Embedded Cooling of Electronic Devices: Conduction, Evaporation, and Single- and Two-Phase Convection (WSPC in Advanced Integration and Packaging, 8)

Contents
Tribute
About the Editors
Chapter 1 Compact Thermal Modeling of Emerging Cooling Technologies for Processors
	1. Introduction
	2. Compact Thermal Modeling
	3. CTMs for Emerging Cooling Solutions and Cooling Performance Evaluation
		3.1. Thermoelectric coolers (TECs)
		3.2. Liquid cooling via microchannels
		3.3. Hybrid cooling
		3.4. Microchannel-based two-phase cooling
		3.5. Two-phase VCs with micropillar wick evaporator
	4. Final Remarks
		4.1. Conclusion
		4.2. Limitations of compact thermal modeling
	Acknowledgments
	Appendix A
	References
Chapter 2 Microscale Evaporation for High Heat Flux Applications
	Nomenclature
	1. Introduction
	2. Background of Evaporative Cooling
		2.1. Evaporation models
		2.2. Transport processes and associated thermal resistances during microscale evaporation
		2.3. Microscale evaporation in microchannels and microgap devices
		2.4. Implementation of micro- and nanostructures to facilitate microscale evaporative cooling
	3. Evaporation of Asymmetric Droplets Formed Using Hollow Micropillars
		3.1. Implementation of micro- and nanostructures to facilitate microscale evaporative cooling
		3.2. Major characteristics of droplets atop a hollow micropillar structure
			3.2.1. Asymmetry in droplet morphology and diffusion transport
			3.2.2. Enhanced vapor diffusion from a suspended droplet
		3.3. Evaporative heat transfer performance from non-axisymmetric droplet atop hollow micropillar structure
			3.3.1. Conduction resistance for a non-axisymmetric droplet
			3.3.2. Heat transfer coefficient for non-axisymmetric droplets
			3.3.3. Vapor diffusion from suspended droplets
			3.3.4. Wetting efficiency
	4. Fabrication Techniques for Evaporative Cooling Devices
		4.1. Fabrication of wicking structures and surface coatings
		4.2. Fabrication of micro- and nanoporous membrane devices
		4.3. Fabrication of hollow micropillar structures
		4.4. Challenges to integrating micro- and nanoengineered surfaces in an embedded cooling system for 3D stacked chips
		4.5. Challenges in fabricating TSVs
			4.5.1. Wafer bonding methods and challenges
			4.5.2. Optimized designs for improved thermal and electrical performance of embedded-cooling systems
	5. Conclusion
	References
Chapter 3 Numerical Modeling of Embedded Two-Phase Cooling in Silicon Microelectronics
	1. Introduction
	2. Numerical Model
		2.1. Coupled level-set volume of fluid model
		2.2. Phase-change model
	3. Computational Domain and Boundary Conditions
	4. Numerical Procedure and Grid-Independence
	5. Results
	6. Two-Phase Flow Comparison with Experimental Results
	7. Further Testing of the Numerical Model: Effect of Multiple Hotspots
	8. Conclusion
	References
Chapter 4 Chip-Embedded Two-Phase Cooling
	1. Introduction
		1.1. Thermal challenges of advanced packaging
		1.2. Two-phase chip-embedded cooling
		1.3. Modeling two-phase cooling
	2. Thermal Test Vehicle
		2.1. Design and fabrication
		2.2. Experimental results
		2.3. TTV modeling
	3. Embedded Two-Phase Liquid Cooled Microprocessor
		3.1. Design/fabrication
		3.2. Experimental results
		3.3. ECM modeling
	4. Two-Phase System-Level Model
	5. 3D Co-Design Summary
	6. Acknowledgments
	References
Chapter 5 Embedded Cooling of High-Power RF Amplifiers
	1. Introduction
	2. Motivation and Past Research on Embedded Cooling
	3. State-of-the-Art Embedded Cooling
	4. Testing
		4.1. Thermal demonstration vehicle
		4.2. Electrical demonstration vehicle
	5. Considerations with Embedded Cooling
	6. Conclusion
	Acknowledgments
	References
Chapter 6 Thermal Characteristics and Management Scheme of Self-Emissive and Liquid Crystal Displays
	Nomenclature
