Cylindrical Dielectric Resonator Antennas: From Design to Recent Trends

BOGATIN’S PRACTICAL GUIDE to PROTOTYPE BREADBOARD and PCB DESIGN
	Table of Contents
	Chapter 1 A Getting-Started Guide
		1.1 Who This Book Is For
		1.2 Getting Stuff Done
		1.3 Cost-Performace Trade-offs
		1.4 Errors, Best Practices, and Habits
		1.5 Learn to Design-in Success
		1.6 A Getting-Started Guide for Signal Integrity
		1.7 The Seven-Step Process
		1.8 Risk Management and Mitigation
		1.9 Two Risk Management Design Strategies
		1.0 Master of Murphy\'s Law
		1.11 Proof of Concept
		1.12 Practice Questions
	Chapter 2
PCB Technology
		2.1 PCB, PWB, or PCA?
		2.2 Physical Design of a PCB
		2.3 Vias Technologies
		2.4 Thermal and Thermal Relief Vias
		2.5 Other Layers
		2.6 The Soldermask Layer
		2.7 Surface Finishes
		2.8 The Silk Screen
		2.9 What the Fab Vendor Needs
		2.10 Practice Questions
	Chapter 3
Signal Integrity and
Interconnects
		3.1 Transparent Interconnects
		3.2 When Interconnets are NOT Transparent
		3.3 Where Signal Integrity Lives
		3.4 Six Categories of Electrical Noise
		3.5 Families of SI/PI/EMI Problems
		3.6 In Principle and In Practice
		3.7 Net Classes and Interconnect Problems
		3.9 Design for X
		3.10 Practice Questions
	Chapter 4
Electrical Properties of
Interconnects
		4.1 Ideal vs Real Circuit Elements
		4.2 Equivalent Electrical Circuit Models
		4.3 Parasitic Extraction of R, L, and C Elements
		4.4 Describing Cross Talk
		4.5 Estimating Mutual Inductance
		4.6 Training Your Engineer’s Mind’s Eye
		4.7 Electrically Long Interconnects
		4.8 Electrically Short and Electrically Long
		4.9 Practice Questions
	Chapter 5
Trace Width Considerations:
Max Current
		5.1 Best design practices
		5.2 Minimum Fabrication Trace Width
		5.3 Copper Thickness as Ounces of Copper
		5.4 Maximum Current Handling of a Trace
		5.5 Maximum Current Through a Via
		5.6 Thermal Runaway with Constant Current
		5.7 Practice Questions
	Chapter 6
Trace Width Considerations:
