Advanced Materials and Technologies for Micro Nano-Devices, Sensors and Actuators (NATO Science for Peace and Security Series B: Physics and Biophysics)

9048138051......Page 1
Advanced Materials and Technologies for Micro/Nano-Devices, Sensors and Actuators......Page 4
TABLE OF CONTENTS......Page 6
PREFACE......Page 9
MEMS/NEMS TECHNOLOGIES AND APPLICATIONS......Page 12
1. Introduction......Page 13
2. Mechanical sensors......Page 14
3. Sensors for biomedical applications......Page 17
4. R&D of micro-sensors theory and micromachining processes......Page 19
5.Other developments and industrially manufactured sensors......Page 22
6. Conclusion......Page 23
References......Page 24
1. Need for monolithic integration......Page 26
2. Major challenges of monolithic integration......Page 29
3. Novel microstructures......Page 30
4. Simple microstructurs for multi-axis measurements......Page 33
5. Unified component platform......Page 34
6. Sensitive integrated circuits......Page 35
7. Economic justification of monolithic integration......Page 36
References......Page 39
2.1. MEMS MICROPHONE......Page 40
2.3. TWO DIMENSIONAL OPTICAL SCANNER......Page 41
3.1. CAPACITIVE PRESSURE SENSORS......Page 42
3.2. MEMS SWITCH......Page 43
4.1. PROVE CARD FOR WAFER-LEVEL BURN-IN TEST (LOW THERMAL EXPANSION COEFFICIENT LTCC)......Page 44
4.2. SiC MICROSTRUCTURE FOR GLASS PRESS MOLDING (SiC)......Page 45
4.3. SAW PASSIVE WIRELESS SENSOR (LiNbO3)......Page 48
References......Page 49
1. Introduction......Page 50
2. Memory material and read–write–erase operations......Page 51
2.2. READ OPERATION......Page 52
2.3. RETENTION AND ENDURANCE CYCLING......Page 54
2.4. WEAR......Page 55
3.1. MICRO-MOVER DESIGN AND FABRICATION......Page 56
3.2. DESIGN AND FABRICATION OF ACTUATED CANTILEVERS......Page 60
3.3. PROCESS INTEGRATION CHALLENGES......Page 62
3.4. PACKAGING AND TESTING......Page 63
4. Electronics and system aspects......Page 64
4.1. SERVO SYSTEM......Page 66
4.2. READ CHANNEL FRONT END ELECTRONICS......Page 68
4.3. NANOCHIP CONTROLLER......Page 69
4.4. TARGET PRODUCTS, EXPECTED PERFORMANCE PARAMETERS AND MARKET OPPORTUNITIES FOR PROBE STORAGE DEVICES......Page 71
References......Page 73
1.1. WHY MEMS?......Page 75
1.2. WHAT’S NEXT? MEMS PAVES THE WAY TO MINIATURIZED CONSUMER IMUs......Page 76
3. A deeper look to gyro technologies......Page 77
4. STMicroelectronics’ Gyroscope......Page 78
5. MEMS IMUs: key factors for system accuracy......Page 81
References......Page 82
1. Introduction......Page 83
2. GaAs membrane supported filters......Page 84
3. GaAs membrane supported Yagi–Uda antennae......Page 87
4. Monolithic Integration of a Schottky diode with a Yagi–Uda antenna on the same GaAs membrane......Page 89
References......Page 93
1. Introduction......Page 96
2. Mechanically multi-stable, CPW embedded microswitches......Page 98
3. W-band 4.25 bit MEMS moving dielectric-block phase shifter......Page 101
4. MEMS tuneable high-impedance surfaces......Page 104
References......Page 106
1. Introduction......Page 108
2. Luminescence properties of opal–erbium nanocomposites......Page 109
3. Electroluminescent three-dimensional photonic crystals based on opal-phosphor nanocomposites......Page 111
4. Femtosecond all-optical switching in opal-Si photonic crystals......Page 112
5. Subpicosecond switching of the photonic band gap in opal-VO2 photonic crystal governed by a photoinduced semiconductor–metal phase transition......Page 114
6. Hypersonic modulation of light by three-dimensional photonic and phononic band-gap material......Page 117
Acknowledgments......Page 119
References......Page 120
MEMS DEVICE AND RELIABILITY PHYSICS......Page 121
PULL-IN DYNAMICS OF ELECTROSTATICALLY ACTUATED BISTABLE MICRO BEAMS......Page 122
1. Introduction......Page 123
2. The model of a curved beam......Page 125
3.1. SINGLE DEGREE OF FREEDOM MODEL......Page 126
3.2. NUMERICAL RESULTS......Page 130
References......Page 132
1.Energy and work in electromechanical systems......Page 134
2. Equations of motion and energy conservation......Page 136
3. Electromechanical equilibrium......Page 138
4. Path following and numerical continuation methods......Page 139
5. Example of path following method......Page 140
6. Stability......Page 142
7.Numerical path following in MATCONT......Page 143
8. Finite element method path following simulations......Page 144
References......Page 145
1. Introduction......Page 146
2. Polarization/charging mechanisms......Page 148
3. Material considerations......Page 150
4. Effect of temperature......Page 153