	1. Introduction
	2. Liquid Crystal Display
		2.1. Edge-light-type backlight unit
		2.2. Direct-light-type backlight unit
	3. Self-Emitting Displays
		3.1. Heat transfer analysis of self-emissive displays
		3.2. Active thermal management for self-emissive displays
Chapter 7 Advances in Materials Engineering for Conduction-Limited Direct Contact Cooling
	1. Introduction
	2. Bulk Materials Advances
	3. Two-dimensional and Ultrathin Materials as Near-Junction Heat Spreaders
	4. Advances in Understanding Conduction Physics
	5. Outlook and Opportunities
	References
Chapter 8 Monolithic Microfluidic Cooling Using Micropin-Fin Arrays for Local High Heat Flux Remediation: Design Considerations, Experimental Validation, and FPGA Integration
	1. Introduction
	2. Effect of Heat Spread Modeling: Hotspot Thermal Resistance Measurement
	3. Thermal Test Bed and Heterogeneous Micropin-Fin Samples
	4. Experimental Results
		4.1. Non-uniform heat flux
	5. Microfluidic Integration with FPGA
	6. Testing of FPGA
		6.1. Variable flow rate testing
		6.2. Clock speed
		6.3. Die power
	7. Conclusion
	References
Chapter 9 Recent Experimental and Modeling Advances in Two-Phase Embedded Microfluidic Cooling
	1. Introduction to Two-Phase Embedded Cooling
	2. High-Heat-Flux Dissipation Using Two-Phase Cooling in Embedded Microchannels
		2.1. Effects of local hotspot heating
		2.2. Effect of channel depth in high-aspect-ratio manifold microchannels
		2.3. High volumetric heat dissipation
	3. Assessing the Role of Flow Boiling Instabilities on Thermal Performance
		3.1. Modeling Ledinegg-instability-induced flow maldistribution
			3.1.1. Parametric effects on stability and severity of maldistribution
			3.1.2. Effect of lateral thermal coupling
		3.2. Ledinegg-instability-induced temperature excursion
		3.3. Experimental characterization of dynamic flow boiling instabilities
			3.3.1. Rapid-bubble-growth instability at the onset of boiling
			3.3.2. Influence of operating conditions on flow boiling instabilities
	4. Effects of Transient Heating on Flow Boiling in Embedded Microchannels
	5. High-Fidelity Modeling of Microchannel Flow Boiling
		5.1. Numerical simulations of microchannel flow boiling
		5.2. Experimental validation of flow boiling models
	6. Outlook
	References
Chapter 10 Scaling Limits, Challenges, and Opportunities in Embedded Cooling
	1. Introduction
	2. Scaling Limits for Convective Embedded Cooling vs. Non-Embedded Cooling
		2.1. Liquid cooling
		2.2. Substrate thickness and spreading number (Sp)
	3. Comparison of Embedded Cooling Fluids
		3.1. Natural convection
		3.2. Forced convection
		3.3. Pool boiling
		3.4. Flow boiling
	4. Embedded-Cooling Solutions
		4.1. Embedded-cooling solutions based on etched electronic substrate
		4.2. Additive-manufacturing-based embedded-cooling solutions
		4.3. Material selection/processing
	5. History and Future of Embedded Cooling
		5.1. IP adoption history of embedded cooling
		5.2. Future adoption of embedded cooling
	Acknowledgments
	References
Chapter 11 Co-Design of Thermal and Electromagnetics for Development of Light and Ultrahigh Efficiency Electric Motors
	1. Introduction
	2. Established Advanced Cooling Approaches
		2.1. Water jacket cooling
		2.2. Oil bath cooling
		2.3. Heat pipe cooling
	3. Direct Liquid-Cooling Concepts
		3.1. Stator iron thermal enhancement
		3.2. Inter-winding cooling
		3.3. Intra-winding cooling
	4. Comparison of Cooling Fluids
	5. Thermal and Electromagnetic Co-Design Simulation
		5.1. Advanced winding topologies using additive manufacturing
		5.2. Advanced insulation and potting materials
		5.3. Advanced cooling techniques
		5.4. Advanced structural materials
		5.5. Co-design and integration
		5.6. Simulation results summary
	6. Summary
	Acknowledgment
	References
Index