Series Resistance
		6.1 Resistance of Any Uniform Conductor
		6.2 Sheet Resistance of a Copper Layer
		6.3 Measuring Very Low Resistances
		6.4 Voltage Drop Across Traces
		6.5 The Thevenin Model of a Voltage Source
		6.6 How Much Trace Resistance Is too Much?
		6.7 The Resistance of a Via
		6.8 Resistance of a Thermal Relief Via
		6.9 Practice Questions
	Chapter 7
The Seven Steps in Creating a
PCB
		7.1 Step 1: Plan of Record
		7.2 Step 2: Create the BOM
		7.3 Step 3: Complete the Schematic
		7.4 Step 4: Complete the Layout, Order the Parts
		7.5 Steps 5 and 6: Assembly and Bring-Up
		7.6 Step 7: Documentation
		7.7 Practice Questions
	Chapter 8
Step 1, POR: Risk Mitigation
		8.1 Visualize the Entire Project Before You Begin
		8.2 Avoid Feature Creep
		8.3 Estimate Everything You Can
		8.4 Preliminary BOM: Critical Components
		8.5 Risk Assessment
		8.6 Risk Mitigation: Tented Vias
		8.7 Risk Mitigation: Qualified Parts
		8.8 Practice Questions
	Chapter 9
Risk Reduction: Datasheets,
Reverse Engineering, and
Component Selection
		9.1 Take Responsibility for Your Design
		9.2 Reducing the Risk of a Design Problem
		9.3 Understand Your Circuit
		9.4 Read Datasheets Critically
		9.5 Build Simple Evaluation Prototypes
		9.6 Reverse Engineer Components
		9.7 Reuse Parts
		9.8 Practice Questions
	Chapter 10
Risk Reduction: Virtual and
Real Prototypes
		10.1 Getting Started with Circuit Simulation
		10.2 Practice Safe Simulation
		10.3 Simulating a 555 Circuit
		10.4 Purchase an Evaluation Board
		10.5 Real Prototypes with Modules
		10.6 Practice Questions
	Chapter 11
Risk Reduction: Prototyping
with a Solderless Breadboard
		11.1 Build a Real Prototype
		11.2 Solderless Breadboards for POC
		11.3 Features of a Solderless Breadboard
		11.4 Bandwidth Limitations
		11.5 A Simple Breakout Board
		11.6 The Mini Solderless Breadboard
		11.7 Best Wiring Habits
		11.8 Habit #1: Consistent Column Assignments
		11.9 Habit #2: Color Code the Wires
		11.10 Habit #3: Keep Signal Traces Short
		11.11 Habit #4: Avoid a Shared Return Path
		11.12 Habit #5: Route Signal-Return Pairs
		11.13 Habit #6: Keep Component Leads Short
		11.14 Practice Questions
	Chapter 12
Switching Noise and Return
Path Routing
		12.1 The Origin of Switching Noise
		12.2 Signal-Return Path Loops
		12.3 Where Does Return Current Flow?
		12.4 A Plane as a Return Path
		12.5 Ground
		12.6 Avoid Gaps in the Return Plane
		12.7 Summary of the Best design practices
		12.8 Practice Questions
	Chapter 13
Power Delivery
		13.1 Origin of Power Rail Switching Noise
		13.2 Calculating Loop Inductance
		13.3 Measuring PDN Switching Noise
		13.4 The Role of Decoupling Capacitors
		13.5 Where Do Decoupling Capacitors Go?
		13.6 The Power Delivery Path
		13.7 Inrush Current
		13.8 Summary of the Eight Habits for Using a SSB
		13.9 Practice Questions
	Chapter 14
Design for Performance: The
PDN on a PCB
		14.1 VRM specifications
		14.2 Voltage Regulator Module
		14.3 Self- and Mutual-Aggression Noise
		14.4 Power and Ground Loop Inductance
		14.5 Decoupling Capacitors
		14.6 A Decoupling Capacitor Myth; Part 1
		14.7 A Decoupling Capacitor Myth; Part 2
		14.8 Routing for Power Distribution
		14.9 Ferrite Beads
		14.10 Summary of the Best design practices
		14.11 Practice Questions
	Chapter 15
Risk Reduction: Design for
Bring-Up
		15.1 Test is Too General a Term
		15.2 What Does It Mean to “Work”?
		15.3 Design for Bring-Up
		15.4 Add Design for Bring-Up Features
		15.5 Jumper Switches
		15.6 LED indicators
		15.7 Test Points
		15.8 The Power Rail as a Diagnostic
		15.9 Practice Questions
	Chapter 16
Risk Reduction: Design
Reviews
		16.1 The Preliminary Design Review
		16.2 The Critical Design Review
		16.3 DRC for DFM in the CDR
		16.4 DRC for Signal Integrity
		16.5 Layout Review
		16.6 Practice Questions
	Chapter 17
Step 2: Surface-Mount or
Through-Hole Parts
		17.1 Through-Hole and Surface-Mount
		17.2 Types of SMT Parts
		17.3 Integrated Circuit Components
		17.4 Practice Questions
	Chapter 18
Finding the One Part in a
Million
		18.1 An Important Selection Process
		18.2 Trade-offs in Selecting Parts
		18.3 The Search Order to Select a Part
		18.4 Selecting Resistors
		18.5 Selecting Capacitors
		18.6 The BOM
		18.7 Summary of the Best Design Practices
		18.8 Selecting Parts for Automated Assembly
		18.9 Practice Questions
	Chapter 19
Step 3: Schematic Capture and
Final BOM
		19.1 Picking a Project Name
		19.2 Schematic Capture
		19.3 Take Ownership of Reference Designs
		19.4 Add Options to Your Schematic
		19.5 Best design practices for Schematic Entry
		19.6 Design Review and ERC
		19.7 Practice Questions
	Chapter 20
Step 4: Layout — Setting Up
the Board
		20.1 Layout
		20.2 Board Dimensions
		20.3 The Layers in a Board Stack
		20.4 Negative and Positive Layers
		20.5 Examples of Some Fab Shop DFM Features
		20.6 Setting Up Design Constraints
		20.7 Thermal Reliefs in Pads and Vias
		20.8 Set Up Board Size and Keepout Layer
		20.9 Practice Questions
	Chapter 21
Floor Planning and Routing
Priority
		21.1 Part Placement
		21.2 The Order of Placement and Routing
		21.3 First Priority: Ground Plane on the Bottom Layer
		21.4 Second Priority: Decoupling Capacitors
		21.5 Third Priority: Ground Connections
		21.6 Fourth Priority: Digital Signals, Congested Signals
		21.7 Fifth Priority: Power Paths
		21.8 The Silk Screen
		21.9 Check the Soldermask
		21.10 Soldermask Color
		21.11 Layout — Critical Design Review
		21.12 Practice Questions
	Chapter 22
Six Common Misconceptions
about Routing
		22.1 Myth #1: Avoid 90 Deg Corners
		22.2 Myth #2: Add Copper Pour on Signal Layers
		22.3 Myth #3: Use Different Value Decoupling Capacitors
		22.4 Myth #4: Split Ground Plan
		22.5 Myth #5: Use Power Planes
		22.6 Myth #6: Use 50 Ohm Impedance Traces
		22.7 Practice Questions
	Chapter 23
Four-Layer Boards
		23.1 Two-Layer Stack-Ups
		23.2 A 4-Layer Board
		23.3 Four-Layer Stack-Up Options
		23.4 Stack-Up Options with Two Planes
		23.5 The Recommended 4-Layer Stack-Up
		23.6 When Signals Change Return Planes
		23.7 Practice Questions
	Chapter 24
Release the Board to the Fab
Shop
		24.1 Gerber Files
		24.2 Cost Adders
		24.3 Board Release Checklist
		24.4 Practice Questions
	Chapter 25
Step 6: Bring-Up
		25.1 Does Your Widget Work?
		25.2 Prototype or Production Testing
		25.3 Design for Bring-Up
		25.4 Find the Root Cause
		25.5 Problems to Expect
		25.6 Troubleshoot Like a Detective
		25.7 Trick #1: Recreate the Problem
		25.8 Trick #2: Seen This Problem Before?
		25.9 Trick #3: Round Up the Usual Suspects
		25.10 Trick #4: Three Possible Explanations
		25.11 A Methodology
		25.12 Forensic Analysis
		25.13 Coding Issues
		25.14 Practice Questions
	Chapter 26
Step 7: Documentation
	Chapter 27
Concluding Comments
	Chapter 28
About Eric Bogatin