEFINITIONS......Page 154
THE FINITE ELEMENT ANALYSIS PROCEDURE......Page 155
CHAPTER 8 DESIGN AND ANALYSIS FOR MECHANICALLY RELIABLE SYSTEMS......Page 157
STRESS ANALYSIS......Page 158
ISOTROPIC BEHAVIOR......Page 161
SIMPLIFICATION OR ENGINEERING ASSUMPTIONS......Page 164
FAILURE......Page 167
FAILURE BY FRACTURE......Page 168
FAILURE BY ELASTIC DEFLECTION......Page 169
FAILURE BY FATIGUE......Page 170
LIFE EXPECTANCY......Page 171
THERMAL STRESSES AND STRAINS......Page 172
PCB WARPAGE......Page 174
SOME TIPS......Page 175
CHAPTER 9 ELECTRICAL RELIABILITY......Page 176
FIRST-YEAR FAILURES......Page 177
RELIABILITY MODELS......Page 178
SYSTEM FAILURE RATE......Page 181
CAD TO FEA CONSIDERATIONS......Page 185
CRITERIA FOR CHOOSING AN ENGINEERING SOFTWARE......Page 186
SOLID MECHANICS AND STRESS ANALYSIS - FEA SOFTWARE......Page 187
GENERAL PHYSICS - CFD AND/OR FEA......Page 188
COMPLETE PACKAGE......Page 189
CUSTOMER SUPPORT......Page 190
QUALITY ASSURANCE (QA)......Page 191
INTERFACING TO OTHER PROGRAMS......Page 193
CHAPTER 11 DESIGN CONSIDERATIONS IN AN AVIONICS ELECTRONIC PACKAGE......Page 195
OPERATIONAL CHARACTERISTICS......Page 196
ELECTRICAL DESIGN SPECIFICATIONS......Page 197
MECHANICAL DESIGN SPECIFICATIONS......Page 198
ANALYSIS......Page 199
THERMAL ANALYSIS......Page 200
LOAD CARRYING AND VIBRATION ANALYSIS......Page 201
RELIABILITY AND MTBF CALCULATIONS......Page 205
REFERENCES......Page 207