References......Page 155
ADVANCED PROCESSES AND MATERIALS......Page 159
1. Introduction......Page 160
3.1.1. Maximising Si etch rate......Page 161
3.1.2. Removal of deposition......Page 164
3.2. INCREASING ASPECT RATIOS......Page 165
4. Conclusion......Page 167
References......Page 168
1. Introduction......Page 169
2. Technologies suitable for low-temperature fabrication......Page 170
2.1.2. Atomic layer deposition of aluminium oxide and titanium dioxide......Page 171
2.1.3. Reactive sputtering of amorphous metals......Page 172
2.2.2. Use of polymers as sacrificial layer......Page 174
3.1. RF SWITCH......Page 176
3.2. FABRY–PEROT INTERFEROMETER FOR VISIBLE LIGHT......Page 177
4. Conclusions......Page 178
References......Page 179
1. Introduction......Page 181
2. Cu–Sn and Au–Sn SLID bonding......Page 183
3. Fabrication of test vehicles for fluxless bonding......Page 185
3.1. Au–Sn......Page 186
3.2. Cu–Sn......Page 187
4.1. BONDING RESULTS AND SHEAR STRENGTH......Page 188
4.2. INTERCONNECT AND BOND FRAME UNIFORMITY REQUIREMENTS......Page 190
References......Page 191
3D INTEGRATION OF MEMS AND IC: DESIGN, TECHNOLOGY AND SIMULATIONS......Page 193
1. Introduction......Page 194
2.1. PRESSURE SENSOR DESIGN......Page 195
2.2. BONDING OF PRESSURE SENSOR AND BAR DEVICE......Page 198
2.4. SIMULATED STACK......Page 199
3.2. TEST RESULTS AFTER FLIP-CHIP BONDING......Page 201
3.3. SIMULATION RESULTS......Page 203
References......Page 204
LOW-FREQUENCY ELECTRONIC NOISE IN THEBACK-GATED AND TOP-GATED GRAPHENE DEVICES......Page 206
1. Introduction......Page 207
2. Graphene preparation......Page 208
3. Graphene device fabrication......Page 209
4. Noise measurements and discussion......Page 210
5. Conclusions......Page 213
References......Page 214
1. Introduction......Page 216
3.1. CAVITY PROFILE MODELS......Page 217
3.2. GAS TRANSPORT MODELS......Page 218
4.1. MEMS SAMPLE SHAPE......Page 219
4.2. CONSTANT PRESSURE OF THE ETCHANT GAS......Page 220
4.3. CONTINUOUS-FLOW REACTOR......Page 221
4.4. PULSE REACTOR......Page 222
References......Page 223
1. Introduction......Page 225
2. Objects and research methods......Page 226
3.1. X-RAY DIFFRACTION RESEARCHES......Page 227
3.2. RAMAN BACKSCATTERING......Page 231
4. Conclusion......Page 234
References......Page 235
1. Introduction......Page 237
2. Experimental details......Page 241
3. Results and discussion......Page 242
References......Page 245
SENSORS......Page 247
1. Introduction......Page 248
2.1. BULK MICROMACHINING......Page 249
2.2. SURFACE MICROMACHINING......Page 251
2.2.2. Pre-processing......Page 252
2.2.4. Post processing......Page 253
3.4. APPLICATION ISSUES......Page 254
4. Integrated sensor examples......Page 255
References......Page 257
VERTICALLY INTEGRATED MEMS SOI COMPOSITE POROUS SILICON-CRYSTALLINE SILICON CANTILEVER-ARRAY SENSORS: CONCEPT FOR CONTINUOUS SENSING OF EXPLOSIVES AND WARFARE AGENTS......Page 259
1. Introduction......Page 260
2. Brief review of state of the art of explosive detection devices......Page 261
3. Fabrication and characterization of c-silicon microcantilever arrays with uniform and reproducible mechanical performance......Page 262
4. Fabrication of composite porous silicon/c-silicon cantilevers......Page 265
5. Integrated cantilevers chips......Page 267
6. Summary......Page 270
References......Page 271
1. Introduction......Page 273
2. Biological functionalization......Page 274
2.1. CHITOSAN-COATED MICROCANTILEVER SENSOR......Page 275
2.2. CHITOSAN-BASED OPTICAL ABSORBANCE SENSOR......Page 276
2.3. TOBACCO MOSIC VIRUS MEMS BATTERY......Page 277
3.1. ENZYMATIC PATHWAY RECONSTRUCTION......Page 279
3.2. BACTERIAL CULTURE IN MICROFLUIDICS......Page 280
3.3. DETECTION OF ENZYMATIC PRODUCTS......Page 281
Acknowledgements......Page 282
References......Page 283
1. Introduction......Page 284
2.1. PRINCIPLES OF PIEZORESISTANCE......Page 285
2.2. FORCE AND DISPLACEMENT SENSITIVITY OF A CANTILEVER BEAM......Page 286
2.3. NOISE IN PIEZORESISTORS......Page 288
2.4. FORCE RESOLUTION AND DESIGN TRADEOFFS......Page 289
3.1. FORCE SENSORS......Page 290
3.2. SCANNING PROBE MICROSCOPY......Page 291
4. Conclusions......Page 292
References......Page 293
1. Introduction......Page 296
2. Research motivation......Page 298
2.1. PARAMETRIC EXCITATION IMPROVES THE PERFORMANCE......Page 299
3. The system......Page 300
4. Experimental characterization......Page 301
4.1. RATE TABLE PERFORMANCE......Page 302
5. Conclusions......Page 304
References......Page 305
SUBJECT INDEX......Page 307
AUTHOR INDEX......Page 309