Advances in Electronic Circuit Packaging: Volume 2 Proceedings of the Second International Electronic Circuit Packaging Symposium, sponsored by the University of Colorado and EDN (Electrical Design News), held at Boulder, Colorado

Front Matter....Pages i-xv
Materials for Electronic Packaging....Pages 1-20
Controlling the Mechanical Response of Printed Circuit Boards....Pages 21-34
A Low-Density Potting Compound....Pages 35-51
An Effective Use of Castings in a Lightweight Electronic Package....Pages 52-60
Heat Sinks and Encapsulants for Volumetric Packaging....Pages 61-76
Potting Problems Related to Packaging Design....Pages 77-90
Packaging of Semiconductor Networks....Pages 91-103
Thermal Packaging for Transient Operation....Pages 104-120
Formulation and Solution of Circuit Card Design Problems through Use of Graph Methods....Pages 121-142
Maintainable Electronic Component Assemblies....Pages 143-165
Electronic Packaging for 5000 g Survival....Pages 166-180
Packaging of a Telemeter to Withstand Impulse Accelerations of 500,000 g ....Pages 181-202
The Welded-Wire Matrix—An Important Step Beyond Printed Wiring....Pages 203-212
Weld Improvement Study Indicating Future Electronics Packaging Applications....Pages 213-218
Automatic Packaging of Miniaturized Circuits....Pages 219-232
Illogical Packaging Design....Pages 233-238
Radiation-Effects Considerations in the Design of Electronic Circuit Packaging for Nuclear-Powered Vehicles....Pages 239-253
Electronic Packaging for Oil-Well Logging....Pages 254-263
Instrumentation Equipment for Polaris Firing Submarines Installed in a Unique Modular Design....Pages 264-278
Miniaturized Positioners for Modular Packaging....Pages 279-288
Development of Miniature and Microminiaturized Electronic Packages....Pages 289-298
The Hidden Value—Packaging for Appearance....Pages 299-308
Cruciform Packaging—A General Synthesis for Airborne Electronics....Pages 309-320
The Systems Approach to Electronic Packaging....Pages 321-328